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US20120096006 BUILDING A LIBRARY OF SPECTRA FOR OPTICAL MONITORING  
A method of controlling polishing includes storing a library having a plurality of reference spectra, polishing a substrate, measuring a sequence of spectra of light from the substrate during...
US20120187428 METHOD FOR THE PRODUCTION OF WHITE LEDS AND WHITE LED LIGHT SOURCE  
For the production of a white LED having a predetermined color temperature, a blue LED (2a-2d) or a UV LED is coated with a conversion layer (5) which absorbs the blue light or UV light and emits...
US20150111313 METHOD FOR MANUFACTURING LED, APPARATUS FOR MANUFACTURING LED, AND LED  
Provided are a high-quality LED and LED member, and a method and a device with which it is possible to manufacture the same in large quantities and at minimal manufacturing cost. The present...
US20110220870 MANUFACTURE OF QUANTUM DOT-ENABLED SOLID-STATE LIGHT EMITTERS  
Light emitting devices comprise excitation sources arranged to excite quantum dots which fluoresce to emit light. In an embodiment, a device is manufactured by a process which involves applying an...
US20140353575 DETERMINATION OF OPTIMAL DIAMETERS FOR NANOWIRES  
Methods of optimizing the diameters of nanowire photodiode light sensors. The method includes comparing the response of nanowire photodiode pixels having predetermined diameters with standard...
US20150179531 Uniformity in Wafer Patterning using Feedback Control  
A method for patterning a wafer includes performing a first patterning on a wafer, and after performing the first patterning, calculating a simulated dose mapper (DoMa) map predicting a change in...
US20130313584 LED illumination device having a first LED chip and a second LED chip, and a method for the production thereof  
An LED illumination device (10) having a first LED chip (1) and a second LED chip (2) is described, wherein the first LED chip (1) is suitable to emit radiation having a first emission...
US20110275167 Endpoint Method Using Peak Location Of Modified Spectra  
A method of optically monitoring a substrate during polishing includes receiving an identification of a selected spectral feature and a characteristic of the selected spectral feature to monitor...
US20130052757 METHODS FOR OPTIMIZING A PLASMA PROCESS  
Methods for optimizing a plasma process are provided. The method may include obtaining a measurement spectrum from a plasma reaction in a chamber, calculating a normalized measurement standard and...
US20150079703 METHOD FOR MANUFACTURING ORGANIC LIGHT EMITTING DISPLAY DEVICE  
An organic light emitting diode (OLED) display includes a substrate where a plurality of pixels are formed, a first pixel defining layer on the substrate, the first pixel defining layer dividing...
US20140134758 TECHNIQUES FOR MATCHING SPECTRA  
A method of controlling processing of a substrate includes measuring a spectrum reflected from the substrate, for each partition of a plurality of partitions of the measured spectrum, computing a...
US20140084247 THRESHOLD ADJUSTMENT FOR QUANTUM DOT ARRAY DEVICES WITH METAL SOURCE AND DRAIN  
Incorporation of metallic quantum dots (e.g., silver bromide (AgBr) films) into the source and drain regions of a MOSFET can assist in controlling the transistor performance by tuning the...
US20100062548 PHOTO KEY AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING THE PHOTO KEY  
A photo key has a plurality of first regions spaced apart from one another on a semiconductor substrate, and a second region surrounding the first regions, and one of the first regions and the...
US20130122611 DUAL-BULB LAMPHEAD CONTROL METHODOLOGY  
The present invention generally relates to methods of controlling UV lamp output to increase irradiance uniformity. The methods generally include determining a baseline irradiance within a...
US20140057370 DUAL WAFER SPIN COATING  
A method of bonding a first substrate and a second substrate includes the steps of rotating first substrate with an adhesive mass thereon, and second substrate contacting the mass and overlying...
US20150147024 Sacrificial Waveguide Test Structures  
Sacrificial optical test structures are constructed upon a wafer of pre-cleaved optical chips for testing the optical functions of the pre-cleaved optical chips. The sacrificial optical structures...
US20120104389 SACRIFICIAL WAVEGUIDE TEST STRUCTURES  
Sacrificial optical test structures are constructed upon a wafer (100) of pre-cleaved optical chips (10) for testing the optical functions of the pre-cleaved optical chips (10). The sacrificial...
US20090075402 Manipulation of focused heating source based on in situ optical measurements  
A method, system or the like which may, for example, be exploited as part of known methods, systems and/or apparatii which manipulate (i.e. tune, modify, change, create, etc.) the impedance of...
US20140257761 Hybrid Focus-Exposure Matrix  
A method for controlling semiconductor production through use of a hybrid Focus Exposure Matrix (FEM) model includes taking measurements of a set of structures formed onto a substrate. The method...
US20090053834 USE OF SCATTEROMETRY FOR IN-LINE DETECTION OF POLY-SI STRINGS LEFT IN STI DIVOT AFTER GATE ETCH  
One embodiment of the present invention relates to a method of forming an integrated circuit, comprising forming an STI structure in a semiconductor body, the STI structure having a divot...
US20130084655 OVERLAY MEASUREMENT FOR A DOUBLE PATTERNING  
A multi-patterning method of manufacturing a patterned wafer provides test structures designed to enhance overlay error measurement sensitivity for monitoring and process control. One or more...
US20150207021 Method for Coating a Solar Panel  
The present invention relates to a method for coating a solar panel to reduce the amount of light being received by the solar panel's photovoltaic cells and reduce their electrical output. The...
US20140356983 DISTORTING DONOR WAFER TO CORRESPONDING DISTORTION OF HOST WAFER  
A method generally for improving wafer-to-wafer bonding alignment. Planar distortions of the bonding surface of a host wafer are determined. The bonding surface of a donor wafer is distorted such...
US20120135546 ALIGNMENT INSPECTION  
The present disclosure relates to the field of microelectronic substrate fabrication and, more particularly, to alignment inspection for vias formed in the microelectronic substrates. The...
US20150198782 PACKAGING MEMS IN FLUIDIC ENVIRONMENTS  
A method and apparatus for packaging a MEMS device is disclosed that includes a MEMS die mounting surface, a MEMS device disposed on the mounting surface, and a fluid contained within the package...
US20150017456 Reducing voids caused by trapped acid on a dielectric surface  
When an etchant for metal (e.g., HF) reaches an underlying silicon oxide layer, it may form silanol bonds or other hydrogen bonds that resist rinsing, so that some etchant remains to be trapped...
US20090305438 Trench isolation method of semiconductor device using chemical mechanical polishing process  
A trench isolation method of a semiconductor device includes forming polishing prevention film patterns on a semiconductor substrate, etching the semiconductor device by using the polishing...
US20140318608 SOLAR CELL MANUFACTURING METHOD AND SOLAR CELL  
A method of manufacturing a solar cell includes a first center alignment step S10 of setting a substrate center position as a reference position for processing of an impurity implanting step S20...
US20120003758 METHOD OF FABRICATING A LIGHT EMITTING DIODE CHIP HAVING PHOSPHOR COATING LAYER  
A method of fabricating light emitting diode chips having a phosphor coating layer comprises providing a substrate having a plurality of light emitting diodes formed thereon; forming a conductive...
US20090170222 CONTROL OF IMPLANT CRITICAL DIMENSIONS USING AN STI STEP HEIGHT BASED DOSE OFFSET  
A method for semiconductor processing is provided, wherein a semiconductor wafer having undergone polishing is provided. The semiconductor wafer has an active region positioned between one or more...
US20140273295 Optical Control Of Multi-Stage Thin Film Solar Cell Production  
Embodiments include methods of depositing and controlling the deposition of a film in multiple stages. The disclosed deposition and deposition control methods include the optical monitoring of a...
US20060223200 Semiconductor manufacture method  
A semiconductor device manufacture method has the steps of: (a) forming a semiconductor device structure in a chip and alignment marks, respectively in a semiconductor wafer; (b) forming a...
US20090269862 ALIGNMENT METHOD OF CHIPS  
An alignment method of chips that are formed on a surface of a semiconductor wafer with alignment marks corresponding to the chips includes the steps of irradiating an alignment mark corresponding...
US20130045546 DETECTION OF SURFACE DEFECTS BY OPTICAL INLINE METROLOGY DURING Cu-CMP PROCESS  
An efficient method of detecting defects in metal patterns on the surface of wafers. Embodiments include forming a metal pattern on each of a plurality of wafers, polishing each wafer, and...
US20130062603 TEST STRUCTURE AND CALIBRATION METHOD  
A test structure for measuring a Micro-Electro-Mechanical System (MEMS) cavity height structure and calibration method. The method includes forming a sacrificial cavity material over a plurality...
US20130052755 Automatically adjusting baking process for low-k dielectric material  
A method includes etching a low-k dielectric layer on a wafer to form an opening in the low-k dielectric layer. An amount of a detrimental substance in the wafer is measured to obtain a...
US20100093112 LASER ANNEALING METHOD AND LASER ANNEALING APPARATUS  
An embodiment of the invention provides a laser annealing method, including the steps of radiating a laser beam to an amorphous film on a substrate while scanning the laser beam for the amorphous...
US20090179213 PHOSPHOR COATING SYSTEMS AND METHODS FOR LIGHT EMITTING STRUCTURES AND PACKAGED LIGHT EMITTING DIODES INCLUDING PHOSPHOR COATING  
Methods are disclosed including applying a layer of binder material onto an LED structure. A luminescent solution including an optical material suspended in a solution is atomized using a flow of...
US20110237002 METHOD FOR MANUFACTURING 3D CIRCUITS FROM BARE DIE OR PACKAGED IC CHIPS BY MICRODISPENSED INTERCONNECTIONS  
A method for manufacturing an electronic circuit in three-dimensional space provides for interconnecting electronic components within the circuit by directly writing conducting lines. The method...
US20090319196 METHOD AND SYSTEM FOR QUANTITATIVE INLINE MATERIAL CHARACTERIZATION IN SEMICONDUCTOR PRODUCTION PROCESSES BASED ON STRUCTURAL MEASUREMENTS AND RELATED MODELS  
By using powerful data analysis techniques, such as PCR, PLS, CLS and the like, in combination with measurement techniques providing structural information, gradually varying material...
US20140179028 PLASMA DOPING APPARATUS AND PLASMA DOPING METHOD  
Disclosed is a plasma doping apparatus provided with a plasma generating mechanism. The plasma generating mechanism includes a microwave generator that generates microwave for plasma excitation, a...
US20090117672 Light emitting devices with phosphor wavelength conversion and methods of fabrication thereof  
A method of fabricating a light emitting device having a specific target color, CIE xy, of emitted light is described. The device comprises a light emitting diode that is operable to emit light of...
US20150079702 MEASUREMENT DEVICE FOR TEXTURE SIZE, MANUFACTURING SYSTEM FOR SOLAR CELL, AND MANUFACTURING METHOD FOR SOLAR CELL  
A manufacturing method for a solar cell, wherein after a texture is formed on a principal surface of a substrate, infrared light in a predetermined wave number range is applied to a portion, on...
US20140227806 METHOD OF MANUFACTURING WHITE LIGHT EMITTING DEVICE (LED) AND APPARATUS MEASURING PHOSPHOR FILM  
A method of manufacturing a white light emitting device includes dividing a phosphor sheet into phosphor film units to be applied to individual light emitting diode (LED) devices, measuring light...
US20130161534 METHOD OF MANUFACTURING WHITE LIGHT EMITTING DEVICE (LED) AND APPARATUS MEASURING PHOSPHOR FILM  
A method of manufacturing a white light emitting device includes dividing a phosphor sheet into phosphor film units to be applied to individual light emitting diode (LED) devices, measuring light...
US20070087457 METHOD FOR INSPECTING AND MENDING DEFECT OF PHOTO-RESIST AND MANUFACTURING PROCESS OF PRINTED CIRCUIT BOARD  
A method for inspecting and mending defects of photo-resist is provided. It includes the following steps. First, a substrate having at least one film is provided. Then, a patterned photo-resist...
US20110263049 WAFER EDGE INSPECTION  
Wafer edge inspection approaches are disclosed wherein an imaging device captures at least one image of an edge of a wafer. The at least one image can be analyzed in order to identify an edge bead...
US20080036040 Semiconductor Wafers With Highly Precise Edge Profile And Method For Producing Them  
A semiconductor wafer has a front side, a rear side and an edge which runs along the circumference of the semiconductor wafer and which connects the front side and the rear side of the edge having...
US20120190136 METHOD AND APPARATUS FOR MANUFACTURING LED DEVICE  
An apparatus and method of manufacturing a light emitting diode (LED) device, and more particularly, an apparatus and method of manufacturing an LED device by dispensing a fluorescent solution...
US20070210460 Substrate processing and alignment  
A substrate can efficiently be manufactured by separating the alignment and the actual processing when an alignment mark is provided, which is fixed with respect to the substrate and when position...

Matches 1 - 50 out of 341 1 2 3 4 5 6 7 >