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US20090321929 |
Standing chip scale package
A standing chip scale package is disclosed. The standing chip scale package provides electrical connection to bumped device contacts on both sides of the chip. The package is coupleable to a...
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US20090321896 |
SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
There is provided a semiconductor device 10 including a solder resist 16 for protecting a wiring pattern 14 electrically connected to a semiconductor chip 11 via an internal connection...
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US20090325346 |
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
The present invention provides a semiconductor device that includes: stacked semiconductor chips, each semiconductor chip including a semiconductor substrate and a first insulating layer that is...
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US20090311830 |
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
A semiconductor chip, semiconductor package including the same, and a method of manufacturing the semiconductor chip and semiconductor package to block up electrical contacts between bonding wires...
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US20090309217 |
FLIP-CHIP INTERCONNECTION WITH A SMALL PASSIVATION LAYER OPENING
A flip-chip electrical coupling ( 100, 200, 300 ) is formed between first and second electrical components ( 110, 180; 410, 480 ). The coupling ( 100, 200, 300 ) includes a bump ( 240, 340 ) and a...
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US20090305464 |
Array-Processed Stacked Semiconductor Packages
One embodiment of the invention is a semiconductor system ( 1400 ) of arrays ( 1401, 1402 , etc.) of packaged devices. Each array includes a sheet-like substrate ( 1411, 1412 , etc.) made of...
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US20090294779 |
Electronic element wafer module, method for manufacturing an electronic element wafer module, electronic element module,and electronic information device
An electronic element wafer module according to the present invention is provided, in which a translucent support substrate for covering and protecting a plurality of electronic elements is...
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US20090294930 |
Semiconductor packages having electromagnetic interference-shielding function, manufacturing method thereof and jig
The present invention relates to relates to a semiconductor package having a function of shielding electromagnetic interference (EMI), a manufacturing method thereof and a jig, and more...
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US20090294958 |
WAFER LEVEL REDISTRIBUTION USING CIRCUIT PRINTING TECHNOLOGY
Methods, systems, and apparatuses for wafer-level integrated circuit (IC) packages are described. A wafer has a surface defined by a plurality of integrated circuit regions Each integrated circuit...
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US20090298231 |
Cmos process for fabrication of ultra small or non standard size or shape semiconductor die
A method for the singulation of integrated circuit die, the method including: etching a semiconductor layer disposed on a silicon oxide dielectric layer, thereby forming a trench defining a...
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US20090294965 |
Method of Manufacturing A Semiconductor Device
Chipping of semiconductor chips is to be prevented. A semiconductor device comprises a semiconductor chip having a main surface, a plurality of pads formed over the main surface, a rearrangement...
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US20090298232 |
METHOD OF FORMING A LEADED MOLDED ARRAY PACKAGE
In one embodiment, a method for forming a leaded molded array package includes placing a lead frame assembly into a molding apparatus having lead cavities. The method further includes forming seals...
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US20090289345 |
ELECTRONIC DEVICE PACKAGE AND FABRICATION METHOD THEREOF
An electronic device package and a fabrication method thereof are provided. The fabrication method includes providing a semiconductor substrate containing a plurality of chips having a first...
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US20090289339 |
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
A semiconductor package includes a carrier, a chip, a stiffener and an encapsulant. The chip is disposed on the carrier. The stiffener is disposed around the chip, directly contacts the carrier,...
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US20090289338 |
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
A semiconductor package includes a carrier, a chip, a stiffener and an encapsulant. The chip is disposed on the carrier. The stiffener is disposed around the chip, directly contacts the carrier,...
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US20090291515 |
Semiconductor device and a semiconductor device manufacturing method
A semiconductor device for fingerprint sensors reduces a mounting area of the semiconductor device and improves a processing capacity of assembling and testing process. The semiconductor device has...
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US20090291529 |
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
A semiconductor device manufacturing method comprising the steps of providing a matrix substrate having a main surface with plural device areas formed thereon, fixing plural semiconductor chips to...
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US20090289358 |
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND SUBSTRATE
A semiconductor device includes a substrate and a plurality of bumps. The substrate is compartmentalized into a bump-free area provided along four sides of the substrate and a bump area which is...
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US20090286357 |
METHOD OF MANUFACTURING A SEMICONDUCTOR STRUCTURE
A method of manufacturing a semiconductor structure. One embodiment produces a substrate having at least two semiconductor chips embedded in a molded body. A layer is applied over at least one main...
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US20090286354 |
SEMICONDUCTOR CHIP HAVING GETTERING LAYER, AND METHOD FOR MANUFACTURING THE SAME
In a semiconductor chip A wherein an element layer 2 having transistors and the like is formed on the front face, and the back face is joined to an underlying member, such as a package substrate,...
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US20090278167 |
Semiconductor device including a plurality of chips and method of manufacturing semiconductor device
A semiconductor device includes a first chip and a second chip. The first chip includes a first conductivity type channel power MOSFET. The second chip includes a second conductivity type channel...
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US20090267202 |
SEMICONDUCTOR PACKAGE
A semiconductor package includes a semiconductor chip, a number of pads, a number of lead bars and an encapsulation material. The semiconductor chip has an upper surface and an opposite bottom...
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US20090267230 |
PACKAGE STRUCTURE FOR INTEGRATED CIRCUIT DEVICE AND METHOD OF THE SAME
The present invention discloses a package structure for an integrated circuit device and method for manufacturing the same. The method includes providing a wafer with multiple integrated circuit...
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US20090261481 |
WAFER LEVEL PACKAGE AND METHOD OF FABRICATING THE SAME
Provided are a wafer level package in which a communication line can be readily formed between an internal device and the outside of the package, and a method of fabricating the wafer level...
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US20090261468 |
SEMICONDUCTOR MODULE
A semiconductor module. One embodiment provides at least two semiconductor chips placed on a carrier. The at least two semiconductor chips are then covered with a molding material to form a molded...
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US20090261414 |
Semiconductor Device and Method for Manufacturing the Same
An object is to improve water resistance and reliability of a semiconductor device by reducing the degree of peeling of a film. In a semiconductor device, a first inorganic insulating layer, a...
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US20090256229 |
Semiconductor Package, Method for Manufacturing the Same, Semiconductor Module, and Electronic Device
In a camera module ( 1 ) of the present invention, a lens member ( 20 ) is attached to a semiconductor package ( 10 ). The semiconductor package ( 10 ) includes: an image sensor ( 11 ) mounted on a...
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US20090258459 |
Packaged System of Semiconductor Chips Having a Semiconductor Interposer
A semiconductor system ( 200 ) of one or more semiconductor interposers ( 201 ) with a certain dimension ( 210 ), conductive vias ( 212 ) extending from the first to the second surface, with...
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US20090252931 |
REINFORCED ASSEMBLY CARRIER AND METHOD FOR MANUFACTURING THE SAME AS WELL AS METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGES
A reinforced assembly carrier is provided. A supporting frame made of molding compound is formed on the edge area of the upper surface and/or on the edge area of the lower surface of the assembly...
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US20090253231 |
ADHESIVE SHEET FOR LASER DICING AND ITS MANUFACTURING METHOD
An adhesive sheet for laser dicing is used for dicing a workpiece into individual chips by light absorption ablation of laser beam and has at least an adhesive layer on one side of a base material...
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US20090251878 |
Electronic Assembly and Method for Making Electronic Devices
An electronic assembly includes: a circuit substrate with a first mounting surface that has a plurality of spaced apart first mounting regions and at least one second mounting region spaced apart...
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US20090243095 |
SUBSTRATE, MANUFACTURING METHOD THEREOF, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
A substrate on which an IC element is fixed includes: a plurality of metal posts arranged in a plurality of columns in a lengthwise direction and in a plurality of rows in a crosswise direction...
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US20090246915 |
Adhesive Composition, Adhesive Sheet and Production Method of Semiconductor Device
The object of the present invention is to provide an adhesive composition that enables to produce conforming products with a high manufacturing yield and without breaking or chipping of the chips...
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US20090246914 |
Semiconductor package and method of manufacturing the same
A package may include a semiconductor chip mounted on a film substrate. A method of manufacturing the same may involve providing a semiconductor chip. The semiconductor chip may include recesses...
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US20090243045 |
Through Hole Vias at Saw Streets Including Protrusions or Recesses for Interconnection
A semiconductor package includes a semiconductor die having a contact pad formed over a top surface of the semiconductor die. The semiconductor die may include an optical device. In one embodiment,...
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US20090243081 |
SYSTEM AND METHOD OF FORMING A WAFER SCALE PACKAGE
A system and method for forming a wafer level package (WLP) (i.e., wafer level chip size package) is disclosed. The WLP includes a silicon integrated circuit (IC) substrate having a plurality of...
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US20090246913 |
Adhesive Composition, Adhesive Sheet and Production Method of Semiconductor Device
The object of the present invention is to provide an adhesive composition that enables to produce conforming products with a high manufacturing yield and without breaking or chipping of the chips...
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US20090246912 |
METHOD OF PRODUCING SEMICONDUCTOR PACKAGES
Semiconductor chips are fixed to one of two opposite surfaces of a leadframe, and the leadframe is electrically connected to each semiconductor chip with wires. After having applied water-soluble...
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US20090236700 |
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
A semiconductor device includes a wiring board, a semiconductor element mounted on the wiring board, a sealing resin configured to cover the semiconductor element, a ground electrode having an end...
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US20090236749 |
ELECTRONIC DEVICE AND MANUFACTURING THEREOF
One aspect is a method including providing a carrier having a first conducting layer, a first insulating layer over the first conducting layer, and at least one through-connection from a first face...
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US20090236647 |
SEMICONDUCTOR DEVICE WITH CAPACITOR
An embodiment of the invention is a semiconductor structure, comprising: a semiconductor chip at least partially embedded within a support; and a capacitor disposed outside the lateral boundary of...
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US20090230530 |
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
A back side of the silicon semiconductor substrate is roughly ground and is finishing-ground by using a whetstone having a copper content of less than 1 ppm, the back side being an opposite side of...
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US20090230554 |
WAFER-LEVEL REDISTRIBUTION PACKAGING WITH DIE-CONTAINING OPENINGS
Methods, systems, and apparatuses for integrated circuit packages, and processes for forming the same, are provided. In one example, an integrated circuit (IC) package includes a thick film...
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US20090230541 |
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
A semiconductor device in which a chip is embedded in a wiring board and bump electrodes formed over the front surface of the semiconductor chip are flip-chip coupled to wiring formed in the wiring...
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US20090224381 |
DOUBLE-FACED ELECTRODE PACKAGE AND ITS MANUFACTURING METHOD
A dual-face package has an LSI chip sealed with a mold resin, and electrodes for external connections on both of the front face and the back face. The LSI chip is bonded onto the die pad of a...
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US20090227070 |
Semiconductor device and method of manufacturing the same
A semiconductor device and a method of manufacturing the same are disclosed. The semiconductor device includes: a casing, a board and a semiconductor chip. The chip includes: an element part; a...
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US20090224401 |
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
A semiconductor device comprises a package substrate, a semiconductor chip, a plurality of bump electrodes and one or more dummy chips. The semiconductor chip is mounted on one surface of the...
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US20090227069 |
Method and device for fabricating an assembly of at least two microelectronic chips
The method enables an assembly of chips, initially formed on a wafer, to be formed. Each chip comprises two parallel main faces joined by side faces. At least one of the side faces comprises at...
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US20090224404 |
Method And System For Fabricating Semiconductor Components With Through Interconnects
A method for fabricating a semiconductor component with through interconnects can include the steps of providing a semiconductor substrate with substrate contacts, and forming openings from a...
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US20090227071 |
SEMICONDUCTOR MODULE
A module having a semiconductor chip with a first contact element on a first main surface and a second contact element on a second main surface is disclosed. The semiconductor chip is arranged on a...
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