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US20060292732 Methods of flip-chip image sensor package fabrication  
The present invention provides flip-chip packaging for optically interactive devices such as image sensors and methods of assembly. In a first embodiment of the invention, conductive traces are...
US20060223216 Sensor module structure and method for fabricating the same  
A sensor module structure and a method for fabricating the same are proposed. A chip carrier module plate including a plurality of chip carriers is provided, each chip carrier having a first...
US20150050759 SUBMOUNT, OPTICAL MODULE PROVIDED WITH SUBMOUNT, AND SUBMOUNT MANUFACTURING METHOD  
In manufacturing a submount, a first electrode layer (12) is formed as a layer on the surface of a submount substrate (11); a side surface (122) of the first electrode layer (12) is formed on...
US20140231887 Method and Apparatus for Image Sensor Packaging  
A backside illuminated image sensor comprises a photodiode and a first transistor in a sensor region and located in a first substrate, wherein the first transistor is electrically coupled to the...
US20130292736 THIN-FILM ENCAPSULATION, OPTOELECTRONIC SEMICONDUCTOR BODY COMPRISING A THIN-FILM ENCAPSULATION AND METHOD FOR PRODUCING A THIN-FILM ENCAPSULATION  
A thin-film encapsulation for an optoelectronic semiconductor body includes a PVD layer deposited by a PVD method, and a CVD layer deposited by a CVD method, wherein the CVD layer is applied...
US20120212637 SOLID-STATE IMAGING APPARATUS, METHOD OF MANUFACTURING SAME, AND CAMERA  
A solid-state imaging apparatus, comprising: a semiconductor chip having a principal face including a pixel region; a protruding portion disposed on the principal face to surround the pixel...
US20120107995 PROCESS FOR PRODUCING SOLAR CELL MODULE  
A process for producing a solar cell module, including (a) forming a seal part made of e.g. a double sided adhesive tape on the edge of a surface of a transparent surface material (first surface...
US20110101484 LIGHT-RECEIVING DEVICE AND METHOD OF MANUFACTURING THE SAME  
There is provided a device including at least one light-receiving unit 11, a base substrate 12A provided with the light-receiving unit 11, a transparent base substrate 13A disposed facing the base...
US20100032786 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE DEVICE  
A semiconductor device and a method for manufacturing the device include connecting a second wafer to a first wafer, forming a hard mask layer on and/or over a backside of the second wafer,...
US20080296716 Sensor semiconductor device and manufacturing method thereof  
A sensor semiconductor device and a manufacturing method thereof are disclosed. The method includes: providing a light-permeable carrier board with a plurality of metallic circuits; electrically...
US20080105941 Sensor-type semiconductor package and fabrication  
The invention provides a sensor-type semiconductor package and fabrication method thereof. The fabrication method includes steps of: attaching a sensor chip to a chip carrier; electrically...
US20060005874 Thin film photovoltaic assembly method  
The present invention relates to a method of manufacturing thin film photovoltaic panels (TFPP). Instead of utilizing a conventional EVA based adhesive layer, material, the present invention uses...
US20140374870 IMAGE SENSOR MODULE AND METHOD OF MANUFACTURING THE SAME  
Disclosed herein are an image sensor module and a method of manufacturing the same. The image sensor includes: a base substrate having an image sensor mounted groove including a first groove and a...
US20140353788 SEMICONDUCTOR OPTICAL PACKAGE AND METHOD  
Embodiments of the present disclosure are directed to optical packages having a package body that includes a light protection coating on at least one surface of a transparent material. The light...
US20140249368 METHOD OF PACKAGING IMAGING DEVICE CHIP, METHOD OF ASSEMBLING ENDOSCOPE, IMAGING MODULE, AND ENDOSCOPE  
An endoscope includes: an imaging device chip having a chip connection portion; a tubular housing tube used to a scope tip portion of an endoscope; a substrate to which the imaging device chip is...
US20140080244 METHOD FOR MANUFACTURING OPTICAL IMAGE STABILIZER EMPLOYING SCRATCH DRIVE ACTUATOR  
A method for an optical image stabilizer including: providing an SOI wafer substrate which has a plurality of cells, the SOI wafer substrate including an insulating layer, and first and second...
US20120037951 Optical Device And Method Of Producing The Same  
An optical device of the present invention comprises a light-emitting element or a light-receiving element mounted on a support and a cured silicone material unified into a single article onto the...
US20100248399 METHOD FOR MANUFACTURING HYBRID IMAGE SENSORS  
A method for wafer-to-wafer bonding of a sensor readout circuitry separately fabricated with a silicon substrate to a photodiode device made of non-silicon materials grown from a separate...
US20100229918 SOLAR CELL MODULE and MANUFACTURING METHOD OF SOLAR CELL MODULE  
A manufacturing method of a solar cell module includes a rear-surface-side protection member having a metal layer sandwiched between a plurality of resin layers, the method comprising the steps...
US20080217715 Wafer Level Package Using Silicon Via Contacts for Cmos Image Sensor and Method of Fabricating the Same  
The present invention relates to a wafer level package of a CMOS image sensor using silicon via contacts and a method of manufacturing the same. A wafer level package of a CMOS image sensor...
US20070290244 METHOD FOR PROCESSING A SCRATCHED SURFACE, PARTICULARLY A GLASS PLATE OF A SEMICONDUCTOR WAFER  
A method for processing a scratched surface of a material that is transparent to electromagnetic radiation includes a step of depositing onto the scratched surface at least one layer of a polymer...
US20060275943 Substrate structure for an image sensor package and method for manufacturing the same  
A substrate structure for an image sensor package, the substrate structure includes a bottom base and a frame layer. The bottom base has an upper surface formed with a plurality of first...
US20140209171 SOLAR MODULE AND PROCESS FOR PRODUCTION THEREOF  
The present invention relates to a solar module comprising a first layer, a solar cell arranged above the first layer and a second layer arranged above the solar cell. The first and/or the second...
US20140179036 METHOD AND SYSTEM FOR HETEROGENEOUS SUBSTRATE BONDING FOR PHOTONIC INTEGRATION  
A method of fabricating a composite integrated optical device includes providing a substrate comprising a silicon layer, forming a waveguide in the silicon layer, and forming a layer comprising a...
US20140042607 MICROBUMP SEAL  
A sealable microelectronic device providing mechanical stress endurance which includes a semiconductor substrate and a method of manufacture. A substantially continuous sealing element is...
US20130340809 DYE-SENSITIZED PHOTOVOLTAIC DEVICE AND FABRICATION METHOD FOR THE SAME  
Provided are a dye-sensitized photovoltaic device which can reduce fabrication costs and improve durability, and a fabrication method of such a dye-sensitized photovoltaic device. The...
US20130221468 COMPACT SENSOR MODULE  
A compact sensor module and methods for forming the same are disclosed herein. In some embodiments, a sensor die is mounted on a sensor substrate. A processor die can be mounted on a flexible...
US20130207144 COMPONENT AND METHOD FOR PRODUCING A COMPONENT  
A component with an optoelectronic semiconductor chip fixed to a connection carrier by a bonding layer and embedded in an encapsulation, wherein a decoupling layer is arranged at least in places...
US20130048055 SEALING LAYER FOR THIN FILM PHOTOVOLTAIC DEVICES AND THEIR METHODS OF MANUFACTURE  
A photovoltaic device is generally provided that includes a plurality of thin film layers on a glass substrate. The plurality of thin film layers define a plurality of photovoltaic cells connected...
US20120298199 SOLAR CELL AND MANUFACTURING METHOD THEREOF  
A solar cell includes a cathode component, an anode component, sealant for assembling the cathode component and the anode component to form a closed space, and electrolyte accommodated in the...
US20120273908 STACKED SENSOR PACKAGING STRUCTURE AND METHOD  
Disclosed herein is a stacked chip package including an image sensor including a recess formed on a surface thereof, and a digital signal processor chip that is positioned within the recess. Also...
US20120193689 PIXEL OF A MULTI-STACKED CMOS IMAGE SENSOR AND METHOD OF MANUFACTURING THE SAME  
Provided is a pixel of a multi-stacked complementary metal-oxide semiconductor (CMOS) image sensor and a method of manufacturing the image sensor including a light-receiving unit that may include...
US20120115262 LASER ASSISTED TRANSFER WELDING PROCESS  
A method of printing transferable components includes pressing a stamp including at least one transferable semiconductor component thereon on a target substrate such that the at least one...
US20120104454 OPTICAL DEVICE, PROCESS FOR FABRICATING IT AND AN ELECTRONIC PACKAGE COMPRISING THIS OPTICAL DEVICE  
An optical device includes at least one optical die (4) that is embedded, at least peripherally, in a plate made of an encapsulation material so that the optical die may transmit light, from one...
US20110057284 CMOS IMAGE SENSOR HAVING A CURVED SEMICONDUCTOR CHIP  
A digital image sensor includes a planar substrate with one or more bonding pads on one side and a silicon chip with one or more bonding pads. The silicon chip is attached on the planar substrate...
US20100282317 METHOD AND SYSTEM FOR ASSEMBLING A SOLAR CELL USING A PLURALITY OF PHOTOVOLTAIC REGIONS  
A solar cell device. The device has a housing member. The device also has a lead frame member coupled to the housing member. In a preferred embodiment, the lead frame member has at least one...
US20100279452 IMAGE SENSOR CHIP PACKAGE METHOD  
In an image sensor chip package method, a transparent substrate having an upper surface, a lower surface, and through holes is provided. The through holes pass through the transparent substrate....
US20100255628 SCRIBING METHODS FOR PHOTOVOLTAIC MODULES INCLUDING A MECHANICAL SCRIBE  
Methods for forming photovoltaic modules, and the photovoltaic modules produced by such methods are provided. A back-electrode layer is disposed on an elongated substrate. A first patterning is...
US20100244270 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE  
A semiconductor device includes: a component substrate of a semiconductor device; electrode pads provided on one surface of the component substrate; a support plate material reinforcing the...
US20100237383 Photoelectric Transmitting or Receiving Device and Manufacturing Method Thereof  
A photoelectric transmitting or receiving device and the manufacturing method thereof are provided. The photoelectric transmitting device comprises a substrate, a first conductive layer, a second...
US20100233838 Mounting of Solar Cells on a Flexible Substrate  
According to an embodiment, a method of manufacturing a solar cell includes depositing a sequence of layers of semiconductor material forming at least one solar cell on a first substrate;...
US20100224767 PHOTODETECTOR, METHOD FOR MANUFACTURING THE SAME, AND PHOTODETECTION SYSTEM  
A photodetector used in, for example, an optical pickup device includes: a photodetection unit including a plurality of photodetection elements and provided on a semiconductor chip; a light...
US20100221853 METHOD FOR GENERATING AN ELECTRODE LAYER PATTERN IN AN ORGANIC FUNCTIONAL DEVICE  
A method for generating an electrode layer pattern in an organic functional device (101; 201) comprising a first transparent electrode layer (103; 203), a second electrode layer (104; 204) and an...
US20100200053 PHOTOVOLTAIC DEVICE HAVING A PROTECTIVE LAYER AND METHODS FOR MANUFACTURING THAT DEVICE  
Disclosed herein is a method of making a photovoltaic device having a protective layer affixed to a top surface thereof. The protective layer is comprised of a polymeric material having a...
US20100197069 PROCESS FOR PRODUCING LAYERED MEMBER AND LAYERED MEMBER  
The object is to provide a photoelectric surface member which allows higher quantum efficiency. In order to achieve this object, a photoelectric surface member 1a is a crystalline layer formed by...
US20100193893 Photodiode With Integrated Semiconductor Circuit and Method for the Production Thereof  
A semiconductor circuit in a semiconductor body and a wafer bonding method for connecting the semiconductor circuit to another substrate, in which a diode is realized in a laminar structure. The...
US20100193670 SOLID-STATE IMAGING DEVICE, METHOD OF MANUFACTURING SOLID-STATE IMAGING DEVICE, METHOD OF DRIVING SOLID-STATE IMAGING DEVICE, AND ELECTRONIC APPARATUS  
A solid-state imaging device includes: a substrate; a substrate voltage supply applying a first potential to the substrate during a light receiving period including first and second exposure...
US20100180945 Method and Structure for Fabricating Solar Cells  
A photovoltaic cell device, e.g., solar cell, solar panel, and method of manufacture. The device has an optically transparent substrate comprises a first surface and a second surface. A first...
US20100175747 Multilayer photovoltaic electric energy generating compound and process for its preparation and application  
A multilayer photovoltaic compound to be applied to outer surfaces of any movable and/or stationary support for absorption and conversion of light radiation into electrical energy comprising, in...
US20100164082 MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICE  
The reliability of a photosensor-type semiconductor device is enhanced. The sealing step in a manufacturing process for the semiconductor device is carried out as described below. A molding die...