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US20090292388 |
SEMICONDUCTOR MANUFACTURING SYSTEM
An object of the present invention is to provide a semiconductor manufacturing system used for manufacturing a semiconductor in a semiconductor manufacturing facility according to a flow shop...
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US20090292385 |
AUTOMATED THROUGHPUT CONTROL SYSTEM AND METHOD OF OPERATING THE SAME
An automated throughput control system and method is provided. By gathering tool specific information of a plurality of process tools on entity level, appropriate throughput related performance...
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US20090292383 |
SYSTEM AND METHOD FOR AUTOMATED ELECTRONIC DEVICE DESIGN
A system for the automated formation and control and execution of an electronic device design flow is disclosed which can enable more efficient electronic device design methodology with higher...
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US20090287341 |
Pre-aligner search
Methods and systems, in one embodiment, for receiving a warped flexible wafer to be transferred between a first mechanism and a second mechanism are described. The method and system senses a first...
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US20090287340 |
In-line effluent analysis method and apparatus for CMP process control
An apparatus and method for collecting and analyzing the effluent stream created by a chemical mechanical planarization (CMP) process performs a continuous measurement of at least one effluent...
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US20090286399 |
Substrate Processing Method and Storage Medium
A substrate processing method includes performing an etching process on a low dielectric constant film disposed on a substrate, thereby forming a predetermined pattern thereon; denaturing a...
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US20090286174 |
MANUFACTURING METHOD AND MANUFACTURING SYSTEM OF SEMICONDUCTOR DEVICE
In an exposure process forming a predetermined circuit pattern of a semiconductor device on a wafer, a resist dimension of the resist pattern formed on a wafer and a focus position in the exposure...
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US20090276078 |
Process control system, process control method, and method of manufacturing electronic apparatus
A process control system includes a client computer which prepares a correlation between a reference monitored value of apparatus information and a feature quantity, a manufacturing execution...
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US20090275202 |
SILICON STRUCTURE HAVING AN OPENING WHICH HAS A HIGH ASPECT RATIO, METHOD FOR MANUFACTURING THE SAME, SYSTEM FOR MANUFACTURING THE SAME, AND PROGRAM FOR MANUFACTURING THE SAME, AND METHOD FOR MANUFACTURING ETCHING MASK FOR THE SILICON STRUCTURE
Provided are a silicon structure having an opening which has a high aspect ratio and an etching mask for forming the silicon structure. A step of performing hole etching or trench etching of...
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US20090266217 |
SHEET CUTTING DEVICE AND CUTTING METHOD
There is provided a method of cutting a sheet S stuck on a semiconductor wafer W having a notch N in an outer circumferential portion in accordance with a plane shape of the semiconductor wafer W....
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US20090265028 |
Organic Substrate with Asymmetric Thickness for Warp Mitigation
A process for large scale production of a laminated organic substrate having reduced thermal warp.
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US20090259333 |
COMPONENT MOUNTING APPARATUS, SERVICE PROVIDING DEVICE AND SERVICING METHOD
A service receiving method for receiving a component library generated from mounted component data, including component size and mounting conditions, via a communication system that includes the...
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US20090254210 |
SYSTEM AND METHOD FOR MOVEMENT CONTROL
A system for controlling object movement on a machine. The system controls a speed of a working point of the machine according to a dynamic decay speed determined through an exponential function...
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US20090248192 |
SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE CONVEYANCE METHOD
A substrate processing system ( 100 ) includes a main transfer line ( 20 ) configured to transfer wafers (W) over the entire system, and an auxiliary transfer line ( 30 ) configured to transfer...
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US20090248187 |
ADVANCED PROCESS CONTROL FOR SEMICONDUCTOR PROCESSING
A computer comprising a recordable medium on which is stored instructions for at least one model-based, run-to-run controller routine is provided. The computer includes instructions to receive a...
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US20090246893 |
SEMICONDUCTOR INTEGRATED CIRCUIT MANUFACTURING PROCESS EVALUATION METHOD
A method for evaluating a process of manufacturing a semiconductor integrated circuit including a deposition step and a polishing step after the deposition step, the method includes: dividing the...
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US20090245984 |
HIGH THROUGHPUT CLEANER CHAMBER
A wafer cleaning chamber comprising a plurality of carrier arms each having concentrically-mounted midpoints between opposing ends of the carrier arms with a wafer carrier mounted on each of the...
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US20090240362 |
SIMULATION MODEL CREATING METHOD, MASK DATA CREATING METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
A simulation model creating method computes, for measurement results of a line width of a resist pattern formed with varied an exposure amount and focus value, a permissible fluctuation range of...
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US20090222672 |
Integrated Circuit That Uses A Dynamic Characteristic Of The Circuit
An integrated circuit has a first component that has a dynamic characteristic that varies among like integrated circuits, for example, among integrated circuits fabricated using the same...
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US20090216357 |
SYSTEM AND METHODS FOR AUTOMATIC GENERATION OF COMPONENT DATA
A method of manufacturing electronic circuits including generating CAD data, a bill of materials and an approved component vendor list for an electronic circuit and employing the CAD data, the bill...
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US20090211897 |
SPUTTERING APPARATUS AND METHOD FOR CONTROLLING THE SAME
The present invention provides a multi-target sputtering apparatus including an increased number of targets which can be sputtered simultaneously, and a method for controlling the sputtering...
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US20090208650 |
Ti-BASED FILM FORMING METHOD AND STORAGE MEDIUM
A Ti-based film forming method includes a step (step 1 ) of cleaning inside a chamber by introducing a cleaning gas containing fluorine into the chamber in a state where a wafer W is not provided...
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US20090204252 |
SUBSTRATE PROCESSING METHOD AND APPARATUS, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND STORAGE MEDIUM
A substrate processing method includes a first step of forming a metal complex by allowing a processing gas containing an organic compound to be adsorbed by a metal layer formed on a target...
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US20090197355 |
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING SYSTEM
A method for manufacturing a semiconductor device that controls the influence of a thickness of a stopper film even if there is a change in the thickness of the stopper film by measuring the...
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US20090191716 |
POLYSILICON LAYER REMOVING METHOD AND STORAGE MEDIUM
A polysilicon layer removing method capable of substantially removing etching residue, while improving the shape of an etching boundary is disclosed. The method for removing the polysilicon layer...
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US20090187268 |
Temperature regulating method, thermal processing system and semiconductor device manufacturing method
A temperature regulating method in a thermal processing system has heating means for heating an interior of a process chamber to process a substrate, a heating control section for controlling the...
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US20090177310 |
METHOD OF CONTROLLING PROCESS PARAMETERS FOR SEMICONDUCTOR MANUFACTURING APPARATUS
Methods and systems for adaptively controlling process parameters in semiconductor manufacturing equipment. An embodiment provides for gain scheduling of PID controllers across recipe steps. One...
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US20090171495 |
METHOD OF CONTROLLING STATUSES OF WAFERS
A method of controlling statuses of a plurality of wafers is described. A status of a wafer among the wafers is determined. An action related to the status is taken, according to the status...
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US20090164040 |
Method of processing semiconductor substrate and processing apparatus
A method of processing semiconductor substrates includes the steps of: storing attribution data indicating an attribution of each of the semiconductor substrates in a recording medium according to...
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US20090157216 |
AUTOMATED SCHEDULING OF TEST WAFER BUILDS IN A SEMICONDUCTOR MANUFACTURING PROCESS FLOW
An automated, computer-implemented method for managing test wafers in an integrated, automated semiconductor manufacturing environment includes: managing a test wafer inventory; consuming...
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US20090143894 |
BEVEL/BACKSIDE POLYMER REMOVING METHOD AND DEVICE, SUBSTRATE PROCESSING APPARATUS AND STORAGE MEDIUM
A bevel/backside polymer removing method removes multi-layered bevel/backside polymers adhering to a bevel surface and a backside of a target substrate. The multi-layered bevel/backside polymers...
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US20090138119 |
Chip Handler with a Buffer Traveling between Roaming Areas for Two Non-Colliding Robotic Arms
Two robotic arms roam in separate, non-overlapping areas of a test station, avoiding collisions. A traveling buffer moves along x-tracks between a front position and a back position. In the front...
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US20090137127 |
PLASMA ETCHING METHOD AND STORAGE MEDIUM
A plasma etching method that can increase the selection ratio of a stop layer to an interlayer insulation film. The plasma etching method is carried out on a substrate that has the interlayer...
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US20090133247 |
APPARATUS FOR PACKAGING A TAPE SUBSTRATE
An apparatus for packaging a tape substrate is provided. The apparatus includes a plurality of robotic arms, a plurality of clamping elements attached to the robotic arms, a memory having a program...
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US20090132082 |
STRIPED ON-CHIP INDUCTOR
Sub-100 nanometer semiconductor devices and methods and program products for manufacturing devices are provided, in particular inductors comprising a plurality of spaced parallel metal lines...
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US20090125141 |
WORKING APPARATUS AND WORKING METHOD FOR CIRCUIT BOARD
In estimating a curved surface model by approximating the shape of the board surface of a circuit board, auxiliary measurement spots are set other than measurement spots on the board surface,...
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US20090125140 |
SYSTEM AND METHOD FOR MATCHING SILICON OXIDE THICKNESS BETWEEN SIMILAR PROCESS TOOLS
The present invention is one or more implementations is a method of fabricating a semiconductor for improved oxide thickness control, defining a process tool, determining and evaluating performance...
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US20090111276 |
Temperature control module using gas pressure to control thermal conductance between liquid coolant and component body
A temperature control module for a semiconductor processing chamber comprises a thermally conductive component body, one or more channels in the component body and one or more tubes concentric...
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US20090105868 |
Method For Assembling A Customized Printed Circuit Board
A system and a method are provided for assembling a customized printed circuit board having at least one electrical component. The system includes an input device for allowing a user to input...
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US20090105867 |
Temperature control method, method of obtaining a temperature correction value, method of manufacturing a semiconductor device and substrate treatment apparatus
In a temperature control method in which a target temperature is given in a thermal treatment furnace and plural heaters are controlled according to the target temperature, the correlation of the...
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US20090099681 |
METHOD FOR CREATING WAFER BATCHES IN AN AUTOMATED BATCH PROCESS TOOL
A method of batching substrates in an automated processing tool, the automated process tool and a system for batching substrates in the automated process tool. The method includes selecting a first...
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US20090098667 |
Method For Picking Up Semiconductor Chips From A Wafer Table And Method For Mounting Semiconductor Chips On A Substrate
The invention relates to a method for picking up semiconductor chips from a wafer table and, optionally, their mounting on a substrate by means of a pick-and-place system. The position and...
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US20090088888 |
COMPONENT MOUNTING METHOD
The component mounter ( 100 ) includes a component return determination apparatus ( 503 ) being a computer device for determining whether the electronic component picked up by a suction nozzle is a...
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US20090085172 |
Deposition Method, Deposition Apparatus, Computer Readable Medium, and Semiconductor Device
A deposition method includes steps of placing a substrate on a susceptor in a process chamber; supplying to the process chamber a source gas including an organic compound and a plasma gas for...
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US20090082897 |
METHOD AND APPARATUS FOR GENERATING METROLOGY TAGS TO ALLOW AUTOMATIC METROLOGY RECIPE GENERATION
A method includes generating a layout for an integrated circuit device. A plurality of metrology sites on the layout is generated. A metrology tag associated with each of the metrology sites is...
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US20090081565 |
METHOD FOR FORMING ETCHING MASK, CONTROL PROGRAM AND PROGRAM STORAGE MEDIUM
Disclosed is a method for forming an etching mask, capable of precisely and easily forming an etching mask having a microscopic pattern of a non-straight-line shape. An exposure pattern of a...
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US20090078197 |
Substrate processing system, control method for substrate processing apparatus and program
The present invention provides a substrate processing system, a control method for a substrate processing apparatus, and a program for the system and/or method, each of which is intended to achieve...
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US20090062954 |
METHOD AND SYSTEM FOR AUTO-DISPATCHING LOTS IN PHOTOLITHOGRAPHY PROCESS
A method and a system for auto-dispatching lots in a photolithography process are provided. According to the method, first, a prioritized lot list is established according to the working status of...
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US20090055013 |
METHOD FOR CONTROLLING SEMICONDUCTOR-PROCESSING APPARATUS
A method controls an apparatus such as a semiconductor-processing apparatus including a controller and at least one device controlled by the controller, wherein the controller is provided with an...
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US20090053904 |
SUBSTRATE PROCESSING METHOD AND COMPUTER STORAGE MEDIUM
In the present invention, a coating solution containing polysilazane is applied to a substrate to form a coating film. Thereafter, an ultraviolet ray is applied to the coating film formed on the...
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