Match Document Document Title
US20150280026 FLEXIBLE TRANSPARENT SOLAR CELL AND PRODUCTION PROCESS OF THE SAME  
The invention provides a flexible transparent solar cell and a production process of the same, and belongs to the technical field of solar cell. The flexible transparent solar cell comprises: a...
US20150279893 Structure and Method for 30 Image Sensor  
An image sensor structure that includes a first semiconductor substrate having a plurality of imaging sensors; a first interconnect structure formed on the first semiconductor substrate; a second...
US20150279885 CMOS IMAGE SENSOR STRUCTURE  
A semiconductor device is operated for sensing incident light and includes a substrate, a device layer, a semiconductor layer and a color filter layer. The device layer is disposed on the...
US20150255634 SEMICONDUCTOR DEVICE HAVING A TRANSPARENT WINDOW FOR PASSING RADIATION  
Method of encapsulating a semiconductor structure comprising providing a semiconductor structure comprising an opto-electric element located in a cavity formed between a substrate and a cap layer,...
US20150249105 IMAGING SYSTEMS WITH FLIP CHIP BALL GRID ARRAYS  
An imaging system may include an integrated circuit package that includes an image sensor die mounted in a flip chip configuration to a package substrate. The image sensor die may be a backside...
US20150243699 IMAGING SYSTEMS WITH THROUGH-OXIDE VIA CONNECTIONS  
An imaging system may include an image sensor package with through-oxide via connections between the image sensor die and the digital signal processing die in the image sensor package. The image...
US20150236209 Optoelectronic Semiconductor Chip and Method for Production Thereof  
An optoelectronic semiconductor chip includes a semiconductor body and a carrier, on which the semiconductor body is arranged. The semiconductor body has a semiconductor layer sequence with an...
US20150214263 SOLID STATE IMAGE PICKUP APPARATUS AND METHOD FOR MANUFACTURING THE SAME, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE  
There is provided a solid state image pickup apparatus including a first semiconductor substrate and a second semiconductor substrate which are bonded to each other, and a buried portion formed in...
US20150194560 STRESSED SEMICONDUCTOR DETECTOR WITH PIEZOELECTRICAL COMPONENT  
A semiconductor detector device comprising: a detector element comprising at least one active detector layer of piezoelectric semiconductor material; a stress inducing element arranged to act in...
US20150171132 Image Sensor Devices, Methods of Manufacture Thereof, and Semiconductor Device Manufacturing Methods  
Image sensor devices, methods of manufacture thereof, and semiconductor device manufacturing methods are disclosed. In some embodiments, a method of manufacturing a semiconductor device includes...
US20150162371 SEMICONDUCTOR DEVICE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE  
The present disclosure includes a first substrate including a first wiring layer having a first connection electrode projecting by a predetermined quantity from a first interlayer insulation film...
US20150140719 VERTICAL CONDUCTIVE CONNECTIONS IN SEMICONDUCTOR SUBSTRATES  
An embodiment of a die comprising: a semiconductor body including a front side, a back side, and a lateral surface; an electronic device, formed in said semiconductor body and including an active...
US20150132872 DEVICE AND METHOD FOR THE SURFACE TREATMENT OF A SUBSTRATE AND METHOD FOR PRODUCING AN OPTOELECTRONIC COMPONENT  
Various embodiments may relate to a device for the surface treatment of a substrate, including a processing head, which is mounted rotatably about an axis of rotation, and which comprises multiple...
US20150125976 SELECTIVE SIDEWALL GROWTH OF SEMICONDUCTOR MATERIAL  
A method of producing a bulk semiconductor material comprises the steps of providing a base comprising a substantially planar substrate having a plurality of etched nano/micro-structures located...
US20150114451 FLEXIBLE PACKAGING FOR MICROELECTRONIC DEVICES  
An apparatus, method, and system, the apparatus and system including a flexible microsystems enabled microelectronic device package including a microelectronic device positioned on a substrate; an...
US20150076645 OPTICAL SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME  
Phosphate-based glass doped with copper ions having infrared blocking filter characteristics is formed into particles and is mixed with a transparent encapsulating resin to encapsulate a...
US20150050770 PROCESS FOR PRODUCING LAYERED MEMBER AND LAYERED MEMBER  
The object is to provide a photoelectric surface member which allows higher quantum efficiency. In order to achieve this object, a photoelectric surface member 1a is a crystalline layer formed by...
US20150008555 SOLID STATE IMAGING APPARATUS, PRODUCTION METHOD THEREOF AND ELECTRONIC DEVICE  
A solid state imaging apparatus includes an insulation structure formed of an insulation substance penetrating through at least a silicon layer at a light receiving surface side, the insulation...
US20150004738 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE  
The present technology includes: bonding a device formation side of a first substrate having a first device and a device formation side of a second substrate having a second device in opposition...
US20140353651 SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SOLID-STATE IMAGING UNIT, AND ELECTRONIC APPARATUS  
A semiconductor device includes, in order on a substrate, an organic semiconductor layer, an inorganic film, and a protective film. The inorganic film and the protective film each have a...
US20140333505 SEMICONDUCTOR PACKAGE HAVING INTEGRATED ANTENNA PAD  
An apparatus for a semiconductor-package includes a semiconductor device having a radio frequency (RF) input or output, an antenna pad, and a package structured to house the semiconductor device...
US20140326303 SOLAR CELL AND METHOD OF MANUFACTURING THE SAME  
A solar cell (1) according to the invention is formed by stacking a first electrode layer (1C), a semiconductor layer (1A), and a second electrode layer (1D). The first electrode layer (1C) is...
US20140322838 Semiconductor Optoelectronic Device And The Method Of Manufacturing The Same  
A semiconductor optoelectronic device comprises an operating substrate; a semiconductor epitaxial stack unit disposed on the operating substrate comprising a first semiconductor material layer...
US20140319547 METHOD OF PRODUCING A PLURALITY OF OPTOELECTRONIC SEMICONDUCTOR CHIPS, AND OPTOELECTRONIC SEMICONDUCTOR CHIP  
A method of producing a plurality of optoelectronic semiconductor chips includes a) providing a layer composite assembly having a principal plane which delimits the layer composite assembly in a...
US20140264698 Image Sensor Device and Method  
A system and method for blocking heat from reaching an image sensor in a three dimensional stack with a semiconductor device. In an embodiment a heat sink is formed in a back end of line process...
US20140197506 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE  
A semiconductor device includes: an organic substrate; an integrated circuit and a chip part provided on the organic substrate; a molded section including a central portion and a peripheral...
US20140186988 CHEMICAL BATH DEPOSITION APPARATUS, METHOD OF FORMING BUFFER LAYER AND METHOD OF MANUFACTURING PHOTOELECTRIC CONVERSION DEVICE  
A chemical bath deposition apparatus includes: a reaction vessel for containing a reaction solution for chemical bath deposition to form a film on a surface of a substrate; a substrate holding...
US20140151724 Method for Producing an Optoelectronic Semiconductor Component and Such a Semiconductor Component  
A method for producing a semiconductor component is disclosed. A carrier substrate includes a mounting region and an opening, which is formed in the mounting region of the carrier substrate. After...
US20140141560 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE  
Disclosed is a manufacturing method of a semiconductor device including a step of attaching semiconductor wafers together, in which it is prevented that the bonding strength between the attached...
US20140104471 SEMICONDUCTOR MODULE, MOS TYPE SOLID-STATE IMAGE PICKUP DEVICE, CAMERA AND MANUFACTURING METHOD OF CAMERA  
A back-illuminated type MOS (metal-oxide semiconductor) solid-state image pickup device 32 in which micro pads 34, 37 are formed on the wiring layer side and a signal processing chip 33 having...
US20140087496 METHODS AND STRUCTURES FOR FORMING AND PROTECTING THIN FILMS ON SUBSTRATES  
A method for forming of a thin film on a substrate is disclosed. The method includes cleaning a process chamber by flowing a first gas having fluorine. The method also includes coating the process...
US20140070353 SEMICONDUCTOR PACKAGE AND METHOD OF FORMING SEMICONDUCTOR PACKAGE  
A semiconductor package includes a semiconductor substrate which includes a first connection terminal electrically connected to a wiring for signal transfer. The semiconductor package may include...
US20140070348 Methods and Apparatus for Sensor Module  
Methods and apparatus for integrating a CMOS image sensor and an image signal processor (ISP) together using an interposer to form a system in package device module are disclosed. The device...
US20140070346 RADIO-FREQUENCY DEVICE PACKAGE AND METHOD FOR FABRICATING THE SAME  
The invention provides a radio-frequency (RF) device package and a method for fabricating the same. An exemplary embodiment of a radio-frequency (RF) device package includes a base, wherein a...
US20140042488 OPTICAL-SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME  
A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a...
US20140011315 Optical Semiconductor Device Having Pre-Molded Leadframe with Window and Method Therefor  
A semiconductor device is made by providing a semiconductor die having an optically active area, providing a leadframe or pre-molded laminated substrate having a plurality of contact pads and a...
US20140008753 SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND CAMERA  
A method of manufacturing a semiconductor device including a first member including a chip mounting region and a peripheral region, a semiconductor chip mounted in the chip mounting region, and a...
US20140004646 Method Of Making 3D Integration Microelectronic Assembly For Integrated Circuit Devices  
A microelectronic assembly for packaging/encapsulating IC devices, which includes a crystalline substrate handler having opposing first and second surfaces and a cavity formed into the first...
US20130334643 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE  
An image pickup apparatus includes a semiconductor chip including a light receiving section, a frame-like spacer arranged on the semiconductor chip to surround the light receiving section, a...
US20130328147 CHIP PACKAGE AND METHOD FOR FORMING THE SAME  
An embodiment of the invention provides a chip package which includes: a semiconductor substrate having a first surface and a second surface; a device region disposed in the semiconductor...
US20130256824 SOLID-STATE IMAGING DEVICE, METHOD OF MANUFACTURING SOLID-STATE IMAGING DEVICE, APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE  
There is provided a solid-state imaging device including a sensor substrate having a sensor-side semiconductor layer including a pixel region in which a photoelectric conversion section is...
US20130228213 SOLAR CELL MODULE AND METHOD FOR MANUFACTURING THE SAME  
A solar cell module includes a framing member (20) formed of long-side frames (21) and short-side frames (25) that hold a peripheral edge portion of a solar cell panel (10), and a supporting...
US20130221473 PHOTOELECTRIC CONVERSION DEVICE, IMAGE PICKUP SYSTEM AND METHOD OF MANUFACTURING PHOTOELECTRIC CONVERSION DEVICE  
A photoelectric conversion device includes a first semiconductor substrate including a photoelectric conversion unit for generating a signal charge in accordance with an incident light, and a...
US20130221471 BACKSIDE ILLUMINATED IMAGE-SENSOR AND METHOD FOR MANUFACTURING THE SAME  
A method for manufacturing a backside-illuminated image sensor may include forming an insulating layer having a predetermined depth in an inactive region of a front side of a semiconductor...
US20130187192 Optoelectronic Component and Method for the Production Thereof  
An optoelectronic component has a semiconductor chip and a carrier, which is bonded to the semiconductor chip by means of a bonding layer of a metal or a metal alloy. The semiconductor chip...
US20130181313 IMAGE PICKUP UNIT AND METHOD OF MANUFACTURING THE SAME  
An image pickup device and a method of the same are described herein. By way of first example, the image pickup device includes a seal member having a first surface, the first surface of the seal...
US20130122617 METHOD OF FABRICATING OPTOELECTRONIC DEVICES DIRECTLY ATTACHED TO SILICON-BASED INTEGRATED CIRCUITS  
Hybrid integration of vertical cavity surface emitting lasers (VCSELs) and/or other optical device components with silicon-based integrated circuits. A multitude of individual VCSELs or optical...
US20130102105 PRODUCTION METHOD OF SOLAR CELL MODULE  
The present invention provides a production method of a solar cell module, comprising: a first process of mounting a module layered body, which comprises at least a glass member, an encapsulant, a...
US20130092975 Methods of Fabricating Optoelectronic Devices Using Semiconductor-Particle Monolayers and Devices Made Thereby  
Methods of fabricating optoelectronic devices, such as photovoltaic cells and light-emitting devices. In one embodiment, such a method includes providing a substrate, applying a monolayer of...
US20130062504 SEMICONDUCTOR DEVICE, SOLID-STATE IMAGING DEVICE, AND CAMERA SYSTEM  
Disclosed herein is a solid state imaging device including a support substrate; an imaging semiconductor chip having a pixel array disposed on the support substrate; and an image processing...