Matches 1 - 41 out of 41
Match Document Document Title
US20090294935 SEMICONDUCTOR PACKAGE SYSTEM WITH CUT MULTIPLE LEAD PADS  
A semiconductor package system includes: providing a leadframe having inner frame bars, outer frame bars, a die pad, tiebars, and rows of leads, the inner frame bars being coplanar with outer frame...
US20090286356 STACKED MASS STORAGE FLASH MEMORY PACKAGE  
A semiconductor device is formed of two or more dice of similar dimensions and bond pad arrangement, in which bond pads are located in fields along less than three edges of the active surface of...
US20090236703 Chip package structure and the method thereof  
A chip package structure includes a chip-placed frame that having an adhesive layer thereon; a chip includes a plurality of pads on an active surface thereon, and is provided on the adhesive layer;...
US20090233401 THIN QUAD FLAT PACKAGE WITH NO LEADS (QFN) FABRICATION METHODS  
Embodiments of the present invention include a method of packaging semiconductor devices. The method comprises the steps of molding a surface of a wafer, sawing the wafer into individual devices,...
US20090230527 Multi-chips package structure and the method thereof  
A multi-chips package structure is provided, which includes a chip-placed frame having a plurality of chip-placed areas thereon, and two adjacent chip-placed areas is connected by a plurality of...
US20090194868 PANEL LEVEL METHODS AND SYSTEMS FOR PACKAGING INTEGRATED CIRCUITS WITH INTEGRATED HEAT SINKS  
Panel level methods and arrangements are described for attaching heat sinks in panel form with dice attached to a leadframe panel. Various methods produce integrated circuit packages each having an...
US20090166820 TSOP LEADFRAME STRIP OF MULTIPLY ENCAPSULATED PACKAGES  
A method of fabricating a semiconductor leadframe package from a strip including multiply encapsulated leadframe packages, and a leadframe package formed thereby are disclosed. An entire row or...
US20090166843 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE  
A semiconductor device includes a semiconductor chip including a first conducting element, and a second conducting element arranged outside the semiconductor chip and electrically connected to the...
US20090091007 Semiconductor Device Having Grooved Leads to Confine Solder Wicking  
A packaged surface-mount semiconductor device has the outer, un-encapsulated lead segments structured in five adjoining portions: The first portion protrudes from the encapsulation about...
US20090079050 AIR CAVITY PACKAGE FOR FLIP-CHIP  
According to an example embodiment, there is method ( 100 ) for manufacturing a semiconductor device in an air-cavity package. For a device die having an active surface, a lead frame is provided (...
US20090068793 MANUFACTURING PROCESS FOR A CHIP PACKAGE STRUCTURE  
A manufacturing process for a chip package structure is provided. First, a patterned conductive layer having a plurality of first openings and a first patterned solder resist layer on the patterned...
US20090057851 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE  
Provided is a method of manufacturing a semiconductor device including: arranging multiple dies planarly between a first lead frame plate and a second lead frame plate, which face each other, to...
US20090053855 Indented lid for encapsulated devices and method of manufacture  
A method for providing improved gettering in a vacuum encapsulated device is described. The method includes forming a plurality of small indentation features in a device cavity formed in a lid...
US20090039485 THERMALLY ENHANCED BALL GRID ARRAY PACKAGE FORMED IN STRIP WITH ONE-PIECE DIE-ATTACHED EXPOSED HEAT SPREADER  
Methods, systems, and apparatuses for integrated circuit packages, such as ball grid array packages, and processes for assembling the same, are provided. A first strip includes an array of package...
US20090035890 TECHNIQUES FOR DIRECT ENCASEMENT OF CIRCUIT BOARD STRUCTURES  
A technique for processing an electronic apparatus (e.g., manufacturing an assembled circuit board, treating an assembled circuit board, etc.) involves applying encasement material to an area of...
US20090026594 Thin Plastic Leadless Package with Exposed Metal Die Paddle  
A method of making electronic packages includes providing a leadframe strip that includes a plurality of leadframes, wherein the leadframes comprise a plurality of leads, etching a surface of each...
US20090023248 METHOD OF PACKAGING A SEMICONDUCTOR DIE  
A method of packaging a semiconductor die includes the steps of providing a flange ( 110 ), coupling one or more active die ( 341 ) to the flange with a lead-free die attach material ( 350 ),...
US20080296746 LEAD FRAME AND MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD THEREOF  
The present invention includes a plurality of mounting portions on which a semiconductor element is mounted, a plurality of electrodes to which the semiconductor elements that are mounted on each...
US20080290484 Leadframe Strip and Mold Apparatus for an Electronic Component and Method of Encapsulating an Electronic Component  
A leadframe strip comprises a plurality of units arranged in a line. Each unit provides two component positions, each having a chip support substrate. The chip support substrates of the two...
US20080286901 Method of Making Integrated Circuit Package with Transparent Encapsulant  
A method for making an IC package with transparent encapsulant includes providing a leadframe, where the leadframe includes a first die pad and a second die pad, disposing a first die on the first...
US20080272470 Same Size Through-Hole Via Die Stacked Package  
A semiconductor package includes a substrate or leadframe structure. A plurality of interconnected dies, each incorporating a plurality of through-hole vias (THVs) disposed along peripheral...
US20080265412 Semiconductor device and method of manufacturing thereof  
A package substrate has wires that electrically connect a semiconductor chip, and surface side terminals that are solid cylindrical and whose one ends are electrically connected to the wires. The...
US20080265395 Semiconductor device and method of fabricating the semiconductor device  
A semiconductor device includes: a package substrate that includes a recessed portion, with electrode pads that are electrically connected to electrodes of the semiconductor chip being formed...
US20080258279 LEADFRAME FOR LEADLESS PACKAGE, STRUCTURE AND MANUFACTURING METHOD USING THE SAME  
A leadframe employed by a leadless package comprises a plurality of package units and an adhesive tape. Each of the package units has a die pad with a plurality of openings and a plurality of pins...
US20080230880 Leadframe Array with Riveted Heat Sinks  
The invention provides improved rivet and heat sink arrangements in leadframes and IC packages. The invention discloses a semiconductor device leadframe array with numerous leadframes having...
US20080197459 ENCAPSULATED CHIP SCALE PACKAGE HAVING FLIP-CHIP ON LEAD FRAME STRUCTURE AND METHOD  
In one embodiment, an encapsulated electronic package includes a semiconductor chip having patterned solderable pads formed on a major surface. During an assembly process, the patterned solderable...
US20080157302 Stacked-package quad flat null lead package  
A method, apparatus, and system relating to an IC package. The method includes providing a leadframe including a die pad for receiving a die and a plurality interconnect pillars, attaching a die to...
US20080150094 Flip chip shielded RF I/O land grid array package  
A novel apparatus and method for providing a radio frequency (“RF”) input/output (“I/O”) land grid array (“LGA”) package structure. The package structure comprises grounded shield rings...
US20080153208 Semiconductor Package Block Mold and Method  
Semiconductor device packages and methods related to their manufacture are described in which improved block molds and block-molding methods alleviate warpage in semiconductor device manufacturing...
US20080119012 Mold array process for chip encapsulation and substrate strip utilized  
A MAP (Mold Array Process) for chip encapsulation is disclosed in this invention. First, a substrate strip having a plurality of units is provided. A plurality of chips are disposed on the...
US20080093715 LEADFRAME AND MOLD COMPOUND INTERLOCK IN PACKAGED SEMICONDUCTOR DEVICE  
An interference interlock between leadframe features and a mold compound is provided in a packaged semiconductor device by exposing at least one predetermined surface area to an etching process...
US20080096319 SAWN POWER PACKAGE AND METHOD OF FABRICATING SAME  
In one embodiment of the invention, a lead-frame is designed for use in IC packages such as those conforming to the TO 220 standard or other standards for power packages. The device areas of the...
US20080081399 Manufacturing Method of Semiconductor Apparatus  
A manufacturing method of a semiconductor apparatus, comprising the steps of: forming a plurality of leads corresponding to a plurality of semiconductor apparatuses on an electrically conductive...
US20080076209 METHOD FOR PRODUCING FLEXIBLE INTEGRATED CIRCUITS WHICH MAY BE PROVIDED CONTIGUOUSLY  
The present invention provides a method for producing integrated circuits which are mechanically flexible and can be provided contiguously on a common flexible carrier substrate. The method...
US20080067648 Locking Feature and Method for Manufacturing Transfer Molded IC Packages  
The invention discloses integrated circuits (ICs), molded IC packages, and to leadframe arrays, package arrays and methods for their manufacture. Leadframe arrays and package arrays used for the...
US20080036055 Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant  
A lead frame for making a semiconductor package is disclosed. The leadframe's leads include a lead lock provided at a free end of each inner lead that is adapted to increase a bonding force of the...
US20080036034 Lead Frame with Included Passive Devices  
An semiconductor device package ( 10 ) includes a semiconductor device (die) ( 12 ) and passive devices ( 14 ) electrically connected to a common lead frame ( 17 ). The lead frame ( 17 ) is formed...
US20080029857 Semiconductor device comprising an excess resin portion, manufacturing method thereof, and apparatus for manufacturing semiconductor device comprising a excess resin portion  
A partly finished product of a semiconductor device includes a resin body encapsulating a semiconductor chip, first and second leads extended outwardly from the resin body, a dam bar connected...
US20080023806 STRESS-FREE LEAD FRAME  
The present invention relates to a stress-free lead frame ( 1 ) for a semiconductor. The stress-free lead frame ( 1 ) is provided with a stress-relief means ( 15 ) and an interlocking means ( 16 )...
US20080009153 Semiconductor package and method of making the same  
A semiconductor package and its fabrication method are disclosed. The fabrication method has the steps of: providing at least a lead frame having a plurality of terminal leads formed with flat...
US20080009096 PACKAGE-ON-PACKAGE AND METHOD OF FABRICATING THE SAME  
A package-on-package and a method of fabricating the same capable of increasing mounting density of a semiconductor package are provided. The method includes providing a flexible substrate first,...
Matches 1 - 41 out of 41