Matches 1 - 50 out of 230 1 2 3 4 5 >
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US20090315190 WIRING BOARD, SEMICONDUCTOR DEVICE USING WIRING BOARD AND THEIR MANUFACTURING METHODS  
A wiring board has an insulating layer, a plurality of wiring layers formed in such a way as to be insulated from each other by the insulating layer, and a plurality of vias formed in the...
US20090315166 STACKED SEMICONDUCTOR DEVICES AND A METHOD FOR FABRICATING THE SAME  
The present invention provides a semiconductor device that includes semiconductor packages arranged in a stacked configuration. A plurality of leads are drawn from the stacked semiconductor...
US20090317944 MOLDED RECONFIGURED WAFER, STACK PACKAGE USING THE SAME, AND METHOD FOR MANUFACTURING THE STACK PACKAGE  
A stack package includes at least two stacked package units. Each package unit comprises semiconductor chips having bonding pads on upper surfaces thereof; a molding part formed to surround side...
US20090315170 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH EMBEDDED CIRCUITRY AND POST, AND METHOD OF MANUFACTURE THEREOF  
A method of manufacture of an integrated circuit packaging system includes: providing a shaped platform with a conductive post; mounting the shaped platform with the conductive post over a...
US20090311828 APPARATUS AND METHODS FOR CONSTRUCTING SEMICONDUCTOR CHIP PACKAGES WITH SILICON SPACE TRANSFORMER CARRIERS  
Apparatus and methods are provided for high density packaging of semiconductor chips using silicon space transformer chip level package structures, which allow high density chip interconnection...
US20090309237 SEMICONDUCTOR PACKAGE SYSTEM WITH SUBSTRATE HAVING DIFFERENT BONDABLE HEIGHTS AT LEAD FINGER TIPS  
A semiconductor package system is provided. A substrate having a die attach paddle is provided. A first plurality of leads is provided around the die attach paddle having a first plurality of lead...
US20090310322 Semiconductor Package  
A substrate includes a number of protruding contact elements. An electrical circuit with electrical contact elements is provided on the substrate. A layer of substrate adhesive is provided on the...
US20090309212 Semiconductor Device and Method of Forming Stress Relief Layer Between Die and Interconnect Structure  
A semiconductor device is made by forming a first conductive layer over a sacrificial carrier. A conductive pillar is formed over the first conductive layer. An active surface of a semiconductor...
US20090311827 Adhesive for electronic components, method and for manufacturing semiconductor chip laminate, and semiconductor device  
It is an object of the present invention to provide: an adhesive for electronic parts that makes it possible to accurately maintain a distance between electronic parts upon joining electronic parts...
US20090305462 COMPACT MULTI-PORT CAM CELL IMPLEMENTED IN 3D VERTICAL INTEGRATION  
A multi-ported CAM cell in which the negative effects of increased travel distance have been substantially reduced is provided. The multi-ported CAM cell is achieved in the present invention by...
US20090302447 SEMICONDUCTOR ARRANGEMENT HAVING SPECIALLY FASHIONED BOND WIRES AND METHOD FOR FABRICATING SUCH AN ARRANGEMENT  
A semiconductor arrangement includes first and second integrated circuits (dies), an electrically conductive intermediate element, and one or more bond conductors. The first and the second...
US20090294944 SEMICONDUCTOR DEVICE ASSEMBLY AND METHOD THEREOF  
A semiconductor device assembly includes a first semiconductor die, a second semiconductor die, at least one semiconductor package component or another semiconductor die, a first conductive element...
US20090294945 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR  
The mounting height of a semiconductor device is reduced. A wiring substrate has an upper surface with multiple bonding leads formed therein and a lower surface with multiple lands formed therein....
US20090294916 BONDING METHOD FOR THROUGH-SILICON-VIA BASED 3D WAFER STACKING  
There is described a hybrid bonding method for through-silicon-via based wafer stacking. Patterned adhesive layers are provided to join together adjacent wafers in the stack, while solder bondng is...
US20090294933 Lead Frame and Chip Package Structure and Method for Fabricating the Same  
The present invention discloses a lead frame and chip package structure, which comprises a plurality of leads including a plurality of inner leads and a plurality of outer leads; a plurality of...
US20090289361 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE  
A semiconductor device includes at least a wiring board, a semiconductor chip that is mounted on one face side of the wiring board, connection pads that are formed on the one face side of the...
US20090290271 Multi-chip module package including external and internal electrostatic discharge protection circuits, and/or method of making the same  
Certain example embodiments disclosed herein relate to multi-chip module (MCM) packages that include external and internal electrostatic discharge (ESD) protection circuits, and/or methods of...
US20090289374 SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE MODULE, AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE MODULE  
A semiconductor device can include a plurality of semiconductor elements. The characteristics of each of the semiconductor elements can be easily tested during the production of the semiconductor...
US20090289331 Semiconductor chip and semiconductor device, and method of manufacturing the same  
At least a part of an outer edge of a surface where a circuit forming region, for example, of a semiconductor substrate that forms a semiconductor chip is arranged (a region surrounded by a scribe...
US20090289318 ELECTRONICS DEVICE PACKAGE AND FABRICATION METHOD THEREOF  
Embodiments provide an electronic device package and a method for fabricating thereof. A semiconductor chip has a substrate. A supporting brick is separated from the substrate by a certain...
US20090289336 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THEREOF  
The present invention provides a semiconductor device including: a semiconductor chip; a lead frame provided with a recessed portion on at least one of an upper surface or a lower surface thereof,...
US20090283891 ELASTICALLY DEFORMABLE INTEGRATED-CIRCUIT DEVICE  
The present invention relates to an integrated-circuit device comprising a multitude of separate rigid substrate islands ( 202 to 208 ) with circuit elements, a respective substrate island being...
US20090286354 SEMICONDUCTOR CHIP HAVING GETTERING LAYER, AND METHOD FOR MANUFACTURING THE SAME  
In a semiconductor chip A wherein an element layer 2 having transistors and the like is formed on the front face, and the back face is joined to an underlying member, such as a package substrate,...
US20090283906 SEMICONDUCTOR DEVICE, METHOD FOR MOUNTING SEMICONDUCTOR DEVICE, AND MOUNTING STRUCTURE OF SEMICONDUCTOR DEVICE  
A semiconductor device of the present invention includes a semiconductor substrate on which an electrode and a Cu bump are stacked, and on the electrode and the Cu bump, a metal bump layer is...
US20090283896 Package structure and method  
A semiconductor die has a surface and an active region on the surface. A thick-film coating is applied to the surface of the semiconductor die to cover only a portion or entire of the active region...
US20090280601 METHOD AND APPARATUS FOR FACILITATING PROXIMITY COMMUNICATION AND POWER DELIVERY  
The described embodiments provide a system that facilitates inter-chip alignment for proximity communication and power delivery. The system includes a first integrated circuit chip and a second...
US20090278243 STACKED TYPE CHIP PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME  
A stacked type chip package structure including a chip carrier, a first chip, a second chip, a third chip, and an insulating material is provided. The chip carrier includes two die pads and a...
US20090273063 SEMICONDUCTOR DEVICE  
One embodiment provides a semiconductor device including a carrier, a first chip attached to the carrier, a structured dielectric coupled to the chip and to the carrier, and a conducting element...
US20090269882 ROTARY CHIP ATTACH  
A rotary chip attach process and manufacturing approach takes chips (e.g., integrated circuits (ICs)) from a wafer in a rotary process. A chip wafer with a positioning unit is placed over the top...
US20090267210 INTEGRATED CIRCUIT PACKAGE AND MANUFACTURING METHOD THEREOF  
An integrated circuit package and a manufacturing method thereof are provided. The package includes a die pad, a plurality of first and second contact pads, a first die, a second die and a molding...
US20090261476 Semiconductor device and manufacturing method thereof  
A semiconductor device and a manufacturing method thereof are disclosed. The method includes the steps of providing a carrier board having conductive circuits disposed thereon and a plurality of...
US20090258458 DFN semiconductor package having reduced electrical resistance  
A dual flat non-leaded semiconductor package is disclosed. A method of making a dual flat non-leaded semiconductor package includes forming a leadframe having a die bonding area with an integral...
US20090258459 Packaged System of Semiconductor Chips Having a Semiconductor Interposer  
A semiconductor system ( 200 ) of one or more semiconductor interposers ( 201 ) with a certain dimension ( 210 ), conductive vias ( 212 ) extending from the first to the second surface, with...
US20090256252 Semiconductor Die Packages With Multiple Integrated Substrates, Systems Using the Same, and Methods Using the Same  
An exemplary semiconductor die package is disclosed having one or more semiconductor dice disposed on a first substrate, one or more packaged electrical components disposed on a second substrate...
US20090256247 SEMICONDUCTOR DEVICE AND METHOD INCLUDING FIRST AND SECOND CARRIERS  
A semiconductor device and method. One embodiment provides an integral array of first carriers and an integral array of second carries connected to the integral array of first carriers. First...
US20090253230 METHOD FOR MANUFACTURING STACK CHIP PACKAGE STRUCTURE  
A method for manufacturing a stack chip package structure is disclosed. The method comprises: providing a first substrate; disposing a first chip on the first substrate; disposing a second chip and...
US20090250797 Multi-Chip Package  
A lead frame assembly includes at least one die paddle. The die paddle includes a first landing area for receiving a first semiconductor chip and a second landing area for receiving a second...
US20090243035 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME AND SEMICONDUCTOR DEVICE MOUNTING STRUCTURE  
In a semiconductor device that is formed by joining two semiconductor elements together to oppose device layers to each other, inductor patterns for transmitting and receiving a signal and feeding...
US20090243065 Semiconductor Device and Method for Manufacturing Semiconductor Device  
A semiconductor device ( 100 ) comprises a first resin substrate ( 101 ) on which a first semiconductor chip ( 125 ) is mounted a surface thereof; a second resin substrate ( 111 ) on which a second...
US20090243086 Enhanced Thermal Dissipation Ball Grid Array Package  
In a semiconductor chip, a thermal adhesive is used to bond an internal heat spreader to an active functional die. In an alternative embodiment a dummy die is place directly on top of the active...
US20090246910 Semiconductor device manufacturing method  
A semiconductor device manufacturing method includes the steps of preparing a semiconductor element having a first electrode, a second electrode, and a third electrode facing the first electrode...
US20090243061 Complex Semiconductor Packages and Methods of Fabricating the Same  
Disclosed are complex semiconductor packages, each including a large power module package which includes a small semiconductor package, and methods of manufacturing the complex semiconductor...
US20090236723 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE-IN-PACKAGE AND METHOD OF MANUFACTURE THEREOF  
A method of manufacture of an integrated circuit packaging system includes: providing a package substrate, having a component side and a system side; mounting a first integrated circuit die on the...
US20090239337 MICROELECTRONIC DEVICES, STACKED MICROELECTRONIC DEVICES, AND METHODS FOR MANUFACTURING MICROELECTRONIC DEVICES  
Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices are described herein. In one embodiment, a set of stacked microelectronic devices...
US20090236705 APPARATUS AND METHOD FOR SERIES CONNECTION OF TWO DIE OR CHIPS IN SINGLE ELECTRONICS PACKAGE  
An apparatus and method for a two semiconductor device package where the semiconductor devices are connected in electrical series. The first device is mounted P-side down on an electrically...
US20090236700 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME  
A semiconductor device includes a wiring board, a semiconductor element mounted on the wiring board, a sealing resin configured to cover the semiconductor element, a ground electrode having an end...
US20090239336 Semiconductor packages and methods of fabricating the same  
A semiconductor package and module, and methods of fabricating the same are provided. A method of fabricating a semiconductor package may include bonding rear surfaces of first and second...
US20090236702 SiP SUBSTRATE  
Disclosed in this specification is a system-in-a-package substrate that includes an interconnect substrate for permitting finely pitched connections to be made to an integrated circuit. The...
US20090230535 SEMICONDUCTOR MODULE  
A semiconductor module. In one embodiment, at least two semiconductor chips are placed on a carrier. The at least two semiconductor chips are then covered with a molding material. An exposed...
US20090230531 Semiconductor Package with Penetrable Encapsulant Joining Semiconductor Die and Method Thereof  
A semiconductor device is made by mounting a first semiconductor die to a first substrate, forming a first encapsulant over the first semiconductor die, and forming a second encapsulant over the...
Matches 1 - 50 out of 230 1 2 3 4 5 >