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US20140342479 METHOD AND SYSTEM FOR TEMPLATE ASSISTED WAFER BONDING USING PEDESTALS  
A method of fabricating a composite semiconductor structure includes providing a first substrate comprising a first material and having a first surface and forming a plurality of pedestals...
US20110094561 DYE-SENSITIZED SOLAR CELL, METHOD OF PRODUCING THE SAME, AND DYE-SENSITIZED SOLAR CELL MODULE  
Provided are a dye-sensitized solar cell wherein a counter electrode composed of a stable counter electrode conductive layer and a catalyst layer is formed on a porous insulation layer, and a...
US20080296712 Assembling Two Substrates by Molecular Adhesion  
The invention relates to an assembly method to enable local electrical bonds between zones located on a face of a first substrate and corresponding zones located on a face of a second substrate,...
US20100009489 METHOD AND SYSTEM FOR PRODUCING A SOLAR CELL USING ATMOSPHERIC PRESSURE PLASMA CHEMICAL VAPOR DEPOSITION  
A process and system for producing a thin-film solar cell using atmospheric pressure plasma chemical vapor deposition is disclosed. A plasma at substantially atmospheric pressure is used to...
US20110162704 RELIABILITY OF BACK END OF LINE PROCESS BY ADDING PVD OXIDE FILM  
A method and apparatus for forming a protective coating on a photovoltaic device is provided. The photovoltaic device is formed by depositing photoelectric conversion units on a substrate, and by...
US20120301992 ELECTROLYTE SOLUTION FOR DYE SENSITIZED SOLAR CELL, AND DYE SENSITIZED SOLAR CELL USING SAME  
It is to provide an electrolyte solution for a dye sensitized solar cell that does not generate a gas, can be used in a wide temperature range, and is excellent in durability. The electrolyte...
US20100200064 DYE-SENSITIZING SOLAR CELL AND FABRICATING METHOD THEREOF  
A dye-sensitizing solar cell (DSSC) is provided. The DSSC includes a working electrode, a counter electrode disposed opposite to the working electrode, a first gap control layer disposed between...
US20120292620 PIXEL STRUCTURE AND MANUFACTURING METHOD THEREOF  
A manufacturing method of pixel structure includes: sequentially forming a gate, a gate insulation layer, a semiconductor layer and a conductive layer on a substrate; forming a first patterned...
US20120103413 THIN-FILM SOLAR CELL AND METHOD FOR FABRICATING THE SAME  
A thin-film solar cell includes a body and a polymer layer. The body includes a first electrode layer, a photoelectric conversion layer, and a second electrode layer, and the polymer layer...
US20100258189 WRAPPED SOLAR CEL  
A photovoltaic device comprising a photovoltaic cell and at least one layer, the photovoltaic ceil and at least one layer wrapped from the inside out to form the photovoltaic device having a...
US20140210027 IMAGE SENSOR MODULE AND METHOD OF MANUFACTURING THE SAME  
There is provided an image sensor module, including: an image sensor having a small thickness of 175 μm or less and having a first coefficient of thermal expansion; a substrate having the image...
US20110212565 Humidity Control and Method for Thin Film Photovoltaic Materials  
A method for processing a thin film photovoltaic module. The method includes providing a plurality of substrates, each of the substrates having a first electrode layer and an overlying absorber...
US20100052087 Image Sensor  
An image sensor die includes a conformal dielectric coating over at least a die sidewall adjacent an interconnect edge and, in some embodiments, a conformal dielectric coating over the image array...
US20140014179 MULTI-LAYER, LIGHT-MODULATING DEVICES AND THE MANUFACTURER THEREOF  
A light-modulating electrical device is disclosed and a method for manufacturing a light-modulating electrical device. The method includes, as a single lamination process, positioning a...
US20100187557 Light Sensor Using Wafer-Level Packaging  
The present invention provides systems, devices and methods for fabricating miniature low-power light sensors. With the present invention, a light sensitive component, such as a diode, is...
US20140346631 RADIATION DETECTOR SYSTEM AND METHOD OF MANUFACTURE  
The present disclosure provides a high electric field radiation detector including a first electrode, a second electrode, a radiation detecting layer, and a soft polymer layer below the radiation...
US20130248914 PACKAGED OPTOELECTRONIC DEVICE AND PROCESS FOR MANUFACTURING  
A packaged optoelectronic device and a method for manufacturing is provided. The packaged optoelectronic device includes at least one optoelectronic device with two electrodes sandwiched between a...
US20130167927 BASE MATERIAL FOR SOLAR CELL MODULE AND METHOD FOR PRODUCING SAME  
A base material for a solar cell module includes a base material film including at least one layer and a coating layer including at least one layer and formed on one surface or both surfaces of...
US20110224487 IMAGE PICKUP MODULE, MANUFACTURING METHOD THEREOF, AND ENDOSCOPIC DEVICE  
Size reduction of an image pickup module is promoted, and reliability of electric connection and electric noise resistance are improved by decreasing the numbers of components and connection...
US20100258891 FINGERPRINT SENSOR CHIP PACKAGE METHOD AND THE PACKAGE STRUCTURE THEREOF  
A fingerprint sensor chip package method and the package structure thereof are disclosed. The invention includes: providing a substrate; arranging a sensor chip on the substrate, with an active...
US20100321555 SOLID STATE IMAGING DEVICE AND MANUFACTURING METHOD THEREOF  
A solid state imaging device includes: a substrate having an opening portion; a solid state imaging element mounted to the substrate through a flip-chip process; and a resin mold portion formed on...
US20140335643 METHOD FOR PRODUCING A PHOTOVOLTAIC MODULE  
A photovoltaic module having at least one photovoltaic cell may be produced. At least one photovoltaic cell may be arranged on a substrate, covering the substrate and the cell with at least one...
US20130127000 Interposer Package For CMOS Image Sensor And Method Of Making Same  
An image sensor package and method of manufacture that includes a crystalline handler with conductive elements extending therethrough, an image sensor chip disposed in a cavity of the handler, and...
US20110223704 DYE-SENSITIZED SOLAR CELL MANUFACTURING METHOD  
A dye-sensitized solar cell manufacturing method of the invention comprises the steps of: preparing a first electrode having an oxide semiconductor layer and a second electrode; forming a first...
US20110120519 Method of Manufacturing a Photovoltaic Cell  
A method of manufacturing a photovoltaic cell using a semiconductor wafer having a front side and a rear side, wherein the photovoltaic cell produces electricity when the front side of the...
US20090217976 Solar cell with integrated thermally conductive and electrically insulating substrate  
A solar cell package and processes for creating a solar cell package are disclosed. The solar cell includes an electrically insulating and thermally conductive first layer, an electrically...
US20060076637 Method and system for packaging a display  
A package structure and method of packaging for an interferometric modulator. A transparent substrate having an interferometric modulator formed thereon is provided. A backplane is joined to the...
US20140326309 METHOD FOR PREVENTING AN ELECTRICAL SHORTAGE IN A SEMICONDUCTOR LAYER STACK, THIN SUBSTRATE CPV CELL, AND SOLAR CELL ASSEMBLY  
The invention relates to a method for preventing an electrical shortage between at least two layers of a semiconductor layer stack attached by the surface of one of its layers to a substrate via a...
US20120292658 SEMICONDUCTOR OPTOELECTRONIC CONVERTING SYSTEM AND THE FABRICATING METHOD THEREOF  
The present invention discloses a semiconductor optoelectronic converting system and the fabricating method thereof, the system comprises a supporting module, a heat pipe, a power converting...
US20110223705 PROCESS FOR ASSEMBLING CAMERA MODULE  
A process for assembling a camera module is provided. Firstly, a first conductive bump and a second conductive bump are placed on a signal terminal of a substrate and a contact pad of an image...
US20110053306 Photovoltaic Lead Manufacture  
An improved lead foil operation procedure for photovoltaic module manufacture is disclosed. The procedure includes lift, cut, and fold lead foil.
US20150207097 COMPONENTS AND METHOD FOR PRODUCING COMPONENTS  
Various embodiments may relate to a component, including a carrier, a first electrode on or over the carrier, an organic functional layer structure on or over the first electrode, a second...
US20130210177 METHOD FOR MANUFACTURING AN ORGANIC ELECTRONIC DEVICE  
The invention relates to method for manufacturing an electronic device comprising an organic layer (120). According to this method, a stack with a metal layer (130) and an organic layer (120) as...
US20110065225 SOLID-STATE IMAGING DEVICE, METHOD OF PRODUCING THE SAME, AND CAMERA  
To provide a solid-state imaging device able to improve light transmittance of a transparent insulation film in a light incident side of a substrate, suppress the dark current, and prevent a...
US20080265355 SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME  
In a semiconductor device which has through holes in an end face, in which a semiconductor element is fixedly mounted on a face of a substrate which has a wiring pattern, which is conductive to...
US20120241802 Method for Producing a Component with at Least One Organic Material and Component with at Least One Organic Material  
In at least one embodiment of the component (10) the latter comprises a first substrate (1) and a second substrate (2), at least one radiation-emitting or radiation-receiving element (3) being...
US20100193023 PHOTOVOLTAIC MODULES COMPRISING PLASTICIZED FILMS BASED ON POLYVINYL ACETAL HAVING A HIGH SPECIFIC RESISTANCE  
Plasticizer-containing films based on polyvinyl acetal having a glass transition temperature Tg of at least 20° C. are useful for the production of photovoltaic modules. The films preferably have...
US20100147365 HIGH FIDELITY NANO-STRUCTURES AND ARRAYS FOR PHOTOVOLTAICS AND METHODS OF MAKING THE SAME  
A photovoltaic device includes an electron accepting material and an electron donating material. One of the electron accepting or donating materials is configured and dimensioned as a first...
US20080087975 Chip package and chip packaging method  
A chip package and a chip packaging method for use in optical applications are disclosed. The packaging method includes the steps of: a) providing a substrate having a first surface and a second...
US20150228923 Optoelectronic component and method for producing an optoelectronic component  
Various embodiments may relate to an optoelectronic component, including a carrier, a planar, electrically active region on or above the carrier; an adhesion layer on or above the electrically...
US20140182669 DYE-SENSITIZED SOLAR CELL AND METHOD FOR MANUFACTURING THE SAME  
To provide a dye-sensitized solar cell with suppressed photoelectric conversion efficiency deterioration due to a gap to be possibly be generated between a transparent member on which a light is...
US20130322476 CONTROLLED-IMPEDANCE OUT-OF-SUBSTRATE PACKAGE STRUCTURES EMPLOYING ELECTRICAL DEVICES, AND RELATED ASSEMBLIES, COMPONENTS, AND METHODS  
Controlled-impedance out-of-substrate package structures employing electrical devices and related assemblies, components, and methods are disclosed. An out-of-substrate package structure may be...
US20100252103 PHOTOELECTRONIC ELEMENT HAVING A TRANSPARENT ADHESION STRUCTURE AND THE MANUFACTURING METHOD THEREOF  
A photoelectronic element having a transparent adhesion structure includes a supporting substrate; a first transparent adhesion layer formed on the supporting substrate; a second transparent...
US20050178428 Photovoltaic system and method of making same  
The present invention relates to a photovoltaic system and methods of making same. The photovoltaic system has a plurality of layers attached to each other to form a unitary structure. More...
US20130334638 Apparatus and Method for Backside Illuminated Image Sensors  
A backside illuminated image sensor comprises a photodiode and a first transistor located in a first substrate, wherein the first transistor is electrically coupled to the photodiode. The backside...
US20110100462 Dye-sensitized solar cell and photoanode thereof  
A dye-sensitized solar cell, a photoanode thereof, and a method for manufacturing the same are disclosed. The photoanode of the dye-sensitized solar cell of the present invention is prepared by a...
US20100212725 SYSTEMS AND METHODS FOR IMPROVED PHOTOVOLTAIC MODULE STRUCTURE  
A system and method for improved photovoltaic module structure is described. One embodiment includes a photovoltaic module comprising a front substrate, a photovoltaic structure attached to the...
US20090267172 METHOD OF MANUFACTURING AN IMAGE SENSING MICROMODULE  
A method of manufacturing a micromodule including the steps of: producing an integrated circuit on an active face of a chip made of a semi-conductive material, making a via passing through the...
US20130032203 SOLAR CELL MODULE ON MOLDED LEAD-FRAME AND METHODS OF MANUFACTURE  
A solar cell having a molded lead frame, and method of manufacture of same, is disclosed. Specifically, a plurality of solar cells is manufactured from a strip of lead-frames and soft solder...
US20120024349 INTRA-LAMINATE DISK LAYER FOR THIN FILM PHOTOVOLTAIC DEVICES AND THEIR METHODS OF MANUFACTURE  
Photovoltaic devices including an insulating layer and an intra-laminate disk layer on a plurality of thin film layers are provided. A first conductive strip, defining a first lead, is positioned...