Matches 1 - 50 out of 113 1 2 3 >


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US20120108065 METHOD FOR MANUFACTURING POLISHING PAD  
A method for manufacturing a polishing pad, which may be laminated, with a small number of manufacturing steps, high productivity and no peeling between a polishing layer and a cushion layer...
US20110309470 Trench MOS Barrier Schottky Rectifier With A Planar Surface Using CMP Techniques  
High Efficiency Diode (HED) rectifiers with improved performance including reduced reverse leakage current, reliable solderability properties, and higher manufacturing yields are fabricated by...
US20150166837 COMPOSITION AND METHOD FOR CHEMICAL MECHANICAL POLISHING  
A composition for chemical mechanical polishing includes a plurality of particles and a plurality of abrasive particles. Each of the plurality of particles includes a body and a functional group....
US20120241916 WAFER EDGE CONDITIONING FOR THINNED WAFERS  
The present invention relates to a method for minimizing breakage of wafers during or after a wafer thinning process. A method of forming a rounded edge to the portion of a wafer remaining after...
US20100001255 SELECTIVE NANOTUBE FORMATION AND RELATED DEVICES  
Nanotube electronic devices exhibit selective affinity to disparate nanotube types. According to an example embodiment, a semiconductor device exhibits a treated substrate that selectively...
US20060030156 Abrasive conductive polishing article for electrochemical mechanical polishing  
Articles of manufacture and processes for planarizing a layer on a substrate are provided. In one aspect, a process is provided for manufacturing a polishing article comprising combining a...
US20110104899 SUB-LITHOGRAPHIC PRINTING METHOD  
A trench structure and an integrated circuit comprising sub-lithographic trench structures in a substrate. In one embodiment the trench structure is created by forming sets of trenches with a...
US20070077764 Polishing method, polishing composition and polishing composition kit  
A polishing method for polishing a polysilicon film provided on a silicon substrate having an isolation region is provided. The method includes preliminarily polishing the polysilicon film using a...
US20070066066 Polishing method for glass substrate, and glass substrate  
To provide a polishing method for a glass substrate required to have extremely high surface smoothness and surface precision, like a glass substrate to be used for e.g. a reflective mask for...
US20050153556 Methods for polishing copper features of semiconductor devices structures  
A method for substantially simultaneously polishing a copper conductive structure of a semiconductor device structure and an adjacent barrier layer includes use of a slurry that is formulated so...
US20110111594 WAFER BONDING METHOD  
Even for the case where a CVD oxide film is interposed at a bonding interface, as a pre-processing of bonding a first wafer and a second wafer, at least the surface roughness of the CVD oxide film...
US20080045014 COMPLEX CHEMICAL MECHANICAL POLISHING AND METHOD FOR MANUFACTURING SHALLOW TRENCH ISOLATION STRUCTURE  
A complex chemical mechanical polishing process for planarizing a structure. The process comprises steps of performing a main polishing process with a first polishing rate, wherein a slurry is...
US20130302983 TEMPORARY ADHESIVE FOR WAFER PROCESSING, MEMBER FOR WAFER PROCESSING USING THE SAME, WAFER PROCESSED BODY, AND METHOD FOR PRODUCING THIN WAFER  
The present invention provided is the temporary adhesive for wafer processing which temporarily bonds a wafer having a circuit face on the front surface and a processing face on the back surface...
US20060216936 Chemical and mechanical polishing method and polishing liquid using therefor  
A polishing method comprising chemically and mechanically polishing a surface to be polished, the polishing comprising a plurality of steps, wherein the surface is polished with a polishing liquid...
US20070082490 APPARATUS OF CHEMICAL MECHANICAL POLISHING AND CHEMICAL MECHANICAL POLISHING PROCESS  
An apparatus of chemical mechanical polishing has a polishing machine, a first thickness metrology and a second thickness metrology. The first thickness metrology is connected with the polishing...
US20120193764 NANOSTRUCTURING PROCESS FOR INGOT SURFACE, WAFER MANUFACTURING METHOD, AND WAFER USING THE SAME  
The instant disclosure relates to a nanostructuring process for an ingot surface prior to the slicing operation. A surface treatment step is performed for at least one surface of the ingot in...
US20070099427 Method for preparing of cerium oxide powder for chemical mechanical polishing and method for preparing of chemical mechanical polishing slurry using the same  
The present invention relates to a method of preparing a cerium oxide powder for a CMP slurry and a method of preparing a CMP slurry using the same, and more particularly, to a method of preparing...
US20080113510 Semiconductor Wafer Fabricating Method and Semiconductor Wafer Mirror Edge Polishing Method  
There is provided a semiconductor wafer fabricating method comprising at least: a double-side polishing step of mirror-polishing a front surface and a back surface of a semiconductor wafer; and a...
US20080227295 Self-aligned contact frequency doubling technology for memory and logic device applications  
Contact spatial-frequency doubling technology is invented to pattern a contact-hole array and a row/column (or multiple isolated rows/columns) of contact holes with their density increased to...
US20120289048 Method for obtaining a layout design for an existing integrated circuit  
A method for obtaining a layout design for an existing integrated circuit, in which, an integrated circuit die is polished with a tilt angle to form an inclined polished surface and one or more...
US20100264518 WAFER AND METHOD FOR CONSTRUCTION, STRENGTHENING AND HOMOGENIZATION THEREOF  
The present invention provides a water and a method for strengthening, homogenization and construction thereof. The concave and convex portions are processed by laser or etching, and then formed...
US20150232328 Method for producing a wafer equipped with transparent plates  
A production method for a wafer equipped with transparent plates includes: formation of a row of through-holes in a wafer; formation of at least one strip-shaped recess in a wafer surface, each of...
US20100330808 CAP LAYER REMOVAL IN A HIGH-K METAL GATE STACK BY USING AN ETCH PROCESS  
In a replacement gate approach, the dielectric cap layers of the gate electrode structures are removed in a separate removal process, such as a plasma assisted etch process, in order to provide...
US20070202702 Chemical mechanical polishing process  
A chemical mechanical polishing method is disclosed. The method includes forming a film on a wafer having at least one trench structure thereon; polishing the surface of the film by providing a...
US20100273329 METHOD FOR PREPARING A DONOR SURFACE FOR REUSE  
A donor wafer, for example of silicon, has an irregular surface following cleaving of a lamina from the surface, for example by exfoliation following implant of hydrogen and/or helium ions to...
US20060143993 Slurry compositions for use in chemical mechanical polishing and method of manufacturing semiconductor device using the same  
Slurry compositions and method used in a chemical-mechanical polishing process for manufacturing a semiconductor device may include a surfactant and a positive-ionic high molecular compound. The...
US20120252212 PROCESSING METHOD FOR WAFER HAVING EMBEDDED ELECTRODES  
A wafer processing method which includes a protective member attaching step of attaching a protective member to the front side of the wafer, a back grinding step of grinding the back side of the...
US20080064211 POLISHING COMPOUND FOR COPPER WIRINGS AND METHOD FOR POLISHING SURFACE OF SEMICONDUCTOR INTEGRATED CIRCUIT  
To provide a technique for realizing high-precision surface planarization when copper is used as a wiring metal. A polishing compound is used which comprises water; a peroxide oxidizer; a surface...
US20130316538 SURFACE MORPHOLOGY GENERATION AND TRANSFER BY SPALLING  
The generation of surface patterns or the replication of surface patterns is achieved in the present disclosure without the need to employ an etching process. Instead, a unique fracture mode...
US20090273060 GROUP III NITRIDE CRYSTAL AND METHOD FOR SURFACE TREATMENT THEREOF, GROUP III NITRIDE STACK AND MANUFACTURING METHOD THEREOF, AND GROUP III NITRIDE SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF  
A method for surface treatment of a group III nitride crystal includes the steps of lapping a surface of a group III nitride crystal using a hard abrasive grain with a Mohs hardness higher than 7,...
US20050136671 Compositions and methods for low downforce pressure polishing of copper  
The present invention provides an aqueous composition useful for polishing copper on a semiconductor wafer at a down force pressure of at least less than 20.68 kPa, comprising by weight percent 1...
US20140030892 METHOD FOR MANUFACTURING SILICON CARBIDE SUBSTRATE  
A method for manufacturing a silicon carbide substrate includes the steps of: preparing an ingot made of silicon carbide; obtaining a silicon carbide substrate by cutting the ingot prepared;...
US20050136670 Compositions and methods for controlled polishing of copper  
The present invention provides an aqueous composition useful for polishing copper on a semiconductor wafer comprising by weight percent 0.001 to 6 inhibitor for a nonferrous metal, 0.05 to 10...
US20050176250 Polishig fluid for metallic films and method for producing semiconductor substrate using the same  
A polishing fluid for metallic films, wherein the etching rate is 10 nm/min. or less, the polishing rate under a load of 10 KPa is 200 nm/min. or more, and the contrast, a ratio of the...
US20080045015 Method of etching wafer  
A method of etching a wafer includes the steps of holding the wafer on a chuck table in the condition where a recessed part formed in the wafer by grinding is directed up, and supplying a required...
US20090023289 CONDUCTOR REMOVAL PROCESS  
A conductor removal process is described, which is applied to a substrate that has thereon a plurality of patterns and a blanket conductor layer covering the patterns. An upper portion of the...
US20110263126 METHOD FOR MANUFACTURING A SILICON WAFER  
Method for manufacturing a silicon wafer free of point defect agglomerates by processes including adding pure carbon to raw material of polycrystalline silicon, melting to become a molten silicon...
US20060216935 Composition for oxide CMP in CMOS device fabrication  
The present invention provides an oxide CMP slurry composition for use in planarizing silicon oxide-containing films via CMP during CMOS device fabrication, and a method of planarizing silicon...
US20070128872 Polishing composition and polishing method  
As a polishing composition which allows high-speed polishing while dishing and erosion are prevented and the flatness of metal film is maintained, there is provided a polishing composition for...
US20080020576 METHOD OF FORMING POLYSILICON PATTERN  
Embodiments relate to a method of forming a polysilicon pattern, which may be able to form a minute pattern. In embodiments, the method may in clued forming a first polysilicon pattern by...
US20150243732 NOVEL INTEGRATION PROCESS TO FORM MICROELECTRONIC OR MICROMECHANICAL STRUCTURES  
The invention relates to transferring, in one exposure, a single-mask feature to form two features on an underlying material. Specifically, a doubled walled structure (i.e. a center opening...
US20070281403 Method of enhancing gate lithography performance by polysilicon chemical-mechanical polishing  
A method of enhancing gate lithography performance by polysilicon chemical-mechanical polishing includes depositing a gate polysilicon layer on a semiconductor substrate which has a field oxide...
US20090042390 ETCHANT FOR SILICON WAFER SURFACE SHAPE CONTROL AND METHOD FOR MANUFACTURING SILICON WAFERS USING THE SAME  
It is possible to reduce workloads of a both-side simultaneous polishing process or a single-side polishing process, and to achieve both of the maintenance of the wafer flatness and the reduction...
US20070099426 Polishing method, polishing apparatus, and electrolytic polishing apparatus  
A polishing method polishes a substrate so as to remove an interconnect metal film and a barrier film formed on portions other than interconnect recesses. The method includes performing a first...
US20140256133 POST METAL CHEMICAL-MECHANICAL PLANARIZATION CLEANING PROCESS  
A post metal chemical-mechanical planarization (CMP) cleaning process for advanced interconnect technology is provided. The process, which follows CMP, combines an acidic clean and a basic clean...
US20080057714 Polished semiconductor wafer and process for producing it  
A polished semiconductor wafer has a front surface and a back surface and an edge R, which is located at a distance of a radius from a center of the semiconductor wafer, forms a periphery of the...
US20070287290 MANUFACTURING METHOD FOR NON-ACTIVE ELECTRICALLY STRUCTURES OF AN INTEGRATED ELECTRONIC CIRCUIT FORMED ON A SEMICONDUCTOR SUBSTRATE AND CORRESPONDING ELECTRONIC CIRCUIT  
Electrically non-active structures are formed for an electronic circuit to make uniform a surface above a semiconductor substrate. The electronic circuit includes first electrically active...
US20060255901 Production of microelectromechanical systems (mems) using the high-temperature silicon fusion bonding of wafers  
The invention relates to a method for manufacturing MEMS devices, in which the sensor and the electronics for processing the sensor signal are monolithically integrated.
US20060214133 Metal polishing solution and polishing method  
A metal polishing solution comprising an oxidizing agent, wherein assuming that an oxidation reaction rate immediately after an oxidation of a metal to be polished starts at its surface is E1 and...
US20100058876 SEMICONDUCTOR DEVICE INCLUDING A PRESSURE SENSOR  
A semiconductor device includes a first cavity within a semiconductor substrate and a second cavity within the semiconductor substrate. The second cavity is open to an atmosphere and defines a...

Matches 1 - 50 out of 113 1 2 3 >