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US20130199301 Vertical Pressure Sensitive Structure  
Embodiments related to pressure sensitive structures are described and depicted.
US20100308425 MEMS DEVICE AND PROCESS  
A MEMS device comprises a back-plate (7) having an inner portion (7a) and an outer portion (7b), the inner portion (7a) connected to the outer portion (7b) by a sidewall (7c). A raised section or...
US20150129992 MEMS MICROPHONE HAVING DUAL BACK PLATE AND METHOD FOR MANUFACTURING SAME  
Disclosed herein are a microelectromechanical systems (MEMS) microphone with a dual-back plate, and a method of manufacturing the same. The MEMS microphone according to an exemplary embodiment of...
US20150076631 REDUCTION OF CHIPPING DAMAGE TO MEMS STRUCTURE  
A MEMS (microelectromechanical systems) structure comprises a MEMS wafer. A MEMS wafer includes a cap with cavities bonded to a structural layer through a dielectric layer disposed between the cap...
US20110165717 METHOD FOR FORMING MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) PACKAGE  
A method for forming a micro-electro-mechanical systems (MEMS) package includes following steps. A plurality of MEMS units are formed on a substrate, and each of the MEMS units includes at least a...
US20130285164 MEMS DEVICE AND METHOD OF MANUFACTURING THE SAME  
According to one embodiment, a MEMS device comprises a first electrode fixed on a substrate, a second electrode formed above the first electrode to face the first electrode, and vertically...
US20140287548 MEMS Device with Release Aperture  
The present disclosure provides a method of fabricating a micro-electro-mechanical systems (MEMS) device. In an embodiment, a method includes providing a substrate including a first sacrificial...
US20120098074 MEMS DEVICE WITH RELEASE APERTURE  
The present disclosure provides a method of fabricating a micro-electro-mechanical systems (MEMS) device. In an embodiment, a method includes providing a substrate including a first sacrificial...
US20110132088 FLEXURE ASSEMBLIES AND METHODS FOR MANUFACTURING AND USING THE SAME  
In one embodiment, an accelerometer includes a suspension frame, a proof mass, and a plurality of flexures suspending the proof mass from the suspension frame. The flexures allow the proof mass to...
US20120313189 METHOD OF PREVENTING STICTION OF MEMS DEVICES  
A method and apparatus are disclosed for reducing stiction in MEMS devices. The method comprises patterning a CMOS wafer to expose Titanium-Nitride (TiN) surface for a MEMS stop and patterning the...
US20140264661 MEMS Devices and Methods for Forming Same  
Embodiments of the present disclosure include MEMS devices and methods for forming MEMS devices. An embodiment is a method for forming a microelectromechanical system (MEMS) device, the method...
US20110086455 GYROSCOPE  
To provide a compact and high performance gyroscope. A gyroscope (10) comprises an outer frame (11); an inner frame (12) positioned inside the outer frame and supported to be movable in one...
US20120223401 CAVITY PROCESS ETCH UNDERCUT MONITOR  
A MEMS device having a device cavity in a substrate has a cavity etch monitor proximate to the device cavity. An overlying layer including dielectric material is formed over the substrate. A...
US20120156820 COMPOSITE SACRIFICIAL STRUCTURE FOR RELIABLY CREATING A CONTACT GAP IN A MEMS SWITCH  
The present Disclosure provides for fabrication devices and methods for manufacturing a micro-electromechanical system (MEMS) switch on a substrate. The MEMS fabrication device may have a first...
US20140125359 METHODS AND SYSTEMS FOR HUMIDITY AND PRESSURE SENSOR OVERLAY INTEGRATION WITH ELECTRONICS  
Capacitive sensors and MEMS elements that can be implemented directly above silicon CMOS electronics are disclosed. A capacitive based sensor is disposed over a first predetermined portion of a...
US20090236677 Micro Electro-Mechanical Sensor (MEMS) Fabricated with Ribbon Wire Bonds  
A micro electro-mechanical sensor is provided. The micro electro-mechanical sensor includes a substrate, and a conducting plane disposed on the substrate. A conducting via is disposed on the...
US20140151821 MEMS STRUCTURE WITH ADAPTABLE INTER-SUBSTRATE BOND  
A MEMS structure incorporating multiple joined substrates and a method for forming the MEMS structure are disclosed. An exemplary MEMS structure includes a first substrate having a bottom surface...
US20120264249 METHOD FOR ETCHED CAVITY DEVICES  
MEMS devices (40) using etched cavities (42) are desirably formed using multiple etching steps. Preliminary cavities (20) formed by locally anisotropic etching to nearly the final depth have...
US20120228725 Multi-Stage Stopper System for MEMS Devices  
A MEMS sensing system includes a movable mass having at least one contact surface, a stopper system for stopping the movement of the mass, the stopper system having at least one contact surface...
US20140036342 Electrical Routing  
An electronic device may have a MEMS device formed of a first conductive material. A trench may be formed in the MEMS device. A layer of non-conductive material may be formed in the trench. A...
US20150061045 MEMS Device  
A MEMS device includes a first chip and a MEMS chip. The first chip has a mounting surface and includes at least an integrated circuit. The MEMS chip has a main surface on which a first set of...
US20130285160 Microscale Metallic CNT Templated Devices and Related Methods  
A microscale device comprises a patterned forest of vertically grown and aligned carbon nanotubes defining a carbon nanotube forest with the nanotubes having a height defining a thickness of the...
US20140186986 HYBRID MEMS BUMP DESIGN TO PREVENT IN-PROCESS AND IN-USE STICTION  
A micro-electro-mechanical systems (MEMS) device and method for forming a MEMS device is provided. A proof mass is suspended a distance above a surface of a substrate by a fulcrum. A pair of...
US20140035072 HYBRID MEMS BUMP DESIGN TO PREVENT IN-PROCESS AND IN-USE STICTION  
A micro-electro-mechanical systems (MEMS) device and method for forming a MEMS device is provided. A proof mass is suspended a distance above a surface of a substrate by a fulcrum. A pair of...
US20100279451 DIRECT CONTACT HEAT CONTROL OF MICRO STRUCTURES  
A method of providing thermal tuning of microelectromechanical structures (MEMS) that are compatible with silicon CMOS electronics is disclosed. A heater is provided integrated with the MEMS for...
US20130229087 Vibration Driven Power Generation Element and Method of Manufacture Thereof  
A vibration driven power generation element according to the present invention includes: a three dimensionally shaped movable comb tooth electrode comprising a plurality of comb teeth of which...
US20130168782 MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) STRUCTURES AND DESIGN STRUCTURES  
Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are disclosed. The method includes forming at least one fixed electrode on a substrate. The method...
US20130285168 MEMS INERTIAL SENSOR AND METHOD FOR MANUFACTURING THE SAME  
A MEMS inertial sensor and a method for manufacturing the same are provided. The method includes: depositing a first carbon layer on a semiconductor substrate; patterning the first carbon layer to...
US20140026670 METHOD OF COMPENSATING FOR EFFECTS OF MECHANICAL STRESSES IN A MICROCIRCUIT  
A method for manufacturing an integrated circuit includes forming in a substrate a measuring circuit sensitive to mechanical stresses and configured to supply a measurement signal representative...
US20140374850 Apparatus and Method for Shielding and Biasing in MEMS Devices Encapsulated by Active Circuitry  
One or more conductive shielding plates are formed in a standard ASIC wafer top metal layer, e.g., for blocking cross-talk from MEMS device structure(s) on the MEMS wafer to circuitry on the ASIC...
US20140103460 MEMS Device and Method of Manufacturing a MEMS Device  
A method for manufacturing a MEMS device is disclosed. Moreover a MEMS device and a module including a MEMS device are disclosed. An embodiment includes a method for manufacturing MEMS devices...
US20110001198 MEMS DEVICE AND INTERPOSER AND METHOD FOR INTEGRATING MEMS DEVICE AND INTERPOSER  
A method for producing Microelectromechanical Systems (MEMS) and related devices using Silicon-On-Insulator (SOI) wafer includes providing an SOI wafer, performing a mesa etch to at least...
US20120276674 Three-Axis Accelerometers and Fabrication Methods  
MEMS accelerometers have a substrate, and a proof mass portion thereof which is separated from the substrate surrounding it by a gap. An electrically-conductive anchor is coupled to the proof...
US20100304517 MEMS DEVICE AND FABRICATION METHOD OF THE SAME  
A microelectromechanical systems (MEMS) device includes a frame, an actuator formed on the same layer as the frame and connected to the frame to be capable of performing a relative motion with...
US20150054097 Method for Manufacturing a MEMS Device and MEMS Device  
A method for manufacturing a MEMS device includes providing a cavity within a layer adjacent to a sacrificial layer. The cavity extends to the sacrificial layer and includes a capillary slot...
US20110215428 MEMS STRUCTURE AND MANUFACTURING METHOD THEREOF  
In a MEMS structure, a first trench which penetrates the first layer, the second layer and the third layer is formed, and a second trench which penetrates the fifth layer, the forth layer and the...
US20140264655 SURFACE ROUGHENING TO REDUCE ADHESION IN AN INTEGRATED MEMS DEVICE  
In an integrated MEMS device, moving silicon parts with smooth surfaces can stick together if they come into contact. By roughening at least one smooth surface, the effective area of contact, and...
US20110311081 MEMS MICROPHONE AND MANUFACTURING METHOD THEREOF  
A micro electro mechanical system (MEMS) microphone capable of preventing a membrane and a back plate from being contacting each other by an overvoltage, an external shock, and the like, and a...
US20110027930 Low Temperature Wafer Level Processing for MEMS Devices  
Microelectromechanical systems (MEMS) are small integrated devices or systems that combine electrical and mechanical components. It would be beneficial for such MEMS devices to be integrated with...
US20110067495 MICROMACHINED ACCELEROMETER WITH MONOLITHIC ELECTRODES AND METHOD OF MAKING THE SAME  
A capacitive accelerometer having one or more micromachined acceleration sensor assembly is disclosed. The acceleration sensor assembly comprises a spring-mass-support structure, a top cap and a...
US20120068278 PULL UP ELECTRODE AND WAFFLE TYPE MICROSTRUCTURE  
The present invention generally relates to MEMS devices and methods for their manufacture. The cantilever of the MEMS device may have a waffle-type microstructure. The waffle-type microstructure...
US20120091546 Microphone  
A microphone comprises a substrate (20), a microphone membrane (10) defining an acoustic input surface and a backplate (11) supported with respect to the membrane with a fixed spacing between the...
US20130127295 PIEZOELECTRIC MICRO POWER GENERATOR AND FABRICATION METHOD THEREOF  
Disclosed are a piezoelectric micro power generator which converts mechanical energy to electric energy to produce electric power and a fabrication method thereof. The piezoelectric micro power...
US20140287547 INHIBITING PROPAGATION OF SURFACE CRACKS IN A MEMS DEVICE  
A microelectromechanical systems (MEMS) device (58) includes a structural layer (78) having a top surface (86). The top surface (86) includes surface regions (92, 94) that are generally parallel...
US20110281389 Micromachine and Method for Manufacturing the Same  
A structure which prevents thinning and disconnection of a wiring is provided, in a micromachine (MEMS structure body) formed with a surface micromachining technology. A wiring (upper auxiliary...
US20140252422 CAVITY STRUCTURES FOR MEMS DEVICES  
Embodiments relate to MEMS devices, particularly MEMS devices integrated with related electrical devices on a single wafer. Embodiments utilize a modular process flow concept as part of a...
US20120211805 CAVITY STRUCTURES FOR MEMS DEVICES  
Embodiments relate to MEMS devices, particularly MEMS devices integrated with related electrical devices on a single wafer. Embodiments utilize a modular process flow concept as part of a...
US20100317138 METHOD FOR FABRICATING MEMS STRUCTURE  
A method for fabricating a MEMS is described as follows. A substrate is provided, including a circuit region and an MEMS region separated from each other. A first metal interconnection structure...
US20140167189 REDUCING MEMS STICTION BY DEPOSITION OF NANOCLUSTERS  
A mechanism for reducing stiction in a MEMS device by decreasing surface area between two surfaces that can come into close contact is provided. Reduction in contact surface area is achieved by...
US20140103466 RESISTANT STRAIN GAUGE  
The invention relates to measurement and control of mechanical values, in particular, to control of stress conditions of various structures and manufacturing sensors of resistant strain gauge type...