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US20090321923 MAGNETIC PARTICLE-BASED COMPOSITE MATERIALS FOR SEMICONDUCTOR PACKAGES  
A semiconductor package is described. The semiconductor package includes a substrate and an integrated heat spreader disposed above and coupled with the substrate. A cavity is disposed between the...
US20090321901 THERMALLY BALANCED HEAT SINKS  
According to example embodiments, a device configured to dissipate heat from a first chip and a second chip on a multi-chip package includes a primary heat sink configured to contact an upper...
US20090321922 SELF-HEALING THERMAL INTERFACE MATERIALS FOR SEMICONDUCTOR PACKAGES  
A semiconductor package is described. The semiconductor package includes an internal housing and a semiconductor die coupled with the internal housing by a layer of self-healing thermal interface...
US20090315172 Semiconductor chip assembly  
A semiconductor chip assembly includes a semiconductor chip and a pyrolytic graphite element that is an electrode that is electrically connected to and provides electrical conduction of current...
US20090315173 HEAT-TRANSFER STRUCTURE  
An apparatus 100 comprising a first substrate 130 having a first surface 125, a second substrate 132 having a second surface 127 facing the first surface and an array 170 of metallic...
US20090317947 Semiconductor package with heat sink, stack package using the same and manufacturing method thereof  
A semiconductor package may include a heat sink. The heat sink may be disposed above and spaced apart from a substrate, which may support a semiconductor chip. The heat sink may have a hole. A...
US20090309213 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME  
A semiconductor chip is mounted on a heat sink disposed inside a through-hole of a wiring board, electrodes of the semiconductor chip and connecting terminals of the wiring board are connected by...
US20090309215 SEMICONDUCTOR MODULE AND METHOD FOR FABRICATING SEMICONDUCTOR MODULE  
A semiconductor module ( 10 ) includes a heat sink ( 1 ), an electronic component ( 2 ), a semiconductor device ( 3 ), and a thermally-conductive sheet member ( 4 ). The thermally-conductive sheet...
US20090294956 Cooling fin and package substrate comprising the cooling fin and manufacturing method thereof  
Disclosed herein is a cooling fin, which is excellent in cooling performance and is simply manufactured, a package substrate comprising the cooling fin, and a manufacturing method thereof. Fireable...
US20090294947 CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF  
A chip package structure includes a substrate, a chip, a thermal conductive layer, a plurality of signal contacts, and a molding compound. The substrate includes a plurality of first thermal...
US20090294936 FOUR MOSFET FULL BRIDGE MODULE  
A molded, leadless packaged semiconductor multichip module includes 100 has four mosfets 10, 12, 14, 16 for a full bridge circuit. The mosfets may include two N-channel and two P-channel...
US20090289352 SEMICONDUCTOR DEVICE AND A METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE  
A semiconductor device includes: a first substrate, having a grounding layer and holes formed therein for filling with an electroconductive material; a semiconductor chip over such first substrate;...
US20090289351 Semiconductor apparatus having both-side heat radiation structure and method for manufacturing the same  
A semiconductor apparatus having a first surface and a second surface opposite to the first surface includes: a semiconductor chip having a front side and a backside; a first heat radiation member...
US20090286359 OPTIMIZED LID ATTACH PROCESS FOR THERMAL MANAGEMENT AND MULTI-SURFACE COMPLIANT HEAT REMOVAL  
A multi-surface compliant heat removal process includes: identifying one or more components to share a heat rejecting device; applying non-adhesive film to the one or more components; identifying a...
US20090283880 Semiconductor Chip Package Assembly with Deflection- Resistant Leadfingers  
The invention relates to leadframes and semiconductor chip package assemblies using leadframes, and to methods for their assembly. A disclosed embodiment of the invention includes a semiconductor...
US20090283879 SEMICONDUCTOR DEVICE AND METHOD  
A chip carrier includes first, second and third layers with the second layer situated between the first and third layers. The first and third layers are formed of a first material and the second...
US20090278248 SEMICONDUCTOR DEVICE AND METHOD OF FABRICATION  
A semiconductor device includes a first die pad, a first semiconductor chip provided on the first die pad, a second die pad, a second semiconductor chip provided on the second die pad, and a...
US20090269888 CHIP-BASED THERMO-STACK  
A chip unit has a stack of at least two electronic chips stacked one on top of the other, a through-chip connection within the stack, the through-chip connection including a bounding material...
US20090267215 POWER MODULE SUBSTRATE, METHOD FOR MANUFACTURING POWER MODULE SUBSTRATE, AND POWER MODULE  
Disclosed is a power module having improved joint reliability. Specifically disclosed is a power module including a power module substrate wherein a circuit layer is brazed on the front surface of...
US20090269885 PACKAGED SEMICONDUCTOR DEVICE WITH DUAL EXPOSED SURFACES AND METHOD OF MANUFACTURING  
The invention claimed is a packaged semiconductor device with dual exposed surfaces and a method of manufacturing the device. A thermal clip and one or multiple source pads are exposed on opposite...
US20090250807 Electronic Component and Method for its Production  
An electronic component includes a number of leads and at least one cooling element. The bottom surface of the cooling element is exposed and the material of the cooling element is different from...
US20090243054 I/O CONNECTION SCHEME FOR QFN LEADFRAME AND PACKAGE STRUCTURES  
Methods, systems, and apparatuses for integrated circuit packages and lead frames are provided. A quad flat no-lead (QFN) package includes a plurality of peripherally positioned pins, a die-attach...
US20090243085 APPARATUS AND METHOD FOR ATTACHING A HEAT DISSIPATING DEVICE  
A microelectronic package is provided. The microelectronic package includes a heat dissipating device having a top side and a bottom side and a thermal interface material disposed adjacent to the...
US20090243057 Semiconductor Chip Package Assembly Method and Apparatus for Countering Leadfinger Deformation  
The invention provides semiconductor chip packages, tools, and methods for preventing and for correcting leadfinger deformation caused during wirebonding in semiconductor chip package...
US20090236733 BALL GRID ARRAY PACKAGE SYSTEM  
A ball grid array package system comprising: forming a package base including: fabricating a heat spreader having an access port, attaching an integrated circuit die to the heat spreader, mounting...
US20090230544 HEAT SINK STRUCTURE AND SEMICONDUCTOR PACKAGE AS WELL AS METHOD FOR CONFIGURING HEAT SINKS ON A SEMICONDUCTOR PACKAGE  
A heat sink structure according to the present invention is provided. The heat sink has a through opening extending from the upper surface through to the lower surface. A solder is disposed in the...
US20090230526 ADVANCED QUAD FLAT NO LEAD CHIP PACKAGE HAVING A PROTECTIVE LAYER TO ENHANCE SURFACE MOUNTING AND MANUFACTURING METHODS THEREOF  
A semiconductor package and related methods are described. In one embodiment, the package includes a die pad, multiple leads, a chip, a package body, and a protective layer. The die pad includes an...
US20090224398 SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME  
A semiconductor module and a method of manufacturing the same are disclosed including a semiconductor element having an electrode, a heat radiation plate placed in thermal contact with a main...
US20090224400 SEMICONDUCTOR ASSEMBLY HAVING REDUCED THERMAL SPREADING RESISTANCE AND METHODS OF MAKING SAME  
Semiconductor assemblies having reduced thermal spreading resistance and methods of making the same are described. In an example, a semiconductor device includes a primary integrated circuit (IC)...
US20090227070 Semiconductor device and method of manufacturing the same  
A semiconductor device and a method of manufacturing the same are disclosed. The semiconductor device includes: a casing, a board and a semiconductor chip. The chip includes: an element part; a...
US20090224393 SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF  
The present invention provides a semiconductor device capable of eliminating voltage (IR) drop of a semiconductor die inside the semiconductor device and a fabricating method of the semiconductor...
US20090218681 Carbon nanotube and metal thermal interface material, process of making same, packages containing same, and systems containing same  
A carbon nanotube (CNT) array is patterned on a substrate. The substrate can be a microelectronic die or a heat sink for a die. The patterned CNT array is patterned by using a patterned catalyst on...
US20090212403 THERMALLY ENHANCED MOLDED LEADLESS PACKAGE  
A molded leadless package (MLP) semiconductor device includes a heat spreader with a single connecting projection extending from an edge of a cap of the heat spreader to a leadframe. The heat...
US20090212417 Semiconductor Device  
A semiconductor device including: a heat sink, a die on the heat sink, resin encapsulating the die, and a mounting aperture in the resin having at least a segment between the heat sink and a first...
US20090212446 Semiconductor Device  
A semiconductor device including: a die pad, a die on the die pad, and resin encapsulating the die and forming an isolation thickness over the die pad, the resin including a mounting aperture and a...
US20090206438 Semiconductor component  
A semiconductor component and a method for manufacturing such a semiconductor component which has a resistance behavior which depends heavily on the temperature. This resistance behavior is...
US20090203172 Enhanced Die-Up Ball Grid Array and Method for Making the Same  
Methods of assembling a ball grid array (BGA) package is provided. One method includes providing a tape substrate that has a first surface and a second surface, attaching a first surface of a...
US20090200660 HEATPLATES FOR HEATSINK ATTACHMENT FOR SEMICONDUCTOR CHIPS  
An apparatus for heatsink attachment and a method for forming the apparatus. The apparatus includes a substrate, a semiconductor chip on top of and physically attached to the substrate, and a lid...
US20090194862 SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME  
There is provided a semiconductor module having improved heat radiation efficiency. A semiconductor module includes a semiconductor element, a pair of Cu heat radiating plates sandwiching the...
US20090189255 WAFER HAVING HEAT DISSIPATION STRUCTURE AND METHOD OF FABRICATING THE SAME  
A wafer having a heat dissipation structure is provided. The wafer having the heat dissipation structure includes a wafer and a number of metallic heat dissipation parts. The wafer has a first...
US20090185593 Method of manufacturing laser diode packages and arrays  
A laser diode package according to the present invention is composed of CTE mismatched components soldered together. The laser diode package includes a laser diode bar, at least one heat sink, and...
US20090184416 MCM packages  
An RF/IPD package with improved thermal management is described. The IPD substrate is attached to a system substrate with a thin RF chip mounted in the standoff between the IPD substrate and the...
US20090179324 Integrated circuit package and fabricating method thereof  
The invention discloses an integrated circuit package. The integrated circuit package comprises a substrate having a first surface and a second surface opposite thereto and a first hole passing...
US20090179323 LOCAL AREA SEMICONDUCTOR COOLING SYSTEM  
A system and method in which a semiconductor chip has electrically inactive metal-filled vias adjacent to a semiconductor device or devices to be cooled and the semiconductor device or devices are...
US20090166852 SEMICONDUCTOR PACKAGES WITH THERMAL INTERFACE MATERIALS  
A method comprises providing a layer of nano particles between a semiconductor die and a slug; and sintering the layer of nano particles to provide thermal interface material to bond the...
US20090166854 Thermal Interface with Non-Tacky Surface  
A thermal interface member includes a bulk layer and a surface layer that is disposed on at least a portion of a surface of the bulk layer. The surface layer is highly thermally conductive, has a...
US20090166850 High-Power Semiconductor Die Packages With Integrated Heat-Sink Capability and Methods of Manufacturing the Same  
An exemplary semiconductor die package of the invention has a metal-oxide substrate disposed between a first surface of a semiconductor die and a heat-sinking component, with a conductive die clip...
US20090166849 SEMICONDUCTOR CHIP  
A semiconductor chip includes a die mounted on a packaging substrate. The die includes a semiconductor substrate; inter-metal dielectric layers on the semiconductor substrate; levels of metal...
US20090161709 MULTICHIP PACKAGE, METHODS OF MANUFACTURE THEREOF AND ARTICLES COMPRISING THE SAME  
Disclosed herein is a multichip package comprising an optoelectronics assembly; a socket that houses the optoelectronics assembly; the socket being in electrical communication with the...
US20090154106 DOUBLE BONDED HEAT DISSIPATION  
Embodiments described herein may include example embodiments of methods, apparatuses, devices, and/or systems for heat dissipation.
Matches 1 - 50 out of 192 1 2 3 4 >