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US20090315947 |
PRINTING HEAD AND METHOD OF MANUFACTURING PRINTING HEAD
A printing head is provided by which, even when the stress is caused by a connecting section between a printing element substrate-side electrode terminal and a lead when the connecting section is...
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US20090275151 |
Method Of Forming Printhead By Removing Sacrificial Material Through Nozzle Apertures
A method of fabricating an inkjet printhead by forming a plurality of actuators on a monolithic substrate, covering the actuators with a sacrificial material, covering the sacrificial material with...
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US20090256891 |
HEATER CHIPS WITH SILICON DIE BONDED ON SILICON SUBSTRATE AND METHODS OF FABRICATING THE HEATER CHIPS
A heater chip has a substrate and at least one die, made of silicon, and a bond non-adhesively attaching them. The substrate, thick enough to resist bowing, has ink supply vias from back to front...
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US20090229126 |
METHOD FOR MANUFACTURING LIQUID JET HEAD
A method for manufacturing a liquid jet head is provided, which includes: a preparation step of preparing a substrate array which is provided with a first substrate having formed therein a first...
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US20090233386 |
METHOD FOR FORMING AN INK JETTING DEVICE
A method for forming an ink jetting device includes providing a silicon substrate having a first surface having formed thereon a plurality of electrical heater elements to form a first upper...
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US20090201343 |
LIQUID EJECTION HEAD AND MANUFACTURING METHOD OF LIQUID EJECTION HEAD
The present invention provides a liquid ejection head for which the peeling of an orifice plate from a substrate seldom occurs, even in a structure such that the walls that define each energy...
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US20090195578 |
INK CARTRIDGE, IMAGE FORMING APPARATUS, AND METHOD TO MANUFACTURE INK CARTRIDGE
An ink cartridge to prevent image degradation due to a misalignment of nozzles in a transfer direction of a printing medium and a transverse direction includes a print head substrate, a first head...
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US20090176322 |
METHOD FOR FABRICATING AN INK JETTING DEVICE
A method for forming an ink jetting device includes providing a silicon chip including a silicon substrate having a first surface and a second surface opposite to the first surface, the first...
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US20090153600 |
SYSTEM AND METHOD FOR DETECTING FLUID EJECTION VOLUME
A fluid ejection device includes an actuator, moveable to actuate a fluid pump, an optical sensor, a flag, affixed to the actuator and positioned to block the optical sensor with motion of the...
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US20090141087 |
Thermal Inkjet Printhead Chip Structure and Manufacturing Method for the same
A thermal inkjet printhead chip structure includes a substrate, an oxide layer formed on the substrate, at least one driver circuitry each including a source, a drain and a gate and formed on the...
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US20090141083 |
INKJET PRINTHEAD AND METHOD OF MANUFACTURING THE SAME
An inkjet printhead and a method of manufacturing the same. The inkjet printhead includes a silicon on insulator (SOI) substrate including a lower silicon substrate, a middle insulating layer, an...
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US20090135222 |
METHOD OF MAKING AN INKJET PRINTHEAD
A method of making an inkjet printhead comprises forming at least one ink ejection element 18 on a surface 14 of a substrate 10 and forming a slot 12 in the substrate to provide fluid...
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US20090124029 |
METHOD OF FABRICATING RESISTOR AND PROXIMATE DRIVE TRANSISTOR FOR A PRINTHEAD
A method of fabricating a resistor-drive transistor architecture for a printhead of a printer, by depositing printer communication and drive electronics on the printhead. The drive electronics are...
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US20090102895 |
PIEZOELECTRIC INKJET PRINTHEAD AND METHOD OF MANUFACTURING THE SAME
Provided are a piezoelectric inkjet printhead and a method of manufacturing the same. The piezoelectric inkjet printhead includes first and second single-crystalline silicon substrates. An ink flow...
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US20090091600 |
MICRO-FLUID EJECTION HEAD AND STRESS RELIEVED ORIFICE PLATE THEREFOR
A micro-fluid ejection head and methods for improving the fabrication and operation of the micro-fluid ejection head. The ejection head includes a photoimaged thick film layer attached to a...
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US20090073228 |
THROUGH-HOLE FORMING METHOD, INKJET HEAD, AND SILICON SUBSTRATE
A through-hole forming method includes steps of forming a first impurity region ( 102 a ) around a region where a through-hole is to be formed in the first surface of a silicon substrate ( 101 ),...
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US20090033695 |
Printheads
Embodiments of a printhead are disclosed.
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US20090021558 |
Liquid discharge apparatus and method for producing liquid discharge apparatus
There is provided a liquid discharge apparatus which includes a liquid channel which connects a discharge port and a pressure chamber; a piezoelectric layer one surface of which facing the pressure...
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US20080318352 |
METHOD OF BONDING MEMS INTEGRATED CIRCUITS
A method of bonding an integrated circuit to a substrate is provided. The integrated circuit is one of a plurality of integrated circuits, each having a respective frontside releasably attached to...
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US20080271300 |
METHOD OF MANUFACTURING ORIENTATION FILM AND METHOD OF MANUFACTURING LIQUID DISCHARGE HEAD
A method of manufacturing an orientation film which method is suitable for manufacturing an orientation film containing a ceramic at low cost. The method includes the steps of: (a) forming a...
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US20080266360 |
Ink-jet head and manufacturing method thereof
An ink-jet head and a method of manufacturing the ink-jet head are disclosed. The ink-jet head may include: an upper substrate, formed by processing a chamber in a silicon substrate; a middle...
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US20080259125 |
MICROFLUIDIC DEVICE AND A FLUID EJECTION DEVICE INCORPORATING THE SAME
A microfluidic device includes first and second glass substrates bonded together. The first glass substrate has first and second opposed surfaces. A die pocket is formed in the first opposed...
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US20080239002 |
CAST-IN PLACE INK FEED STRUCTURE USING ENCAPSULANT
A method of forming an enclosed fluid path in a print head includes providing a die member and a truncated nozzle plate spaced from the upper surface of the die member. The die and nozzle plate are...
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US20080238997 |
HIGHLY INTEGRATED WAFER BONDED MEMS DEVICES WITH RELEASE-FREE MEMBRANE MANUFACTURE FOR HIGH DENSITY PRINT HEADS
A method of fabricating a MEMS inkjet type print head and the resulting device is disclosed. The method includes providing a driver component and separately providing an actuatable membrane...
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US20080211885 |
FLUID DISTRIBUTION STACK
A fluid distribution stack ( 500 ) for distributing fluid to a printhead integrated circuit ( 51 ), the fluid distribution stack ( 500 ) including a lower layer ( 530 ) having a lower channel (...
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US20080213927 |
METHOD FOR MANUFACTURING AN IMPROVED RESISTIVE STRUCTURE
Provided, in one embodiment, is a method for manufacturing a resistive structure. This method, without limitation, includes forming a substrate, and forming a tantalum-aluminum-nitride resistive...
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US20080211873 |
METHOD OF MANUFACTURING RECORDING HEAD AND RECORDING HEAD
A method of manufacturing a recording head according to the present invention includes a plurality of steps to describe as follows. In a solder paste application step, solder paste bodies are...
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US20080204511 |
Liquid Discharging Apparatus and Method for Manufacturing Liquid Discharging Apparatus
There is provided a head including a chip 10 that has a semiconductor substrate 11 , heating elements 12 disposed on the semiconductor substrate 11 , coating layers 14 disposed on the...
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US20080199981 |
METHOD FOR FORMING A FLUID EJECTION DEVICE
A method of forming a fluid ejection device includes forming a pair of first glass layers and forming a second glass layer. Each first glass layer includes a first side and a second side with the...
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US20080188018 |
METHOD OF MANUFACTURING INK JET CIRCUIT BOARD WITH HEATERS AND ELECTRODES CONSTRUCTED TO REDUCE CORROSION
An ink jet head circuit board is provided which has heaters to generate thermal energy for ink ejection as they are energized. This circuit board has the heaters formed with high precision to...
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US20080186356 |
NOZZLE PLATE, METHOD OF MANUFACTURING NOZZLE PLATE, AND IMAGE FORMING APPARATUS
The nozzle plate has a nozzle hole formed therethrough, the nozzle hole being defined in the nozzle plate with an inner surface including a first liquid-philic portion, a liquid-phobic portion and...
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US20080165222 |
INK-JET RECORDING HEAD, METHOD FOR MANUFACTURING INK-JET RECORDING HEAD, AND SEMICONDUCTOR DEVICE
An ink-jet recording head includes a substrate which has a first surface, a second surface opposed to the first surface, and energy-generating elements arranged above the first surface and...
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US20080153188 |
APPARATUS AND METHOD FOR FORMING SEMICONDUCTOR LAYER
Grooves forming a thin-film transistor (TFT) pattern are formed on the surface of a roller. A tank supplies ink including semiconductor materials to the roller. A squeegee embeds the ink supplied...
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US20080143791 |
LIQUID JET HEAD CHIP AND MANUFACTURING METHOD THEREFOR
A liquid ejection head includes a substrate including, at a surface thereof, an ejection energy generating means for generating ejection energy for ejecting liquid, a flow path forming member...
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US20080122896 |
INKJET PRINTHEAD WITH BACKSIDE POWER RETURN CONDUCTOR
A print head includes a substrate and an ejector. The substrate includes a first side and a second side. The ejector is located on the first side of the substrate and includes a fluid chamber with...
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US20080122895 |
NOZZLE MEMBERS, COMPOSITIONS, AND METHODS FOR MICRO-FLUID EJECTION HEADS
An improved photoimaged nozzle plate for a micro-fluid ejection head, a micro-fluid ejection head containing the nozzle plate, and methods for making a micro-fluid ejection head. The improved...
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US20080113459 |
METHOD FOR DIVIDING WAFER, METHOD FOR MANUFACTURING SILICON DEVICES, AND METHOD FOR MANUFACTURING LIQUID EJECTING HEADS
A method for dividing a wafer into a plurality of chips is provided. The method includes providing recesses in a surface of the wafer at positions along boundaries between regions to become the...
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US20080094453 |
Inkjet Print Head
An inkjet print head comprises an array of print head heater circuits, each associated with a respective print head nozzle. Each heater circuit comprises a heater arrangement ( 28 ) and a drive...
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US20080094452 |
Inkjet Print Head
An inkjet print head comprising an array of print head heater circuits, each associated with a respective print head nozzle. Each heater circuit comprises a heater arrangement ( 12 ) and a drive...
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US20080096296 |
Ink-jet printhead and manufacturing method thereof
An ink-jet printhead and a manufacturing method thereof include a substrate on which a space portion is formed, a passage plate installed on the substrate in which an ink chamber is formed to store...
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US20080088674 |
INK JET PRINT HEAD AND METHOD OF MANUFACTURING INK JET PRINT HEAD
The present invention provides an ink jet print head having a channel shape that meets an intended purpose, and a method for manufacturing the ink jet print head. In the method for manufacturing...
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US20080081387 |
MANUFACTURING METHOD OF LIQUID DISCHARGE HEAD AND ORIFICE PLATE
There is disclosed a manufacturing method in which depths of individual liquid chambers can be set to be small. The manufacturing method is a manufacturing method of a liquid discharge head having...
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US20080076197 |
METHOD OF MANUFACTURING A LIQUID EJECTION HEAD AND LIQUID EJECTION HEAD
A method of manufacturing a liquid ejection head and a liquid ejection head capable of preventing corrosion of electrodes are provided. A method of manufacturing a liquid ejection head includes: a...
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US20080057601 |
Method for manufacturing a white LED
A method for manufacturing a white LED is disclosed. The method for manufacturing a white LED comprises a die bonding step in which a blue chip is mounted on a lead frame; a wire bonding step in...
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US20080050850 |
METHOD FOR MANUFACTURING SEMICONDUCTOR LASER ELEMENT
A method for manufacturing a semiconductor laser element includes forming a semiconductor laminated structure, having an active layer, on a substrate; etching the semiconductor laminated structure...
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US20080044934 |
Methods of forming semiconductor light emitting device packages by liquid injection molding and molded semiconductor light emitting device strips
Semiconductor light emitting device packaging methods include fabricating a substrate configured to mount a semiconductor light emitting device thereon. The substrate may include a cavity...
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US20080038852 |
Method for manufacturing layered periodic structures
A method of manufacturing a periodic grating structure for a component. The method includes forming first structured layer including a final periodic grating structure of a first material and a...
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US20080026494 |
Method of fabricating a terbium-doped electroluminescence device via metal organic deposition processes
A method of fabricating an electroluminescent device includes preparing a wafer and a doped-silicon oxide precursor solution. The doped-silicon oxide precursor solution is spin coated onto the...
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US20080026495 |
Electromagnetic waveguide
A method of manufacturing an electromagnetic (EM) waveguide capable of guiding a wave along a pre-defined propagation path is described. The method includes providing a core region that extends...
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