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US20090286334 |
PROCESS FOR TREATMENT OF SEMICONDUCTOR WAFER USING WATER VAPOR CONTAINING ENVIRONMENT
A process is provided for treating a semiconductor wafer at a target wafer temperature. This process includes the following steps: a) determining the target wafer temperature of the semiconductor...
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US20090280582 |
Design Methodology for MuGFET ESD Protection Devices
A method for manufacturing a MuGFET ESD protection device having a given layout by means of a given manufacturing process, the method comprising selecting multiple interdependent layout and process...
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US20090278230 |
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
A semiconductor device has a substrate, an insulating interlayer, an interconnect as one example of an electro-conductive pattern, a through-electrode, and a bump as one example of a connection...
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US20090277287 |
METHOD FOR PERFORMING A SHELF LIFETIME ACCELERATION TEST
Embodiments of the invention provide a method of determining a storage lifetime of a wafer in a storage environment, the storage environment corresponding to an environment having a first value of...
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US20090258445 |
MULTI-VARIABLE REGRESSION FOR METROLOGY
A method for assessing metrology tool accuracy is described. Multi-variable regression is used to define the accuracy of a metrology tool such that the interaction between different measurement...
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US20090246891 |
MARK FORMING METHOD AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
A mark forming method includes forming a first mask layer on a semiconductor substrate; forming at least three first patterns having periodicity on the first mask layer; forming a second mask layer...
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US20090243120 |
SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR ELEMENT FABRICATION METHOD
A semiconductor element is provided that includes a semiconductor substrate, a circuit element disposed on the substrate, and a through-hole formed in the substrate having a stripe-like...
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US20090236699 |
DISCREET PLACEMENT OF RADIATION SOURCES ON INTEGRATED CIRCUIT DEVICES
An integrated circuit and methods of forming and using the integrated circuit. The circuit includes: a radiation-emitting layer over a selected region of a top surface of an integrated circuit...
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US20090233463 |
INTEGRATED CIRCUIT TEST SOCKET HAVING ELASTIC CONTACT SUPPORT AND METHODS FOR USE THEREWITH
A socket can be used for testing an integrated circuit package having a plurality of rows of leads. The socket includes a base that is aligned with a circuit board having a plurality of contact...
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US20090226737 |
SILICON SUBSTRATE AND MANUFACTURING METHOD OF THE SAME
A condition of a single crystal manufacturing step subjected to the Czochralski method applying an initial oxygen concentration, a dopant concentration or resistivity, and a heat treatment...
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US20090225330 |
OPTOELECTRONIC DISTANCE SENSOR
An optoelectronic distance sensor with slant component 200 having a spacer 202 bonded on a mother substrate 201 is disclosed. The spacer 202 has slant surface for receiving one or more...
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US20090221103 |
FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
In the fabrication of a semiconductor integrated circuit device, a 2D-3D inspection technique for solder printed on a substrate is provided which permits easy preparation of data and easy visual...
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US20090219969 |
SUBSTRATE SURFACE TEMPERATURE MEASUREMENT METHOD, SUBSTRATE PROCESSING APPARATUS USING THE SAME, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
The expansion amount of a substrate ( 106 ) is measured using a scope ( 115 a, 115 b ) which observes the edge surface of the substrate ( 106 ). The temperature of the neutral plane of the...
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US20090215206 |
System and method for controlling a semiconductor manufacturing process
A semiconductor manufacture and testing device is provided, comprising: a process device configured to perform a semiconductor processing operation on a semiconductor wafer; a testing device...
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US20090215203 |
MONITORING OF TEMPERATURE VARIATION ACROSS WAFERS DURING PROCESSING
A method of measuring temperature across wafers during semiconductor processing includes the step of providing a correlation between a peak wafer temperature during a processing step and a change...
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US20090212447 |
Mark Structure for Coarse Wafer Alignment and Method for Manufacturing Such a Mark Structure
A mark structure includes on a substrate, at least four lines. The lines extend parallel to each other in a first direction and are arranged with a pitch between each pair of lines that is directed...
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US20090201043 |
Crack Sensors for Semiconductor Devices
Crack sensors for semiconductor devices, semiconductor devices, methods of manufacturing semiconductor devices, and methods of testing semiconductor devices are disclosed. In one embodiment, a...
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US20090200547 |
TRENCH DEPTH MONITOR FOR SEMICONDUCTOR MANUFACTURING
A method of manufacturing a semiconductor wafer having at least one device trench extending to a first depth position includes providing a semiconductor substrate having first and second main...
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US20090197356 |
Substrate positioning on a vacuum chuck
We have discovered a method of using the vacuum chuck/heater upon which a substrate wafer is positioned to determine whether the wafer is properly placed on the vacuum chuck. The method employs...
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US20090197355 |
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING SYSTEM
A method for manufacturing a semiconductor device that controls the influence of a thickness of a stopper film even if there is a change in the thickness of the stopper film by measuring the...
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US20090197354 |
SYSTEM AND METHOD FOR MONITORING MANUFACTURING PROCESS
A system and method for monitoring a manufacturing process are provided. A wafer is provided. Process parameters of a manufacturing machine are in-situ measured and recorded if the wafer is...
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US20090186426 |
Plasma Doping Method and Apparatus Employed in the Same
A plasma doping method and a plasma doping apparatus, having a superior in-plane uniformity of an amorphous layer formed on a sample surface, are provided. In the plasma doping method by which...
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US20090184624 |
LIGHT EMITTING DEVICE WITH IMPROVED CONVERSION LAYER
The invention relates to a light emitting device comprising a substrate layer and a light conversion layer located on said substrate layer, whereby the light conversion layer is a polycrystalline...
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US20090155933 |
Manufacturing Method of Display Device
To suppress the occurrence of image quality irregularities in a liquid crystal display device having a TFT substrate which is manufactured by performing steps a plurality of times in such a manner...
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US20090148965 |
Method and apparatuses for high pressure gas annealing
Novel methods and apparatuses for annealing semiconductor devices in a high pressure gas environment. According to an embodiment, the annealing vessel has a dual chamber structure, and potentially...
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US20090146145 |
PROCESSING CONDITION INSPECTION AND OPTIMIZATION METHOD OF DAMAGE RECOVERY PROCESS, DAMAGE RECOVERING SYSTEM AND STORAGE MEDIUM
A processing condition inspection method of a damage recovery process for reforming a film having OH groups generated by damages from a predetermined process by using a processing gas includes...
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US20090142859 |
PLASMA CONTROL USING DUAL CATHODE FREQUENCY MIXING
Methods for processing a substrate in a processing chamber using dual RF frequencies are provided herein. In some embodiments, a method of processing a substrate includes forming a plasma of a...
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US20090137068 |
Method and Computer Program Product for Wafer Manufacturing Process Abnormalities Detection
A method for wafer manufacturing process abnormalities detection, the method includes: generating a classifier in response to compression based similarities between relevant wafer manufacturing...
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US20090130784 |
Method for determining the position of the edge bead removal line of a disk-like object
A method for determining the position of an edge bead removal line of a disk-like object having an edge area and an alignment mark on the edge area is disclosed, wherein the edge area including the...
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US20090117673 |
FAILURE DETECTING METHOD, FAILURE DETECTING APPARATUS, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
A failure detecting method has inputting a foreign substance inspection map created by foreign substance inspection for a wafer surface after each processing process in a wafer processing process,...
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US20090114853 |
MANUFACTURING SYSTEM FOR SEMICONDUCTOR DEVICE CAPABLE OF CONTROLLING VARIATION IN ELECTRICAL PROPERTY OF ELEMENT IN WAFER SURFACE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE
A measuring device measures a gate length of a plurality of gate electrodes formed on a wafer. A calculation device calculates data of an ion implantation dosage for making uniform a threshold...
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US20090103350 |
Method of Testing an Integrated Circuit, Method of Manufacturing an Integrated Circuit, and Integrated Circuit
According to one embodiment of the present invention, a method of testing a memory device including a memory cell array is provided, the method including: dividing the memory cell array into a...
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US20090102023 |
Method for Manufacturing a Structure, Semiconductor Device and Structure on a Substrate
One possible embodiment is a method for manufacturing a structure on a substrate which can be used in the manufacturing of a semiconductor device, including the steps of: forming a first structure...
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US20090100917 |
ROCKING Y-SHAPED PROBE FOR CRITICAL DIMENSION ATOMIC FORCE MICROSCOPY
Measuring surface profiles of structures on integrated circuits is difficult when feature sizes are less than 100 nanometers. Atomic force microscopy provides surface profile measurement capability...
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US20090081817 |
PATTERNING METHOD
A patterning method is provided. In the patterning method, a film is formed on a substrate and a pre-layer information is measured. Next, an etching process is performed to etch the film. The...
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US20090078198 |
CHAMBER COMPONENTS WITH INCREASED PYROMETRY VISIBILITY
The present invention generally provides method and apparatus for non-contact temperature measurement in a semiconductor processing chamber. Particularly, the present invention provides methods and...
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US20090074141 |
Automated selection of x-ray reflectometry measurement locations
A computer-implemented method for inspection of a sample includes defining a plurality of locations on a surface of the sample, irradiating the surface at each of the locations with a beam of...
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US20090068770 |
TACTILE SURFACE INSPECTION DURING DEVICE FABRICATION OR ASSEMBLY
Processes for inspecting a surface during device fabrication include contacting the surface with a tactile sensor. The tactile sensor is an electroluminescent tactile sensor array or a current...
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US20090061544 |
TRAJECTORY BASED CONTROL OF PLASMA PROCESSING
A method of controlling a plasma processing according to trajectories connecting start and stop values of parameters controlling the plasma processing, for example, gas flow and power supplied to...
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US20090061543 |
METHOD FOR CALIBRATING AN INSPECTION TOOL
Provided is a method for manufacturing a semiconductor device. The method, in one embodiment, includes calibrating an inspection tool configured to obtain a measurement of a semiconductor feature,...
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US20090056441 |
PROCESS CONDITION MEASURING DEVICE
An instrument for measuring a parameter comprises a substrate, a plurality of sensors carried by and distributed across a surface of the substrate that individually measure the parameter at...
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US20090053837 |
Wafer boat for semiconductor testing
In accordance with one embodiment of the invention, a method and apparatus are provided for testing a wafer while the wafer is disposed in a wafer carrier. The test results can be utilized to...
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US20090050885 |
Semiconductor wafers and methods of fabricating semiconductor devices
A semiconductor wafer includes a plurality of unitary semiconductor chips formed on a semiconductor substrate. Scribe lane region separate the unitary semiconductor chips from each other. Test...
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US20090035883 |
Auto Routing for Optimal Uniformity Control
A method for improving within-wafer uniformity is provided. The method includes forming an electrical component by a first process step and a second process step, wherein the electrical component...
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US20090032908 |
Semiconductor device and method of manufacturing it
A method of manufacturing a semiconductor device capable of largely increasing the yield and a semiconductor device manufactured by using the method is provided. After a semiconductor layer is...
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US20090029490 |
Method of fabricating an electronic device
It has been found that for silicon integrated circuits having capacitor structures or other p-n junctions structure at a technology node of 32 nm or smaller, photovoltaic induced corrosion of...
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US20090019408 |
Production method, design method and design system for semiconductor integrated circuit
A production method for a semiconductor integrated circuit includes: creating a model parameter of an element constituting a cell, wherein the model parameter is defined by a design value and a...
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US20090001336 |
PHASE CHANGE MATERIAL BASED TEMPERATURE SENSOR
A block of phase change material located in a semiconductor chip is reset to an amorphous state. The block of phase change material may be connected to an internal resistance measurement circuit...
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US20080318347 |
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
In the semiconductor device manufacturing method of the present invention, first, the emissivity of a wafer placed in a chamber is measured. Then, the fluctuation rate of a wafer physical quantity...
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US20080311688 |
Method and Apparatus for Creating a Gate Optimization Evaluation Library
The invention can provide a method of processing a substrate using Gate-Optimization processing sequences and evaluation libraries that can include gate-etch procedures, COR-etch procedures, and...
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