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US20100001294 |
LED module having a heat sink
The invention relates to an LED module ( 1 ) comprising at least one light-emitting diode (LED) ( 3 ) and at least one heat sink ( 2 ) for active cooling, having at least one coolant channel ( 6 )...
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US20100001310 |
LIGHT EMITTING DIODE AND MANUFACTURING METHOD THEREOF
An exemplary light emitting diode (LED) includes a substrate, a LED chip and an encapsulation unit. The encapsulation unit includes a first encapsulation material located over the LED chip and a...
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US20090323748 |
Photoelectric conversion device, photoelectric conversion module and method of manufacturing photoelectric conversion device
A photoelectric conversion device includes a circuit substrate that has a first concave portion having a light transmission hole, a first metal interconnection that is formed from a bottom of the...
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US20090321749 |
Light Emitting Device and Method of Manufacturing a Light Emitting Device
A light emitting device comprising a heat sink, a dielectric layer arranged on the heat sink, a heat conductive layer arranged on the dielectric layer, an undercoating arranged on at least a part...
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US20090321760 |
FABRICATION OF COMPACT OPTO-ELECTRONIC COMPONENT PACKAGES
A wafer-level method of fabricating an opto-electronic component package, in which the opto-electronic component is mounted to a semiconductor wafer having first and second surfaces on opposite...
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US20090321774 |
OPTICAL SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
An optical semiconductor device can have a first lead for an optical semiconductor chip to be mounted on and a second lead for joining to a wire extending from the optical semiconductor chip. The...
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US20090321726 |
ENCAPSULATION FOR ORGANIC OPTOELECTRONIC DEVICES
An organic optoelectronic device includes a substrate, an anode, a cathode, an active region comprising an organic material, an encapsulation that isolates the active region from an ambient...
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US20090321778 |
FLIP-CHIP LIGHT EMITTING DIODE AND METHOD FOR FABRICATING THE SAME
A flip-chip light emitting diode includes a substrate, an LED chip and a plurality of conductive bumps. The substrate has at least one recess defined in the surface of the substrate, and at least a...
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US20090315062 |
Light Emitting Diode Submount With High Thermal Conductivity For High Power Operation
This invention relates to the thermal management, extraction of light, and cost effectiveness of Light Emitting Diode, or LED, electrical circuits. An integrated circuit LED submount is described,...
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US20090315061 |
METHODS OF ASSEMBLY FOR A SEMICONDUCTOR LIGHT EMITTING DEVICE PACKAGE
Methods of assembly for a semiconductor light emitting device package may include positioning a submount on a mounting substrate with a flux material therebetween and at least substantially free of...
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US20090309121 |
Light emitting apparatus
In a light-emitting apparatus using a silicone resin as a sealant of its light-emitting element, it is intended to prevent discoloration of its lead frame. A light-emitting element fixed to a lead...
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US20090302342 |
Semiconductor Light-Emitting Device and Manufacturing Method
A semiconductor light-emitting device and a method for manufacturing the same can include a mixture resin encapsulating an LED chip in order to emit various colored lights, and can also include a...
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US20090305443 |
METHOD OF MAKING LIGHT EMITTING DIODES
A method of making a plurality of light emitting diodes simultaneously includes steps of: a) providing a wafer and a first bonding layer, and adhering the first bonding layer to a bottom side of...
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US20090302345 |
LED LAMP MODULE AND FABRICATION METHOD THEREOF
An LED lamp module is disclosed. An LED die is directly mounted on a heat sink element and then the LED chip is electrically connected to a circuit substrate or a circuit layer disposed over the...
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US20090302747 |
ORGANIC LIGHT EMITTING DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
Provided is a method of manufacturing an organic light emitting display device in which a laser beam is used. The method includes forming an organic light emitting unit on a substrate; forming a...
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US20090294795 |
LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME
A light emitting device includes a light emitting layer made of semiconductor; an upper electrode including a bonding electrode capable of connecting a wire thereto and a thin-wire electrode...
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US20090295286 |
Organic Light Emittig Diode Unit and Method for Manufacturing the Same
The present invention provides an organic light emitting diode unit including: a bar-shaped organic light emitting diode body; a glass protective tube having at least one opening and housing the...
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US20090294793 |
LED PACKAGE AND METHOD OF MANUFACTURING THE SAME
Provided is an LED package including a heat radiating portion that is composed of two or more metal layers and has a cavity formed therein; a first lead that extends from one side of the heat...
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US20090289268 |
LIGHT EMITTING APPARATUS AND SEMICONDUCTOR APPARATUS, AND METHOD FOR MANUFACTURING THE SAME
A semiconductor apparatus and a light emitting apparatus which are capable of efficiently dissipating the heat generated by a semiconductor device and have high reliability, and a method for...
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US20090291516 |
Peeling Method and Method of Manufacturing Semiconductor Device
There is provided a peeling method capable of preventing a damage to a layer to be peeled. Thus, not only a layer to be peeled having a small area but also a layer to be peeled having a large area...
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US20090289275 |
Light Emitting Device, Package, Light Emitting Device Manufacturing Method, Package Manufacturing Method and Package Manufacturing Die
Provided is a light emitting device wherein a resin molded body having a circular or an oval recessed section at the center suppresses generation of cracks. A light emitting device ( 1 ) is...
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US20090289274 |
PACKAGE STRUCTURE OF LIGHT EMITTING DIODE AND METHOD OF MANUFACTURING THE SAME
Provided are a LED package structure and a method of manufacturing the same. The LED package structure includes first and second plate-shaped auxiliary support pieces; a heat-dissipating portion...
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US20090289318 |
ELECTRONICS DEVICE PACKAGE AND FABRICATION METHOD THEREOF
Embodiments provide an electronic device package and a method for fabricating thereof. A semiconductor chip has a substrate. A supporting brick is separated from the substrate by a certain...
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US20090290273 |
LIGHT-EMITTING DIODE PACKAGE HAVING ELECTROSTATIC DISCHARGE PROTECTION FUNCTION AND METHOD OF FABRICATING THE SAME
A light-emitting diode (LED) package having electrostatic discharge (ESD) protection function and a method of fabricating the same adopt a composite substrate to prepare an embedded diode and an...
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US20090283793 |
NITRIDE SEMICONDUCTOR LIGHT-EMITTING DEVICE AND PRODUCTION METHOD THEREOF
Disclosed is a semiconductor device which is improved in output power efficiency since reflection by the substrate is reduced. This semiconductor device is also excellent in strength...
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US20090283788 |
Light-Emitting Diode Chip Package Body and Method for Manufacturing Same
A light-emitting diode chip package body with an excellent heat dissipation performance and a low manufacturing cost, and a packaging method of the same are disclosed. A LED chip package body is...
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US20090278152 |
LIGHT EMITTING DIODE AND PACKAGE METHOD THEREOF
A light emitting diode comprises a sheet-like package body, a barricade, a light emitting diode die, and fluorescent filler. The sheet-like package body has a die-bonding region. The barricade is a...
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US20090278157 |
Method for the production of a semiconductor component comprising a planar contact, and semiconductor component
In a method for producing a semiconductor component, in particular a semiconductor structure having a surface structure or topography which is produced by means of electronic components ( 2 ) on a...
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US20090273004 |
CHIP PACKAGE STRUCTURE AND METHOD OF MAKING THE SAME
A chip package structure and method thereof uses a semiconductor substrate as a package substrate, which improve heat dissipation. Also, the chip package structure is incorporated with a...
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US20090273000 |
Light emitting device and method of manufacturing same
A light emitting device according to the present invention comprises board 2 having electrode 3 b formed on the surface thereof, light emitting element 1 mounted on the surface of board 2, ...
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US20090275153 |
METHOD OF PRODUCTION OF SEMICONDUCTOR LIGHT EMISSION DEVICE AND METHOD OF PRODUCTION OF LIGHT EMISSION APPARATUS
A method of production of semiconductor light emission devices for forming stripes of two multilayers having different emission wavelengths on a substrate, including the steps of: depositing a...
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US20090273005 |
OPTO-ELECTRONIC PACKAGE STRUCTURE HAVING SILICON-SUBSTRATE AND METHOD OF FORMING THE SAME
Disclosed herein is a structure of opto-electronic package having a Si-substrate. The Si-substrates are manufactured in batch utilizing the micro-electromechanical processes or the semiconductor...
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US20090267102 |
LIGHT EMITTING DIODE PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
A light emitting diode (LED) package structure includes a carrier, a first protrusion, a LED chip, and an adhesion layer. The first protrusion is disposed on the carrier and has a first opening to...
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US20090267504 |
ORGANIC LIGHT EMITTING APPARATUS AND METHOD OF PRODUCING THE SAME
Provided are an organic light emitting apparatus for use in, for example, a flat device display, and a method of producing the apparatus. The organic light emitting apparatus has sides formed by...
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US20090267108 |
LIGHT EMITTING DIODE CHIP PACKAGE AND METHOD OF MAKING THE SAME
The LED chip package of the present invention uses a semiconductor substrate as package substrate, which improves heat dissipation. Also, the LED chip package is incorporated with a planarization...
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US20090261341 |
ORGANIC LIGHT EMITTING DISPLAY AND METHOD OF MANUFACTURING THE SAME
An organic light emitting display includes a pixel part adapted to generate a light and a metal oxide layer. The metal oxide layer is formed by oxidation of a metal layer combined with oxygen of...
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US20090261374 |
HIGH OUTPUT POWER LIGHT EMITTING DEVICE AND PACKAGED USED THEREFOR
An object of the present invention is to provide a light emitting device that has high output power and long service life where a package is suppressed from discoloring due to heat generation. The...
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US20090258449 |
FABRICATING METHOD OF LIGHT EMITTING DIODE PACKAGE
A method of fabricating a light emitting diode package structure is provided. First, a first circuit substrate having a first surface and a corresponding second surface and a second circuit...
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US20090250718 |
LIGHT EMITTING DIODE AND METHOD FOR PRODUCING THE SAME
A method for producing an LED includes steps of: providing a base ( 22 ), a chip body ( 21 ) and a die ( 40 ), wherein the base has a concave depression ( 23 ) defined therein and the die has a...
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US20090242916 |
Method for packaging a light emitting device
A method for packaging a light emitting element includes a step of providing a carrier formed with an anode electrode and a cathode electrode, a step of providing a light emitting object by...
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US20090242927 |
SEMICONDUCTOR LIGHT EMITTING MODULE AND METHOD FOR MANUFACTURING THE SAME
A light emitting module includes a semiconductor light source, a first lead with a bonding pad to which the light source is attached, and a second lead spaced from the first lead in a first...
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US20090246897 |
LED chip package structure and method for manufacturing the same
An LED chip package structure includes a substrate unit, a light-emitting unit, and a colloid unit. The substrate unit has a substrate body, and a positive electrode trace and a negative electrode...
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US20090242923 |
Hermetically Sealed Device with Transparent Window and Method of Manufacturing Same
The invention is a hermetically sealed semiconductor die package wherein a surface of the die can be positioned very close to the hermetic package and a method of fabricating such a package. The...
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US20090242924 |
LIGHT EMITTING DIODES WITH SMOOTH SURFACE FOR REFLECTIVE ELECTRODE
A light emitting diode comprising an epitaxial layer structure, a first electrode, and a second electrode. The first and second electrodes are separately disposed on the epitaxial layer structure,...
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US20090238232 |
Method of Protecting Semiconductor Chips from Mechanical and ESD Damage During Handling
A method and apparatus are provided for protecting a semiconductor device from damage. The method may include the steps of providing an active semiconductor device on a surface of a semiconductor...
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US20090239320 |
SEMICONDUCTOR DEVICE AND PEELING OFF METHOD AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
The present invention provides a peeling off method without giving damage to the peeled off layer, and aims at being capable of peeling off not only a peeled off layer having a small area but also...
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US20090236619 |
Light Emitting Diodes with Light Filters
LED chips including an LED layer or layers capable of emitting light of a first wavelength, a light conversion layer on the LED capable of converting at least a portion of the light of a first...
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US20090239317 |
Method and jig structure for positioning bare dice
A method and jig structure for positioning bare dice is disclosed. The jig structure for positioning at least one bare dice includes a trap having at least one positioning groove wherein the depth...
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US20090230425 |
WATER-BARRIER ENCAPSULATION METHOD
The present invention generally relates to organic light emitting diode (OLED) structures and methods for their manufacture. To increase the lifetime of an OLED structure, an encapsulating layer...
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US20090230417 |
LIGHT EMITTING DIODE PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
The present invention discloses a light emitting diode (LED) package structure, which includes a carrier, a first protrusion, a LED chip, and an adhesion layer. The first protrusion is disposed on...
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