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US20090283844 |
PROCESS OF FABRICATING MICROFLUIDIC DEVICE CHIPS AND CHIPS FORMED THEREBY
A process for fabricating multiple microfluidic device chips. The process includes fabricating multiple micromachined tubes in a semiconductor device wafer. The tubes are fabricated so that each...
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US20090278628 |
INTEGRATED SINGLE-CRYSTAL MEMS DEVICE
Method of manufacturing a MEMS device integrated in a silicon substrate. In parallel to the manufacturing of the MEMS device passive components as trench capacitors with a high capacitance density...
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US20090267167 |
DUAL-FACE FLUID COMPONENTS
A fluid component includes at least one substrate of a material that can be etched and an etch stop layer for said material means for detecting the properties of a fluid and/or for activating said...
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US20090253261 |
Silicon Wafer Having Through-Wafer Vias With A Predetermined Geometric Shape
A method of manufacturing a semiconductor device includes providing a semiconductor substrate having first and second main surfaces opposite to each other, forming in the semiconductor substrate at...
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US20090215213 |
Microelectromechanical device having a common ground plane and method for making aspects thereof
The present invention relates to MEM switches. More specifically, the present invention relates to a system and method for making MEM switches having a common ground plane. One method for making...
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US20090215156 |
Method for Fabricating Nanogap and Nanogap Sensor
The present invention relates to a method of fabricating a nanogap and a nanogap sensor, and to a nanogap and a nanogap sensor fabricated using the method. The present invention relates to a method...
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US20090186440 |
METHODS, APPARATUS, AND ROLLERS FOR CROSS-WEB FORMING OF OPTOELECTRONIC DEVICES
Apparatus and methods for forming optoelectronic devices such as an array of light emitting diodes or photovoltaic cells in one embodiment a roll-to-roll process in which a uniquely configured...
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US20090152654 |
MICROMECHANICAL SYSTEM
A micromechanical system includes a substrate, a first planar electrode, a second planar electrode, and a third planar electrode. The second planar electrode is movably positioned at a distance...
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US20090065881 |
Electric Field Concentration Minimization for MEMS
A method and resulting device for reducing an electrical field at an isolation gap in a capacitive actuator includes providing a bottom electrode layer and forming a pattern in the bottom electrode...
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US20090026558 |
SEMICONDUCTOR DEVICE HAVING A SENSOR CHIP, AND METHOD FOR PRODUCING THE SAME
A semiconductor sensor device and method is disclosed. In one embodiment, the semiconductor device includes a cavity housing and a sensor chip. In one embodiment, the cavity housing has an opening...
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US20080315331 |
ULTRASOUND SYSTEM WITH THROUGH VIA INTERCONNECT STRUCTURE
An ultrasound monitoring system. In one embodiment, an array of transducer cells is formed along a first plane and an integrated circuit structure, formed along a second plane parallel to the first...
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US20080296437 |
Method and Device to Generate a Transverse Casimir Force for Propulsion, Guidance and Maneuvering of a Space Vehicle
Method and device for directly generating a transverse Casimir force comprising a technique for fabricating a microstructure array of non-parallel conducting plates held in place by an insulating...
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US20080283728 |
Solid-state image pickup device and a method of manufacturing the same, and image pickup apparatus
Disclosed herein is a solid-state image pickup device, including: a first pixel for receiving a visible light of an incident light to subject the visible light to photoelectric conversion; a second...
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US20080233672 |
METHOD OF INTEGRATING MEMS STRUCTURES AND CMOS STRUCTURES USING OXIDE FUSION BONDING
A method to fabricate a device including a micro-electro-mechanical system structure and a monolithic integrated circuit comprises using a first wafer as a first substrate, fabricating the...
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US20080231931 |
MEMS CAVITY-COATING LAYERS AND METHODS
Devices, methods, and systems comprising a MEMS device, for example, an interferometric modulator, that comprises a cavity in which a layer coats multiple surfaces. The layer is conformal or...
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US20080220557 |
SENSOR MANUFACTURE WITH DATA STORAGE
A biometric sensing device includes a sensor manufacture for sensing a biometric stimulus. The sensor manufacture is also configured to persistently store data electronically, such as security data.
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US20080213933 |
METHODS OF FABRICATING A LARGE AREA TRANSDUCER ARRAY
Methods of fabricating a tiled transducer array are disclosed. Embodiments of the methods include fabricating a wafer comprising a plurality of transducers, dicing the wafer to form individual...
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US20080188027 |
Semiconductor device having impurity-doped resistor element
Resistor elements are formed by doping impurity into a single crystal film formed on a substrate such as a silicon-on-insulator substrate. A semiconductor device having such resistor elements is...
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US20080188024 |
METHOD OF FABRICATING MICRO MECHANICAL MOVING MEMBER AND METAL INTERCONNECTS THEREOF
A method of fabricating micro mechanical moving member and metal interconnects thereof. A first metal interconnect pattern and a second metal interconnect pattern disposed thereon are formed on a...
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US20080176356 |
DIODE ENERGY CONVERTER FOR CHEMICAL KINETIC ELECTRON ENERGY TRANSFER
An improved diode energy converter for chemical kinetic electron energy transfer is formed using nanostructures and includes identifiable regions associated with chemical reactions isolated...
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US20080176355 |
DIODE ENERGY CONVERTER FOR CHEMICAL KINETIC ELECTRON ENERGY TRANSFER
An improved diode energy converter for chemical kinetic electron energy transfer is formed using nanostructures and includes identifiable regions associated with chemical reactions isolated...
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US20080176354 |
Method of uniform current distribution using current modified layer
An electric device has a p-n diode, where the p-n diode is covered with a current modified layer (CML). With a resistance distribution of the CML, a current is decreased toward all directions from...
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US20080157787 |
SENSITIVITY CAPACITIVE SENSOR
A method of creating an improved sensitivity capacitive fingerprint sensor involves forming vias from a first side of a sensor chip having an array of capacitive sensors, making the vias...
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US20080157354 |
Multiple stacked nanostructure arrays and methods for making the same
A method of fabricating a stacked nanostructure array includes preparing a substrate; forming a bottom electrode directly on the substrate; growing a first nanostructure array directly on the...
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US20080135959 |
SEMICONDUCTOR COMPONENT COMPRISING MAGNETIC FIELD SENSOR
The invention relates to a semiconductor component ( 100 ) comprising a semiconductor chip ( 10 ) configured as a wafer level package, a magnetic field sensor ( 11 ) being integrated into said...
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US20080128838 |
SENSOR MODULE AND METHOD OF MANUFACTURING SAME
The embodiments herein relate to sensor modules having sensor chips with a sensing region on a face thereof, and methods for their manufacture.
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US20080113465 |
Angular rate sensor and method of manufacturing the same
An angular rate sensor 100 comprises a first structure 110 which includes a fixed portion 111 having an opening 114 , a displacing portion 112 placed in the opening 114 , and a connecting...
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US20080113464 |
Asymmetric chalcogenide device
A semiconductor device with S-type negative differential resistance (e.g., phase change memory or threshold switch) may be formed with an asymmetric i-v curve. The asymmetric nature may be achieved...
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US20080112035 |
METHODS AND DEVICES FOR INHIBITING TILTING OF A MOVABLE ELEMENT IN A MEMS DEVICE
Interferometric modulators having a separable modulator architecture are disclosed having a reflective layer suspended from a flexible layer over a cavity. The interferometric modulators have one...
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US20080108163 |
Microelectromechanical system device and method for preparing the same for subsequent processing
A method for preparing a microelectomechanical system (MEMS) device for subsequent processing is disclosed. The method includes establishing an anti-stiction material on exposed surfaces of the...
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US20080090319 |
Infrared photodiodes and sensor arrays with improved passivation layers and methods of manufacture
InSb infrared photodiodes and sensor arrays with improved passivation layers and methods for making same are disclosed. In the method, a passivation layer of AlInSb is deposited on an n-type InSb...
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US20080090318 |
Method and apparatus for forming a photodiode
Embodiments of the invention provide a method and an apparatus for forming a photodiode. One embodiment provides a thin dielectric layer sandwiched between two metallic plates (electrodes), one or...
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US20080087914 |
Extreme Ultraviolet (EUV) Detectors Based Upon Aluminum Nitride (ALN) Wide Bandgap Semiconductors
Disclosed are detector devices and related methods. In an Al EUV detector a low temperature AlN layer is deposed above an AlN buffer layer. In one embodiment, the low temperature AlN layer is...
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US20080081391 |
MEMS Device with Roughened Surface and Method of Producing the Same
A method of producing a MEMS device provides a MEMS apparatus having released structure. The MEMS apparatus is formed at least in part from an SOI wafer having a first layer, a second layer spaced...
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US20080070339 |
Method for one-way coupling an input signal to an integrated circuit
A method for one-way coupling an input signal to an integrated circuit on a semiconductor chip with the integrated circuit electrically isolated from the input signal comprises forming a MOS...
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US20080070338 |
MICRO-ELECTROMECHANICAL SYSTEM (MEMS) BASED CURRENT & MAGNETIC FIELD SENSOR HAVING CAPACITIVE SENSE COMPONENTS
A micro-electromechanical system (MEMS) based current & magnetic field sensor includes a MEMS-based magnetic field sensing component having a capacitive magneto-MEMS component, a compensator and an...
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US20080067499 |
Silicon/germanium superlattice thermal sensor
A silicon/germanium (SiGe) superlattice thermal sensor is provided with a corresponding fabrication method. The method forms an active CMOS device in a first Si substrate, and a SiGe superlattice...
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US20080048211 |
Trench isolated capacitive micromachined ultrasonic transducer arrays with a supporting frame
A one or two-dimensional capacitive micro-machined ultrasonic transducer (CMUT) array with supporting frame is provided. The CMUT array has at least three array elements deposited on a conductive...
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US20080038859 |
METHOD FOR FORMING MICROMACHINED STRUCTURE
The invention provides a method of fabricating a micromachined structure, and in particular to a method of forming a micro-electro-mechanical system (MEMS) structure. A thin silicon cantilevered or...
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US20080020504 |
Sensors for detecting NOx in a gas and methods for fabricating the same
Nitrogen oxide sensors and methods for fabricating them are provided. According to an exemplary embodiment of the present invention, the method comprises providing an electrically insulating...
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US20080017946 |
Back-lit image sensor with a uniform substrate temperature
An image sensor including photosensitive cells including photodiodes and at least one additional circuit with a significant heat dissipation including transistors. The image sensor is made in...
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US20080006098 |
Sensor device and a method for its manufacturing
A sensor device with a semiconductor substrate with at least one deformable region with a sensing element thereon that generates an output signal related to a force applied to the deformable region...
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