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US20090291559 |
STABLE, HIGH RATE SILICON SLURRY
The invention provides a chemical-mechanical polishing composition comprising wet-process silica, a stabilizer compound, a potassium salt, a secondary amine compound, and water. The invention...
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US20090260297 |
Hydrophilic and hydrophobic silane surface modification of abrasive grains
A surface-modified abrasive grain includes an abrasive grain as a substrate, and a film on the abrasive grain that includes a relatively hydrophilic silane component and a relatively hydrophobic...
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US20090246464 |
SILICON NITRIDE CUTTING TOOL
A silicon nitride cutting tool comprising a sintered product is disclosed. The sintered product comprises silicon nitride, at least one rare earth element compound, and a magnesium compound. The...
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US20090235591 |
FIXED ABRASIVE ARTICLES UTILIZING COATED ABRASIVE PARTICLES
An fixed abrasive article is provided which includes a matrix material and abrasive particles embedded within the matrix material. The abrasive particles have a core-shell structure that includes a...
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US20090224370 |
NON-PLANAR CVD DIAMOND-COATED CMP PAD CONDITIONER AND METHOD FOR MANUFACTURING
The present invention relates to a composite material having non-planar geometries and edge-shaving surfaces comprising a CVD diamond coating applied to a composite substrate made from a ceramic...
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US20090223136 |
Polishing compound for semiconductor wafer polishing and polishing method
The polishing compound for semiconductor wafer of the present invention contains colloidal silica composed of silica particles to which tetraethylammonium is fixed, and concentration of silica...
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US20090197414 |
Polishing Composition and Polishing Method Using The Same
The present invention provides a polishing composition that can be suitably used in polishing of polysilicon, and a polishing method using the polishing composition. The polishing composition...
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US20090145044 |
ABRASIVE ARTICLES AND METHODS FOR MAKING SAME
The disclosure is directed to an abrasive article. The abrasive article includes a backing having a major surface and a make layer. The make layer is disposed over the major surface of the backing....
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US20090139149 |
Abrasive Grain Based on Melted Spherical Corundum
An abrasive grain made from melted spherical corundum where the abrasive grain consists of a spherical corundum core, coated with an encircling layer of a binder and fine-grained abrasive solid...
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US20090124173 |
COMPOSITIONS AND METHODS FOR RUTHENIUM AND TANTALUM BARRIER CMP
This invention provides a chemical-mechanical polishing composition comprising an abrasive, an aqueous carrier, an oxidizing agent having a standard reduction potential of greater than 0.7 V and...
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US20090111359 |
POLISHING COMPOSITION FOR HARD DISK SUBSTRATE
A polishing composition for a hard disk substrate includes alumina particles, silica particles, and water. The volume median diameter of secondary particles of the alumina particles measured by a...
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US20090104851 |
Polishing of sapphire with composite slurries
Improved slurry compositions comprising a mixture of a first type of particles and a second type of abrasive particles dispersed within an aqueous medium, and abrasive slurry compositions for use...
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US20090101625 |
Silicon carbide particles, methods of fabrication, and methods using same
Improved silicon carbide particles, improved silicon carbide abrasive particles, and abrasive slurry compositions for use chemical mechanical planarization (CMP) processes. The particles can...
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US20090100766 |
Coated abrasive grains, method and for the production thereof as well as the use thereof for producing abrasives
The present invention relates to abrasive grains, which are coated with a micro-particle inorganic powder and a binder, consisting of the group of conventional abrasive grains as well as the group...
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US20090098807 |
Composite slurries of nano silicon carbide and alumina
Improved slurry compositions comprising silicon carbide particles and alumina particles dispersed within an aqueous medium. Slurry compositions in the form of abrasive slurry compositions for use...
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US20090098806 |
Compositions And Methods For Removing Scratches From Plastic Surfaces
A composition including an abrasive, a suspension agent, a surfactant, and a lubricant, is provided for removing scratches, hazing, discoloration, and other defects from plastic surfaces. The...
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US20090081871 |
POLISHING COMPOSITION AND METHOD UTILIZING ABRASIVE PARTICLES TREATED WITH AN AMINOSILANE
The inventive method comprises chemically-mechanically polishing a substrate with an inventive polishing composition comprising a liquid carrier, a cationic polymer, an acid, and abrasive particles...
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US20090068840 |
POLISHING LIQUID AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
A polishing liquid is provided, which includes abrasive grains and a surfactant. The abrasive grains contain a first colloidal silica having an average primary particle diameter of 45-80 nm and a...
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US20090036291 |
GRINDING BEADS AND METHOD OF PRODUCING THE SAME
A ceramic consisting essentially of:
about 51% to about 68% by weight ZrO 2 ; about 20% to about 40% by weight Al 2 O 3 ; about 9% to about 12% by weight CeO 2 ; about 0.05% to about 0.2% by...
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US20090035942 |
Ruthenium CMP compositions and methods
The present invention provides a chemical-mechanical polishing (CMP) composition for polishing a ruthenium-containing substrate in the presence of an oxidizing agent such as hydrogen peroxide...
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US20080311750 |
Polishing composition for semiconductor wafer and polishing method
The present invention relates to a polishing composition for a semiconductor wafer which is excellent in polishing property, and a polishing method. The polishing composition for a semiconductor...
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US20080289261 |
POLISHING COMPOSITION AND POLISHING METHOD
To provide a polishing composition which is suitable particularly for an application to polish a wafer containing tungsten, and a polishing process employing such a polishing composition. The...
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US20080287038 |
Polishing composition for semiconductor wafer, method for production thereof and polishing method
The present invention relates to a polishing composition for a substrate including a metal such as wiring, etc., formed on a semiconductor wafer, which can provide a high polishing rate without...
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US20080286660 |
DAMASCENE RETICLE AND METHOD OF MANUFACTURE THEREOF
A method for manufacturing an optical projection reticle employs a damascene process. First feature recesses are etched into a projection reticle mask plate which is transmissive or transparent....
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US20080263965 |
Semiconductor Polishing Composition
A semiconductor polishing composition is disclosed. The semiconductor polishing composition includes fumed silica. The semiconductor polishing composition is an aqueous dispersion solution of fumed...
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US20080250723 |
Process and Apparatus For Treating Exhausted Abrasive Slurries For the Recovery of Their Reusable Components
Process for completely recovering the reusable components of an abrasive slurry used in slicing crystalline materials of silicon, quartz or ceramics when it becomes exhausted and enriched with...
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US20080237535 |
Composition for polishing semiconductor wafer, and method of producing the same
A composition for polishing a semiconductor wafer contains fumed silica particles that are produced by wet grinding using a grinding medium and that have characteristics (A) to (C): (A) a specific...
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US20080222967 |
BONDED ABRASIVE ARTICLE AND METHOD OF MAKING
A bonded abrasive article is provided that includes abrasive grains within a bond matrix, the abrasive grains including cubic boron nitride (cBN) and the bond matrix including a polycrystalline...
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US20080207091 |
Slurry Composition For Color Filter Polishing
The invention provides a slurry composition for polishing color filters. The slurry composition at least includes an abrasive, a buffer solution and an additive. The abrasive is selected from the...
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US20080206576 |
Superabrasive compact including diamond-silicon carbide composite, methods of fabrication thereof, and applications therefor
Embodiments of the present invention relate to diamond-silicon carbide composites, superabrasive compacts including such diamond-silicon carbide composites, and methods of fabricating such...
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US20080202037 |
AUTO-STOPPING SLURRIES FOR CHEMICAL-MECHANICAL POLISHING OF TOPOGRAPHIC DIELECTRIC SILICON DIOXIDE
The present invention provides auto-stopping CMP slurry compositions that minimize post-CMP non-uniformity and also extend the time that polishing can be continued beyond the end point without the...
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US20080200033 |
POLISHING COMPOUND, METHOD FOR POLISHING SURFACE TO BE POLISHED, AND PROCESS FOR PRODUCING SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
To provide a polishing compound which is capable of polishing SiC at a high removal rate, or capable of suppressing polishing of silicon dioxide in an insulating layer on the other hand, while...
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US20080190036 |
ACOUSTIC DRIVEN TOUGHENED FOAM GLASS ABRASIVE DEVICES AND A METHOD FOR PRODUCING THE SAME
An abrasive tool having an elongated handle member, an ultrasonic vibration source operationally connected to the elongated handle member, and a toughened foamed glass ceramic portion operationally...
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US20080172951 |
COATED ABRASIVE PRODUCTS CONTAINING AGGREGATES
A coated abrasive product includes a particulate material containing green, unfired abrasive aggregates having a generally spheroidal or toroidal shape, the aggregates formed from a composition...
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US20080155904 |
METHOD OF ABRADING A METAL WORKPIECE
A method of abrading a metal workpiece including contacting a metal workpiece with an abrasive article, wherein the abrasive article includes a flexible waterproof backing having a first surface...
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US20080148652 |
Compositions for chemical mechanical planarization of copper
A composition and associated method for chemical mechanical planarization of a copper-containing substrate are described and which afford low defectivity levels on copper during copper CMP...
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US20080134585 |
Compositions for polishing aluminum/copper and titanium in damascene structures
The invention provides a chemical-mechanical polishing composition for polishing a substrate. The polishing composition comprises an oxidizing agent, calcium ion, an organic carboxylic acid, and...
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US20080127573 |
Slurry Composition for Final Polishing of Silicon Wafers and Method for Final Polishing of Silicon Wafers Using the Same
Disclosed is a slurry composition for final polishing of silicon wafers to achieve mirror surfaces of the wafers. The slurry composition can include deionized water, abrasive particles, a...
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US20080125018 |
SOLUTION FOR FIXED ABRASIVE CHEMICAL MECHANICAL POLISHING PROCESS AND FIXED ABRASIVE CHEMICAL MECHANICAL POLISHING METHOD
A solution for fixed abrasive chemical mechanical polishing process including a protection constituent, a hydrolysis constituent and water is described. The protection constituent is used to...
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US20080125017 |
POLISHING COMPOSITION AND POLISHING METHOD
To provide a polishing composition which is capable of selectively polishing a silicon oxide film against a polysilicon film, and a polishing method employing such a polishing composition. The...
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US20080125016 |
Method for Producing Polishing Agent, Polishing Agent Produced Thereby and Method for Producing Silicon Wafer
The present invention is a method for producing a polishing agent in which silica particles are dispersed in an aqueous solution, comprising at least a step of removing metal compound ions from a...
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US20080120918 |
POLISHING COMPOSITION AND POLISHING PROCESS
To provide a polishing composition which is suitable particularly for an application to polish a wafer containing tungsten, and a polishing process employing such a polishing composition. The...
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US20080120917 |
Blast material
A blast media for removal of thick coatings from heavy steel and lighter aluminum substrates where a profile is desired for new paint adhesion. The blast media is applied as a free flowing...
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US20080115423 |
Polishing Composition For Silicon Wafer
The present invention relates to a polishing composition for silicon wafer comprising silica; a basic compound; at least one compound selected from the group consisting of amino acid derivatives...
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US20080108497 |
METAL-RICH SILICEOUS COMPOSITIONS AND METHODS OF PRODUCING SAME
A modified sol-gel method to create metal-rich siliceous material, such as colloidal silica or aluminosilicate particles is disclosed. Initially, the metal salt of choice is added to a silicic acid...
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US20080104893 |
POLISHING COMPOSITION AND POLISHING METHOD
To provide a polishing composition suitable for use to polish a silicon dioxide film, particularly for use to polish a silicon dioxide film formed on a silicon substrate or a polysilicon film, and...
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US20080096475 |
Polishing Composition and Polishing Method
The present invention aims to improve the polishing rate during the polishing process of semiconductor substrates, hard disk substrates or the like by using a polishing composition containing...
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US20080096470 |
Chemical mechanical polishing slurry, its preparation method, and use for the same
A chemical mechanical polishing slurry for polishing a copper layer without excessively or destructively polishing a barrier layer beneath the copper layer is disclosed and includes an acid, a...
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US20080086951 |
Spinous silica-based sol and method of producing the same
The present invention provides a sol of spinous silica-based particles in which silica-based particles having peculiar forms, spinous forms are dispersed in a solvent. The spinous silica-based...
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US20080076327 |
Polishing slurry and polishing method using same
Polishing slurry is caused to be present between a surface of a soft magnetic layer and a polishing tool such as a polishing pad and the surface of the soft magnetic layer and the polishing tool...
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