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US20090291513 OVERLAY MARKS, METHODS OF OVERLAY MARK DESIGN AND METHODS OF OVERLAY MEASUREMENTS  
An overlay mark for determining the relative shift between two or more successive layers of a substrate and methods for using such overlay mark are disclosed. In one embodiment, the overlay mark...
US20090291512 SEMICONDUCTOR DEVICE PATTERN VERIFICATION METHOD, SEMICONDUCTOR DEVICE PATTERN VERIFICATION PROGRAM, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD  
Information on a transfer pattern created from a design pattern corresponding to a pattern to be formed on a substrate is acquired as pattern transfer information. The design pattern is compared...
US20090291511 METHOD OF FORMING SEMICONDUCTOR THIN FILM AND SEMICONDUCTOR THIN FILM INSPECTION APPARATUS  
A method of forming a semiconductor thin film includes the steps of: forming an amorphous semiconductor thin film on a substrate; forming a crystalline semiconductor thin film partially in each...
US20090286335 METHODS OF FABRICATING LIGHT EMITTING DEVICES BY SELECTIVE DEPOSITION OF LIGHT CONVERSION MATERIALS BASED ON MEASURED EMISSION CHARACTERISTICS  
A method of fabricating a light emitting device (LED) includes measuring emission characteristics for a plurality of LED chips configured to emit light of a first color. The plurality of LED chips...
US20090278569 Semiconductor Device and its Manufacturing Method, Semiconductor Manufacturing Mask, and Optical Proximity Processing Method  
An object of the present invention is to reduce processing time and manufacturing cost for a semiconductor device including a logic circuit. To accomplish the above object, an area ( 114 ) for...
US20090272901 Semiconductor substrate, substrate inspection method, semiconductor device manufacturing method, and inspection apparatus  
A semiconductor substrate inspection method includes: generating a charged particle beam, and irradiating the charged particle beam to a semiconductor substrate in which contact wiring lines are...
US20090269864 METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE BY CONSIDERING THE EXTINCTION COEFFICIENT DURING ETCHING OF AN INTERLAYER INSULATING FILM  
The present invention is directed to a method for manufacturing a semiconductor device by forming an ultraviolet radiation absorbing film of a silicon-rich film above a semiconductor substrate,...
US20090267241 Substrate with Check Mark and Method of Inspecting Position Accuracy of Conductive Glue Dispensed on the Substrate  
The invention relates to a substrate with a check mark and a method of inspecting position accuracy of conductive glue dispensed on the substrate. The method is implemented on the substrate having...
US20090258446 PATTERN VERIFICATION METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIA  
A pattern verification method according to an embodiment includes, dividing a pattern data region or a pattern formation region formed based on the pattern data to a plurality of unit regions,...
US20090253222 Etching process state judgment method and system therefor  
An etching process state judgment method comprising: a spectral data obtaining step, in which an optical emission spectrum distribution is obtained by monitoring optical emission during an etching...
US20090250697 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR  
Methods for detecting a void in an element portion of a semiconductor device having an element portion and a void detection structure are disclosed. As a part of the method, an insulating film is...
US20090246894 Fabrication and Test Methods and Systems  
Methods and systems for fabricating and testing semiconductor devices are disclosed. In one embodiment, a method of forming a material includes providing a first workpiece, forming a material on...
US20090246893 SEMICONDUCTOR INTEGRATED CIRCUIT MANUFACTURING PROCESS EVALUATION METHOD  
A method for evaluating a process of manufacturing a semiconductor integrated circuit including a deposition step and a polishing step after the deposition step, the method includes: dividing the...
US20090239315 METHOD AND SYSTEM FOR PROCESSING TEST WAFER IN PHOTOLITHOGRAPHY PROCESS  
A method and a system for processing a test wafer in a photolithography process are provided for processing an i th layer of the test wafer, and i is a positive integer. In the present method, a...
US20090236693 Planarization of Gan by Photoresist Technique Using an Inductively Coupled Plasma  
Films of III-nitride for semiconductor device growth are planarized using an etch-back method. The method includes coating a III-nitride surface having surface roughness features in the micron...
US20090233385 Plasma Doping Method and Plasma Doping Apparatus  
Before a plasma doping process is performed, there is generated a plasma of a gas containing an element belonging to the same group in the periodic table as the primary element of a silicon...
US20090227049 METHODS FOR DISCRETIZED PROCESSING OF REGIONS OF A SUBSTRATE  
The present invention provides methods and systems for discretized, combinatorial processing of regions of a substrate such as for the discovery, implementation, optimization, and qualification of...
US20090221105 MANUFACTURING METHOD FOR SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE  
In mass production of CMIS integrated circuit devices or the like, electric characteristics, such as Vth (threshold voltage) or the like, disadvantageously vary due to variations in gate length of...
US20090215205 SHOWER HEAD STRUCTURE FOR PROCESSING SEMICONDUCTOR  
A shower head structure disposed in a device 2 for processing a semiconductor while supplying processing gas to a processing space S for storing a heated processed substrate W, comprising a...
US20090206472 COF PACKAGING STRUCTURE, METHOD OF MANUFACTURING THE COF PACKAGING STRUCTURE, AND METHOD FOR ASSEMBLING A DRIVER IC AND THE COF PACKAGING STRUCTURE THEREOF  
A COF packaging structure includes a substrate, a first conductive foil, and a second conductive foil. The substrate has a first surface and a second surface opposite to the first surface. The...
US20090203214 SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE OBTAINED BY SUCH A METHOD  
The invention relates to a method of manufacturing a semiconductor device ( 10 ) with a substrate ( 11 ) and a semiconductor body ( 1 ), whereby in the semiconductor body ( 1 ) a semiconductor...
US20090203156 METHODS FOR ACCURATELY MEASURING THE THICKNESS OF AN EPITAXIAL LAYER ON A SILICON WAFER  
Methods for measuring thickness of an epitaxial layer of a wafer. An example method applies photoresist over the epitaxial layer, and then portions of the photoresist within a sacrificial region of...
US20090197359 METHODS FOR EVALUATING AND MANUFACTURING SEMICONDUCTOR WAFER  
A method for evaluating a shape change of a semiconductor wafer is provided. The method comprises acquiring unconstrained shape data of shape data of the semiconductor wafer being placed on a...
US20090197358 Method for making COP evaluation on single-crystal silicon wafer  
An evaluation area of an evaluation object wafer is concentrically divided in a radial direction, an upper limit value to the number of COPs is set in each divided evaluation segment, and an...
US20090194865 METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE, METHOD FOR DETECTING A SEMICONDUCTOR SUBSTRATE AND SEMICONDUCTOR CHIP PACKAGE  
A method for manufacturing a semiconductor device, includes: preparing a semiconductor substrate with a first notch; preparing a supporting substrate with a second notch; laminating the...
US20090191651 POSITIONING APPARATUS, EXPOSURE APPARATUS, AND METHOD OF MANUFACTURING DEVICE  
A positioning apparatus comprises a detector which detects the mark and outputs a mark signal and a controller. The controller includes a calculating unit which calculates position data of the mark...
US20090186428 METHOD FOR CONSTRUCTING MODULE FOR OPTICAL CRITICAL DIMENSION (OCD) AND MEASUREING METHOD OF MODULE FOR OPTICAL CRITICAL DIMENSION USING THE MODULE  
An optical critical dimension measuring method, applicable in measuring a pattern, that includes a plurality of polysilicon layers, of a device, is provided. The method includes obtaining a real...
US20090186427 CHARACTERIZING FILMS USING OPTICAL FILTER PSEUDO SUBSTRATE  
A system and method of characterizing a parameter of an ultra thin film, such as a gate oxide layer. A system is disclosed that includes a structure having a pseudo substrate positioned below an...
US20090186425 METHOD FOR FORMING BUMPS, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME, SUBSTRATE PROCESSING APPARATUS, AND SEMICONDUCTOR MANUFACTURING APPARATUS  
A semiconductor substrate ( 1 ) is secured by suction to a rear face ( 1 b ) of a supporting face ( 11 a ) of a substrate supporting table ( 11 ). In this event, the thickness of the semiconductor...
US20090176321 TEMPLATE FOR FORMING SOLDER BUMPS, METHOD OF MANUFACTURING THE TEMPLATE AND METHOD OF INSPECTING SOLDER BUMPS USING THE TEMPLATE  
A template for forming solder bumps includes a transparent substrate on which a plurality of cavities is formed at an upper surface portion thereof, and a light-reflective layer and a protective...
US20090170223 METHODS FOR CALIBRATING A PROCESS FOR GROWING AN EPITAXIAL SILICON FILM AND METHODS FOR GROWING AN EPITAXIAL SILICON FILM  
Methods are provided for calibrating a process for growing an epitaxial silicon-comprising film and for growing an epitaxial silicon-comprising film. One method comprises epitaxially growing a...
US20090140390 GaAs SEMICONDUCTOR SUBSTRATE AND METHOD OF MANUFACTURING THE SAME, AND GROUP III-V COMPOUND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME  
A GaAs semiconductor substrate includes a main surface ( 10 m ) having an inclined angle of 6° to 16° with respect to a (100) plane ( 10 a ), and a concentration of chlorine atoms on the main...
US20090140247 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE  
The semiconductor device of the present invention includes a first insulating film on a substrate having a first region and a second region, a light shielding film formed in the first region and an...
US20090124028 Imaging device and method for a bonding apparatus  
An imaging device and method of a bonding apparatus in which the imaging device includes: a high-magnification optical system having first and second high-magnification optical paths that extend to...
US20090119069 METHOD FOR DETERMINING RELATIVE SWING CURVE AMPLITUDE  
A process ( 300 ) is disclosed to measure predetermined wavelength reflectance spectra of a photo resist coated wafer ( 305,310,315,320 ) at a nominal thickness. After coating, the predetermined...
US20090108269 ILLUMINATION DEVICE HAVING ONE OR MORE LUMIPHORS, AND METHODS OF FABRICATING SAME  
A light emitter comprising a monolithic die comprising at least one solid state light emitting device and at least a first lumiphor covering part of a light emission region of the die. In some...
US20090108257 CRITICAL DIMENSION FOR TRENCH AND VIAS  
Test structures including test trenches are used to define critical dimension of trenches in a via level of an integrated circuit to produce substantially the same depth. The trenches are formed at...
US20090104719 Plasma Doping System with In-Situ Chamber Condition Monitoring  
A method of in-situ monitoring of a plasma doping process includes generating a plasma comprising dopant ions in a chamber proximate to a platen supporting a substrate. A platen is biased with a...
US20090098668 Method and Apparatus to Facilitate Testing of Printed Semiconductor Devices  
A printing platform receives ( 102 ) (preferably in-line with a semiconductor device printing process ( 101 )) a substrate having at least one semiconductor device printed thereon and further...
US20090096091 SEMICONDUCTOR DEVICE MANUFACTURING APPARATUS, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE  
A semiconductor device manufacturing apparatus is provided with a drawing pattern printing part having a print head which injects a conductive solvent, an insulative solvent and an interface...
US20090075407 ELECTRONIC DEVICE AND METHOD FOR PRODUCING THE SAME  
A microelectronic device and a method for producing the device can overcome the disadvantages of known electronic devices composed of carbon molecules, and can deliver performance superior to the...
US20090073445 BONDING AGENT STICKING INSPECTION APPARATUS, MOUNTING APPARATUS, AND METHOD OF MANUFACTURING ELECTRICAL COMPONENT  
A bonding agent sticking inspection apparatus includes a photographing section, a movement section, and a control section. The photographing section photographs an image of a substrate. The image...
US20090035882 METHOD AND APPARATUS FOR AFFECTING SURFACE COMPOSITION OF CIGS ABSORBERS FORMED BY TWO-STAGE PROCESS  
A method and system to modify a surface composition of thin film Group IBIIIA VIA solar cell absorbers having non-uniformly distributed Group IIIA materials or graded materials, such as Indium...
US20090023231 Semiconductor Device Manufacturing Method and Method for Reducing Microroughness of Semiconductor Surface  
Surface treatment is performed with a liquid, while shielding a semiconductor surface from light. When the method is employed for surface treatment in wet processes such as cleaning, etching and...
US20090023230 METHODS AND APPARATUS FOR DEPOSITING AN ANTI-REFLECTION COATING  
Systems, methods, and apparatus are provided for depositing an anti-reflection film on a substrate. A substrate is transported to a metrology tool. A characteristic of the substrate is measured,...
US20090011524 Method for determining suitability of a resist in semiconductor wafer fabrication  
In one disclosed embodiment, the present method for determining resist suitability for semiconductor wafer fabrication comprises forming a layer of resist over a semiconductor wafer, exposing the...
US20090008794 Thickness Indicators for Wafer Thinning  
A wafer thinning system and method are disclosed that includes grinding away substrate material from a backside of a semiconductor device. A current change is detected in a grinding device...
US20080318351 METHOD OF SETTING RECIPES OF A DEFECT TEST  
In a method of setting recipes of a defect test, a laser intensity map of a sample is obtained. The laser intensity map is then area-scanned to obtain average laser intensity. Recipes are set based...
US20080318350 Apparatus for improving incoming and outgoing wafer inspection productivity in a wafer reclaim factory  
An apparatus and method for inspecting wafers at a reclaim factory is described. Embodiments of the invention describe an apparatus in which a wafer ID and wafer thickness may be simultaneously...
US20080308799 WIRING STRUCTURE AND MANUFACTURING METHOD THEREFOR  
A wiring structure including a wiring pattern formed in an insulation film on a substrate, a pattern for measurement which is formed in the insulation film on the substrate in a region different...
Matches 1 - 50 out of 95 1 2 >