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US20060270117 Method for modified bus bar with Kapton™ tape or insulative material on LOC packaged part  
A semiconductor device is formed from a die and a lead frame having one or more bus bars. Portions of the bus bars are overlain with an electrically insulative material while leaving bonding areas...
US20090098686 METHOD OF FORMING PREMOLDED LEAD FRAME  
A method of forming a pre-molded lead frame having increased stand-offs includes the steps of attaching a first tape to a first side of the lead frame and a second tape to a second side of the...
US20150194379 Protrusion Bump Pads for Bond-on-Trace Processing  
An embodiment apparatus includes a dielectric layer in a die, a conductive trace in the dielectric layer, and a protrusion bump pad on the conductive trace. The protrusion bump pad at least...
US20130277811 STACKED INTERPOSER LEADFRAMES  
A method of manufacturing integrated circuit (IC) devices includes the steps of providing a first frame that has openings each having a perimeter with shaped notches, placing a first die in at...
US20130196473 MOLD CHASE  
A mold chase for packaging a semiconductor die includes first and second toothed mold clamps, each having teeth, recesses located between the teeth, and an open cavity located in a center of the...
US20070031996 Packaged integrated circuit having a heat spreader and method therefor  
An integrated circuit is packaged, in one embodiment, by wire bonding to pads supported by tape. The tape also supports traces that run from the wire bonded location to a pad for solder balls. A...
US20130026614 STRUCTURE AND METHOD FOR BUMP TO LANDING TRACE RATIO  
The present disclosure provides an integrated circuit. The integrated circuit includes an interconnect structure formed on a substrate; a landing metal trace formed on the interconnect structure...
US20110272794 PRE-MOLDED CLIP STRUCTURE  
A method for making a premolded clip structure is disclosed. The method includes obtaining a first clip and a second clip, and forming a molding material around the first clip comprising a first...
US20140335660 BONDING STRUCTURE AND METHOD  
A bonding structure and a method for bonding components, wherein the bonding structure includes a nanoparticle preform. In accordance with embodiments, the nanoparticle preform is placed on a...
US20090212404 LEADFRAME HAVING MOLD LOCK VENT  
A leadframe for supporting a semiconductor chip, the leadframe including a die pad having a first major surface and an opposing second major surface defining a thickness and having at least one...
US20130258627 INTERPOSER-BASED DAMPING RESISTOR  
Various resistor circuits and methods of making and using the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a resistor onboard an interposer. The...
US20100035385 ALUMINUM BUMP BONDING FOR FINE ALUMINUM WIRE  
The invention includes a packaged semiconductor device in which the bond wires are bonded to the leads with an aluminum bump bond. The semiconductor device is mounted on a leadframe having leads...
US20090111220 COATED LEAD FRAME  
A lead frame having a coating of organic compounds on its lead fingers prevents tin and flux from contaminating the lead fingers after die attach. The coating is removed prior to wire bonding. The...
US20060145317 Leadframe designs for plastic cavity transistor packages  
The specification describes a plastic cavity package for semiconductor devices that provides additional mechanical integrity for leads that extend from the plastic housing. Portions of the leads...
US20080150104 LEADFRAME WITH DIFFERENT TOPOLOGIES FOR MEMS PACKAGE  
A package for a micro-electromechanical (MEMS) device is described. A premolded leadframe base has opposing top and bottom surfaces. Each surface is defined by a topology having at least one...
US20140353387 Smart Card Module and Method for Producing a Smart Card Module  
A smart card module for use in a smart card includes a microchip and a contact zone for making contact with the microchip by means of a reader. The microchip can be enclosed by an encapsulation...
US20120146165 MAGNETIC FIELD CURRENT SENSORS  
Embodiments relate to magnetic field current sensors. In an embodiment, a method of forming a conductor clip for a magnetic field current sensor comprises forming a footprint portion; forming...
US20130207250 CHIP ATTACH FRAME  
A chip attach frame is used to align pins of an integrated circuit chip with pads on a chip carrier. A frame block has a socket defining two alignment edges that form a reference corner. The chip...
US20090072359 STACKED SYNCHRONOUS BUCK CONVERTER  
A multichip module buck converter 10 has a high side power mosfet 12, a low side power mosfet 22 and a pre-molded leadframe 40 between the two mosfets for connecting the source of mosfet 12 to the...
US20080003722 Transfer mold solution for molded multi-media card  
A method of fabricating a memory card. The method comprises the initial step of providing a leadframe which has a dambar and a plurality of contacts, each of the contacts being attached to the...
US20110256670 METHOD FOR MANUFACTURING INTEGRATED CIRCUIT PACKAGE SYSTEM WITH UNDER PADDLE LEADFINGERS  
A method for manufacturing an integrated circuit package system includes: forming a die paddle; forming an under paddle leadframe including lower leadfingers thereon; attaching the under paddle...
US20050269673 Pure copper-coated copper foil and method of producing the same, and TAB tape and method of producing the same  
A copper foil which is substantially free of generation of voids even if fusing treatment is conducted on a tin-plated layer and which is excellent in etching properties is provided. To achieve...
US20070141755 RIBBON BONDING IN AN ELECTRONIC PACKAGE  
A flexible conductive ribbon is ultrasonically bonded to the surface of a die and terminals from a lead frame of a package. Multiple ribbons and/or multiple bonded areas provide various benefits,...
US20090102034 Packaged Microchip with Spacer for Mitigating Electrical Leakage Between Components  
A packaged microchip has a base, at least one spacer coupled to the base, and first and second microchips mounted to the at least one spacer. The at least one spacer is configured to substantially...
US20100084749 Package and fabricating method thereof  
A package and a fabricating method thereof are provided. The package includes a lead frame, a chip and a sealant. The lead frame has a notch and a plurality of first notch-side leads, a plurality...
US20130049181 LEAD FRAME HAVING A FLAG WITH IN-PLANE AND OUT-OF-PLANE MOLD LOCKING FEATURES  
A semiconductor device lead frame having enhanced mold locking features is provided. The lead frame has a flag with bendable edge features along the edge of the flag. Each edge feature is shaped...
US20090127695 SURFACE MOUNT PACKAGE WITH ENHANCED STRENGTH SOLDER JOINT  
A substrate pad in a semiconductor package having a geometry and structure that facilitates providing a solder joint to the pad that has enhanced structural integrity and resistance to mechanical...
US20120032315 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH DIE PADDLE AND METHOD OF MANUFACTURE THEREOF  
A method of manufacture of an integrated circuit packaging system includes: providing a package paddle having a single integral structure with a paddle central portion surrounded by a paddle...
US20080044952 SELECTIVE REMOVAL OF GOLD FROM A LEAD FRAME  
A method of packaging an integrated circuit, including providing a lead frame having lead fingers, where the lead frame has a gold layer thereon on a top surface and a bottom surface. An...
US20090121330 Clip Mount For Integrated Circuit Leadframes  
A leadframe having a die thereon connects a high current conductive area on the die to a leadframe contact using copper clip that include a structure portion that is received with a recess-like...
US20070105280 BRACE FOR WIRE LOOP  
A method of connecting a lead frame (12) lead finger (16a) to a bond pad (18a) on an integrated circuit (IC) die (10) includes bonding a first bonding wire (20a) from the lead finger (16a) to an...
US20070031997 Jig and vacuum equipment for surface adhesion and adhesion method using the vacuum operative adhesion  
Provided is a jig which can be used in a process of adhering a adhering object to a to-be adhered object in a vacuum atmosphere, and vacuum equipment for use in the adhering process. The jig...
US20150206768 METHOD AND SYSTEM FOR CO-PACKAGING GALLIUM NITRIDE ELECTRONICS  
A method of fabricating an electronic package includes providing a package comprising a leadframe and a plurality of pins and providing a gallium nitride (GaN) transistor comprising a drain...
US20110156033 METHOD AND SYSTEM FOR TRACING DIE AT UNIT LEVEL  
A method and system for tracing die at unit level, comprising: assigning a first identification to a support member including a plurality of die support units; generating a second identification...
US20090166826 LEAD FRAME DIE ATTACH PADDLES WITH SLOPED WALLS AND BACKSIDE GROOVES SUITABLE FOR LEADLESS PACKAGES  
Disclosed are die paddle structures for leadframes and methods of attaching die to the die paddles. An exemplary die paddle comprises a sloped wall disposed around an attachment area for a die,...
US20090065916 SEMICONDUCTOR DIE MOUNT BY CONFORMAL DIE COATING  
A conformal coating on a semiconductor die provides adhesion between the die and a support. No additional adhesive is necessary to affix the die on the support. The conformal coating protects the...
US20110108966 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CONCAVE TRENCHES AND METHOD OF MANUFACTURE THEREOF  
A method of manufacture of an integrated circuit packaging system includes: providing a conductive layer having a first surface and a second surface; forming first concave trenches in the first...
US20080116587 CONDUCTOR POLYMER COMPOSITE CARRIER WITH ISOPROPERTY CONDUCTIVE COLUMNS  
A carrier comprises a metallic panel, a conductive column, a circuit, and an electrically insulating filling. The conductive column is within the panel and travels from a first surface to a second...
US20130344660 HEATSINK ATTACHMENT MODULE  
An assembly process for a heatsink attachment module for a chip packaging apparatus is provided and includes attaching a semiconductor chip to a substrate to form a module subassembly, placing a...
US20120241927 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH TRANSPARENT ENCAPSULATION AND METHOD OF MANUFACTURE THEREOF  
A method of manufacture of an integrated circuit packaging system includes: forming a substrate having a redistribution line thereon; mounting an integrated circuit to the substrate; and molding a...
US20090026592 SEMICONDUCTOR DIES WITH RECESSES, ASSOCIATED LEADFRAMES, AND ASSOCIATED SYSTEMS AND METHODS  
Semiconductor dies with recesses, associated leadframes, and associated systems and methods are disclosed. A semiconductor system in accordance with one embodiment includes a semiconductor die...
US20140138803 CHIP ARRANGEMENTS AND METHODS FOR MANUFACTURING A CHIP ARRANGEMENT  
A chip arrangement is provided, the chip arrangement including: a carrier; a chip disposed over the carrier, the chip including one or more contact pads, wherein a first contact pad of the one or...
US20140138706 ELECTRONIC CIRCUIT, PRODUCTION METHOD THEREOF, AND ELECTRONIC COMPONENT  
An electronic circuit according to this invention includes a printed circuit board and an electronic component that is soldered onto the printed circuit board. The electronic component is a flat...
US20110147906 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH EMBEDDED INTERCONNECT AND METHOD OF MANUFACTURE THEREOF  
A method of manufacture of an integrated circuit packaging system includes: providing an integrated circuit with an adhesive attached thereto; connecting the integrated circuit and a plated...
US20090224382 SEMICONDUCTOR PACKAGE WITH MOLD LOCK VENT  
A semiconductor package including a leadframe having first and second major surfaces and a mold lock opening extending between the first and second major surfaces. The semiconductor package...
US20090294939 LEAD FRAME AND SEMICONDUCTOR DEVICE UTILIZING THE SAME  
A lead frame and semiconductor device providing improved bond strength from wave bonding such as of wires in lead frames manufactured with depressed inner leads. The lead frame comprises an outer...
US20100072591 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH ANTI-PEEL PAD  
An integrated circuit package system includes: forming an anti-peel pad having both a concave ring and an external terminal with the concave ring, having a peripheral wall, surrounding the...
US20090051017 Lead Frame with Non-Conductive Connective Bar  
An electronic component includes a lead frame, a semiconductor chip and an encapsulating body. The lead frame includes a heat spreader area, a plurality of conductive lead fingers, at least one...
US20090206457 RESIN MOLDING PART AND MANUFACTURING METHOD THEREOF  
A primary molding product is formed by integrally forming a first lead frame and a second lead frame with a primary molding resin portion. In addition, in order to prevent separation of the first...
US20120098127 POWER/GROUND LAYOUT FOR CHIPS  
Embodiments of the present disclosure provide a chip that comprises a base metal layer formed over a first semiconductor die and a first metal layer formed over the base metal layer. The first...