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US20090302427 |
Semiconductor Chip with Reinforcement Structure
Various semiconductor chip reinforcement structures and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes coupling a semiconductor chip to...
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US20090294931 |
Methods of Making an Electronic Component Package and Semiconductor Chip Packages
An electronic component package having an EMI shielded space is disclosed. The package comprises a substrate having an electronic component located on its surface and a conductive enclosure having...
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US20090291531 |
Method of manufacturing a semiconductor device and molding die
A method of manufacturing a semiconductor device capable of obtaining high joining force between a heat spreader and resin is provided. The method of manufacturing a semiconductor device according...
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US20090261471 |
RF POWER TRANSISTOR PACKAGE
An RF power transistor package with a rectangular ceramic base can house one or more dies affixed to an upper surface of the ceramic base. Source leads attached to the ceramic base extend from at...
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US20090263939 |
SEMICONDUCTOR ELEMENT, METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT, MULTI-LAYER PRINTED CIRCUIT BOARD, AND METHOD OF MANUFACTURING MULTI-LAYER PRINTED CIRCUIT BOARD
A transition layer 38 is provided on a die pad 22 of an IC chip 20 and integrated into a multilayer printed circuit board 10 . Due to this, it is possible to electrically connect the IC chip...
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US20090243077 |
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH RIGID LOCKING LEAD
An integrated circuit package system includes: providing a protective layer having an opening; forming a conductive layer over the protective layer and filling the opening; patterning a rigid...
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US20090243067 |
MOUNTABLE INTEGRATED CIRCUIT PACKAGE SYSTEM WITH SUBSTRATE
A mountable integrated circuit package system includes: providing a substrate having an opening provided therein; providing an encapsulated integrated circuit package having an external leadfinger;...
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US20090236735 |
UPGRADEABLE AND REPAIRABLE SEMICONDUCTOR PACKAGES AND METHODS
A semiconductor device package includes a carrier, one or more semiconductor devices on the carrier, and a redistribution element above the uppermost of the one or more semiconductor devices. The...
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US20090152714 |
Semiconductor device and method for manufacturing the same
An electronic device includes: a substrate having first and second surfaces, wherein the first surface is opposite to the second surface; a first electronic element mounted on the first surface of...
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US20090075431 |
Wafer level package with cavities for active devices
According to one exemplary embodiment, a method for forming a wafer level package includes fabricating an active device on a substrate in a semiconductor wafer, forming polymer walls around the...
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US20090045501 |
STRUCTURE ON CHIP PACKAGE TO SUBSTANTIALLY MATCH STIFFNESS OF CHIP
Chip packages and a related method are disclosed that provide a structure on a side opposite a chip on a carrier of a chip package to substantially match a stiffness of the chip. In one embodiment,...
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US20090045500 |
Power semiconductor module with a connected substrate carrier and production method therefor
A power semiconductor module includes a housing, a substrate carrier with a circuit thereon and electrical connection elements extending therefrom. The carrier has a cutout between its inner...
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US20090032928 |
Multi-chip stack structure having through silicon via and method for fabrication the same
The invention discloses a multi-chip stack structure having through silicon via and a method for fabricating the same. The method includes: providing a wafer having a plurality of first chips;...
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US20090014859 |
INTERCONNECTS FOR PACKAGED SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING SUCH DEVICES
Packaged semiconductor devices and assemblies including interconnects and methods for forming such interconnects are disclosed herein. One embodiment of a packaged semiconductor assembly includes a...
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US20090008760 |
SEMICONDUCTOR DEVICE HAS ENCAPSULANT WITH CHAMFER SUCH THAT PORTION OF SUBSTRATE AND CHAMFER ARE EXPOSED FROM ENCAPSULANT AND REMAINING PORTION OF SURFACE OF SUBSTRATE IS COVERED BY ENCAPSULANT
A semiconductor device and a fabrication method thereof are provided. An opening having at least one slanted side is formed on a substrate. At least one chip and at least one passive component are...
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US20090001553 |
Mems Package and Method for the Production Thereof
A micro electro-mechanical systems (MEMS) package is described herein. The package includes a carrier substrate having a top side, a MEMS chip mounted on the top side of the carrier substrate, and...
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US20080313894 |
METHOD FOR MAKING AN INTERCONNECT STRUCTURE AND LOW-TEMPERATURE INTERCONNECT COMPONENT RECOVERY PROCESS
A method is provided for making an interconnect structure. The method includes applying a low-temperature removable layer and adhesive layer to an electronic device or to a base insulative layer;...
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US20080308917 |
EMBEDDED CHIP PACKAGE
An electronic assembly is disclosed. One embodiment includes at least one semiconductor chip and a package structure embedding the semiconductor chip. The package structure includes at least one...
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US20080296747 |
Micromechanical component having thin-layer encapsulation and production method
A micromechanical component having a substrate and having a thin-layer, as well as having a cavity which is bounded by the substrate and the thin-layer, at least one gas having an internal pressure...
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US20080217763 |
MICROELECTRONIC WORKPIECES AND METHODS FOR MANUFACTURING MICROELECTRONIC DEVICES USING SUCH WORKPIECES
Microelectronic workpieces and methods for manufacturing microelectronic devices using such workpieces are disclosed. In one embodiment, a microelectronic assembly comprises a support member having...
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US20080217753 |
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
A semiconductor device includes a semiconductor element 1, a thermal conductor 91 located opposite a major surface of the semiconductor element 1, and a mold resin member 6 molding the...
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US20080211087 |
CHIP MODULE AND METHOD FOR PRODUCING A CHIP MODULE
A chip module comprises a substrate, a chip arranged on one side of the substrate and conductor structures arranged on at least one side of the substrate and conductively connected to the chip. At...
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US20080213947 |
Resin encapsulation molding method for semiconductor device
According to a resin encapsulation molding method for a semiconductor device, a resin-encapsulated substrate having a semiconductor device that is mounted on the substrate and that has a portion...
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US20080206926 |
SEMICONDUCTOR ELEMENT, METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT, MULTI-LAYER PRINTED CIRCUIT BOARD, AND METHOD OF MANUFACTURING MULTI-LAYER PRINTED CIRCUIT BOARD
A transition layer 38 is provided on a die pad 22 of an IC chip 20 and integrated into a multilayer printed circuit board 10 . Due to this, it is possible to electrically connect the IC chip...
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US20080206929 |
PRINTING DEVICE, PRODUCTION UNIT, AND PRODUCTION METHOD OF ELECTRONIC PARTS
A printing device, a production unit and a production method of electronic parts suitable for production of precise electronic parts are provided. A squeegee is attached to a rotating machine, and...
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US20080203561 |
HIGH FREQUENCY DEVICE MODULE AND MANUFACTURING METHOD THEREOF
A high frequency device module of an embodiment of a current invention includes: an insulation substrate in which electrodes are provided on the front surface thereof and a grounding substrate is...
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US20080191339 |
MODULE WITH SILICON-BASED LAYER
The invention concerns a module comprising a carrier element, a semiconductor device mounted on said carrier element and a silicon-based insulating layer. The silicon-based insulating layer is...
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US20080174005 |
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
An electronic device has a substrate that has first and second peripheral portions. The first peripheral portion provides a shearing position for separation. The electronic device has a plurality...
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US20080164618 |
SEMICONDUCTOR PACKAGE SYSTEM WITH DIE CARRIER HAVING MOLD FLOW RESTRICTING ELEMENTS
A semiconductor package can comprise a die stack attached to a substrate, with bond wires electrically connecting the two. Often multiple die stacks are adhered to a single substrate so that...
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US20080160678 |
Method for fabricating semiconductor package
A semiconductor package and a method for fabricating the same are proposed. A substrate having a first circuit layer, a second circuit layer, and a core layer formed between the first and second...
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US20080145968 |
Manufacturing Method For Micro-SD Flash Memory Card
A method for fabricating MicroSD devices includes forming a PCB panel having multiple PCBs arranged in parallel rows, with each PCB connected to its neighboring PCBs in each row by relatively...
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US20080145976 |
Packaging of Micro Devices
A silicon wafer is used as a substrate ( 1 ). A thin layer of metal is deposited and etched to form device metallisation ( 3 ), including electrodes and bondpads. A passivation layer ( 4 ) of...
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US20080136000 |
Micromechanical Component Having Multiple Caverns, and Manufacturing Method
A micromechanical component having at least two caverns is provided, the caverns being delimited by the micromechanical component and a cap, and the caverns having different internal atmospheric...
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US20080128886 |
Substrate for a flexible microelectronic assembly and a method of fabricating thereof
Substrates having integrated rigid and flexible regions and methods of fabricating such substrates are disclosed. The substrates may advantageously be used for mounting semiconductor chips used in...
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US20080099902 |
Insertion-type semiconductor device and fabrication method thereof
The present invention provides an insertion-type semiconductor device and a fabrication method thereof, including the steps of: mounting a chip on a BGA substrate and performing a packaging molding...
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US20080096326 |
Method for Making Advanced Smart Cards With Integrated Electronics Using Isotropic Thermoset Adhesive Materials With High Quality Exterior Surfaces
Advanced Smart Cards and similar form factors (e.g. documents, tags) having high quality external surfaces of Polyvinylchloride (PVC), Polycarbonate (PC), synthetic paper or other suitable material...
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US20080089048 |
Substrate with built-in electronic component and method for manufacturing the same
A substrate with built-in electronic components includes a substrate on which a first conductive pattern is formed; an electronic component mounted on the substrate; an insulting layer which is...
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US20080079142 |
Wafer-level MEMS package and manufacturing method thereof
The present invention is related in general to a wafer-level packaging technique for micro-electro-mechanical systems (MEMS). A cap structure is provided encapsulating a MEMS element formed on a...
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US20080057626 |
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
For molding semiconductor chips on a wiring substrate matrix with a sealing resin, the wiring substrate matrix is placed on a lower die cavity block of a lower die, and, thereafter, an upper die is...
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US20080054445 |
RIGID WAVE PATTERN DESIGN ON CHIP CARRIER SUBSTRATE AND PRINTED CIRCUIT BOARD FOR SEMICONDUCTOR AND ELECTRONIC SUB-SYSTEM PACKAGING
A rigid wave pattern formed on a first side of a substrate in a semiconductor die package. The rigid wave pattern aligns with and overlies the contact fingers formed on the second side of the...
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US20080038870 |
THERMAL METHOD TO CONTROL UNDERFILL FLOW IN SEMICONDUCTOR DEVICES
A method and apparatus for assembling a semiconductor device. A chip ( 901 ) with solder bodies ( 903 ) on its contact pads is flipped onto a substrate ( 904 ). After the reflow process, a gap (...
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US20080009102 |
Method for Encasulating Sensor Chips
A method for encapsulating sensor chips is disclosed. A protective layer is formed on an active surface of a sensor chip, and at least covers a sensor region in the active surface. The active...
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