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7303471 |
Method and system for transferring data to an electronic toy or other electronic device
A method for transferring data from a display device to an electronic device includes displaying a visual pattern on the display device. The visual pattern represents the data being transferred. In...
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7302519 |
Distributed content addressable memory
The present invention provides a large capacity distributed content addressable memory (CAM) made up of a plurality of smaller CAMs interconnected on a high speed data bus. Each of the smaller CAMs...
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7301221 |
Controlling diffusion in doped semiconductor regions
A method and device for reducing a dopant diffusion rate in a doped semiconductor region is provided. The methods and devices include selecting a plurality of impurity elements, including at least...
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7301190 |
Structures and methods to enhance copper metallization
Disclosed structures and methods inhibit atomic migration and related capacitive-resistive effects between a metallization layer and an insulator layer in a semiconductor structure. One exemplary...
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7300873 |
Systems and methods for forming metal-containing layers using vapor deposition processes
A method of forming (and an apparatus for forming) a metal containing layer on a substrate, particularly a semiconductor substrate or substrate assembly for use in manufacturing a semiconductor or...
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7300870 |
Systems and methods of forming refractory metal nitride layers using organic amines
A method of forming (and apparatus for forming) refractory metal nitride layers (including silicon nitride layers), such as a tantalum nitride barrier layer, on a substrate by using an atomic layer...
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7300857 |
Through-wafer interconnects for photoimager and memory wafers
A through-wafer interconnect for imager, memory and other integrated circuit applications is disclosed, thereby eliminating the need for wire bonding, making devices incorporating such...
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7300839 |
Selective polysilicon stud growth
A memory cell having a bit line contact is provided. The memory cell may be a 6F 2 memory cell. The bit line contact may have a contact hole bounded by insulating sidewalls, and the contact hole...
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7300821 |
Integrated circuit cooling and insulating device and method
A method and device for cooling an integrated circuit is provided. A method and device using a gas to cool circuit structures such as a number of air bridge structures is provided. A method and...
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7300526 |
Method and system for removal of contaminates from phaseshift photomasks
A system and method to clean the pellicle frame and adhesive ring of a photomask reticle are described. One embodiment includes a cover that isolates the photomasks from the pellicle frame. The...
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7299381 |
Discrete tests for weak bits
A testing method for semiconductor memory that selects memory cells adjacent to the periphery of the memory array and to a memory twist. These memory cells are subjected to a more demanding test...
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7299329 |
Dual edge command in DRAM
A technique to increase transfer rate of command and address signals via a given number of command and address pins in each of one or more integrated circuit memory devices during a clock cycle of...
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7298638 |
Operating an electronic device having a vertical gain cell that includes vertical MOS transistors
A high density vertical gain cell is realized for memory operation. The gain cell includes a vertical MOS transistor used as a sense transistor having a floating body between a drain region and a...
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7298453 |
Method and apparatus for irradiating a microlithographic substrate
A method and apparatus for exposing a radiation-sensitive material of a microlithographic substrate to a selected radiation. The method can include directing the radiation along a radiation path in...
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7298425 |
Method for assisting video compression in a computer system
One embodiment of the present invention provides a method that facilitates compression of video data in a computer system by performing the time-consuming task of computing the difference between...
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7298406 |
Ground referenced pixel reset
A ground referenced pixel reset circuit is disclosed. The ground referenced pixel reset circuit supplies a pixel with a reset signal such that when the reset signal is asserted high, the reset...
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7298401 |
Method and apparatus for removing flicker from images
Method and apparatus for removing image artifacts from an image of a scene illuminated by a periodically varying light source such as a fluorescent light source. The image is represented by image...
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7298031 |
Multiple substrate microelectronic devices and methods of manufacture
A microelectronic device and method for manufacture. In one embodiment, two microelectronic substrates are directly bonded to each other without an intermediate adhesive material. For example, each...
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7298025 |
Microelectronic component assemblies and microelectronic component lead frame structures
The present invention provides microelectronic component assemblies and lead frame structures that may be useful in such assemblies. For example, one such lead frame structure may include a set of...
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7298024 |
Transparent amorphous carbon structure in semiconductor devices
A transparent amorphous carbon layer is formed. The transparent amorphous carbon layer has a low absorption coefficient such that the amorphous carbon is transparent in visible light. The...
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7298000 |
Conductive container structures having a dielectric cap
Container structures for use in integrated circuits and methods of their manufacture. The container structures have a dielectric cap on the top of a conductive container to reduce the risk of...
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7297995 |
Transparent metal shielded isolation for image sensors
An isolation region formed in a substrate and lined with a transparent metal layer. The isolation region provides isolation between adjacent active areas of an integrated circuit structure, for...
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7297917 |
Readout technique for increasing or maintaining dynamic range in image sensors
The apparatus and method provide a readout technique and circuit for increasing or maintaining dynamic range of an image sensor. The readout technique and circuit process each pixel individually...
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7297915 |
Compensation methods and systems for imaging detectors
Imaging arrays typically include thousands or millions of photodetectors that convert sensed light into corresponding electric signals, which are ultimately converted into digital image signals for...
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7297639 |
Methods for etching doped oxides in the manufacture of microfeature devices
Methods for selectively etching doped oxides in the manufacture of microfeature devices are disclosed herein. An embodiment of one such method for etching material on a microfeature workpiece...
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7297637 |
Use of pulsed grounding source in a plasma reactor
A method for grounding a semiconductor substrate pedestal during a portion of a high voltage power bias oscillation cycle to reduce or eliminate the detrimental effects of feature charging during...
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7297623 |
Etch stop layer in poly-metal structures
In accordance with one embodiment of the present invention, a method of interfacing a poly-metal structure and a semiconductor substrate is provided where an etch stop layer is provided in a...
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7297617 |
Method for controlling diffusion in semiconductor regions
A method and device for reducing a dopant diffusion rate in a doped semiconductor region is provided. The methods and devices include selecting a plurality of impurity elements, including at least...
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7297563 |
Method of making contact pin card system
A compliant contact pin contactor card method for making is provided. The compliant contact pin assembly includes a contact pin formed from a portion of a substrate with the contact pin compliantly...
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7297412 |
Fabrication of stacked microelectronic devices
Manufacture of stacked microelectronic devices is facilitated by producing subassemblies wherein adhesive pads are applied to the back surfaces of a plurality of microelectronic components in a...
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7296346 |
Plating buss and a method of use thereof
The present invention relates generally to a plating buss design and method for minimizing short circuit problems in PCB panel singulation. More particularly, the invention encompasses a serpentine...
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7295462 |
Method and apparatus processing variable resistance memory cell write operation
A circuit and method for writing to a variable resistance memory cell. The circuit includes a variable resistance memory cell, a switchable current blocking device and a charge storing element. As...
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7295081 |
Time delay oscillator for integrated circuits
One aspect relates to an oscillator, and various oscillator embodiments comprise an amplifier and line driver with an input and an output and a transmission line with a predetermined transmission...
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7294921 |
System-on-a-chip with multi-layered metallized through-hole interconnection
The present invention is directed to a high-performance system on a chip which uses multi-layer wiring/insulation through-hole interconnections to provide short wiring and controlled low-impedance...
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7294911 |
Ultrathin leadframe BGA circuit package
A circuit package is formed using a leadframe. The leadframe is formed or etched to align a plurality of bond pad structures above a reference plane while supporting leadframe fingers are...
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7294903 |
Transistor assemblies
Semiconductor processing methods of forming transistors, semiconductor processing methods of forming dynamic random access memory circuitry, and related integrated circuitry are described. In one...
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7294897 |
Packaged microelectronic imagers and methods of packaging microelectronic imagers
Microelectronic imagers, methods for packaging microelectronic imagers, and methods for forming electrically conductive through-wafer interconnects in microelectronic imagers are disclosed herein....
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7294893 |
Titanium silicide boride gate electrode
A method for use in the fabrication of a gate electrode includes providing a gate oxide layer and forming a titanium boride layer on the oxide layer. An insulator cap layer is formed on the...
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7294790 |
Apparatus for measuring parasitic capacitance and inductance of I/O leads on an electrical component using a network analyzer
Apparatus is provided for measuring the potential for mutual coupling in an integrated circuit package of any type or configuration using a network analyzer in conjunction with a coaxial test...
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7294578 |
Use of a plasma source to form a layer during the formation of a semiconductor device
A method used to form a semiconductor device having a capacitor comprises placing a semiconductor wafer assembly into a chamber of a plasma source, the wafer assembly comprising a layer of...
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7294570 |
Contact integration method
A method of making a contact plug and a metallization line structure is disclosed in which a substrate is provided with at least one contact hole within an insulation layer situated on a...
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7294567 |
Semiconductor contact device and method
The invention provides an advanced metallization technique for fabricating a memory cell array on a substrate. The array is fabricated by forming discrete and self-aligned vias in a first layer...
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7294556 |
Method of forming trench isolation in the fabrication of integrated circuitry
This invention includes methods of forming a phosphorus doped silicon dioxide comprising layers, and methods of forming trench isolation in the fabrication of integrated circuitry. In one...
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7294549 |
Vertical floating gate transistor
A floating gate transistor has been described that includes source and drain regions that are fabricated on different horizontal planes. A floating gate and a control gate are fabricated vertically...
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7294545 |
Selective polysilicon stud growth
A memory cell having a bit line contact is provided. The memory cell may be a 6F 2 memory cell. The bit line contact may have a contact hole bounded by insulating sidewalls, and the contact hole...
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7294527 |
Method of forming a memory cell
The invention relates to the fabrication of a resistance variable material cell or programmable metallization cell. The processes described herein can form a metal-rich metal chalcogenide, such as,...
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7294049 |
Method and apparatus for removing material from microfeature workpieces
Methods and apparatus for removing materials from microfeature workpieces. One embodiment of a subpad in accordance with the invention comprises a matrix having a first surface configured to...
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7294040 |
Method and apparatus for supporting a microelectronic substrate relative to a planarization pad
A method and apparatus for planarizing a microelectronic substrate. In one embodiment, one surface of the microelectronic substrate is engaged with a planarizing pad and the opposite surface of the...
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7293526 |
Plasma reaction chamber liner consisting essentially of osmium
The invention encompasses a method of enhancing selectivity of etching silicon dioxide relative to one or more organic substances. A material comprising one or more elements selected from Group...
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7292497 |
Multi-bank memory
A multi-bank memory device includes rows and columns of memory cores. Each row includes memory cores from one bank interleaved with memory cores from another bank. Banks in different rows can be...
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