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US20130214296 HEAT SPREADING SUBSTRATE WITH EMBEDDED INTERCONNECTS  
Heat spreading substrate with embedded interconnects. In an embodiment in accordance with the present invention, an apparatus includes a metal parallelepiped comprising a plurality of wires inside...
US20140061901 Precise-Aligned Lock-And-Key Bonding Structures  
Copper (Cu)-to-Cu bonding techniques are provided. In one aspect, a bonding method is provided. The method includes the following steps. A first bonding structure is provided having at least one...
US20090152544 DISGUISING TEST PADS IN A SEMICONDUCTOR PACKAGE  
A method of forming a semiconductor package is disclosed including disguising the test pads. Test pads are defined in the conductive pattern of the semiconductor package for allowing electrical...
US20150084161 MIXED MODE RC CLAMPS  
A system interconnect includes a first resistor-capacitor (RC) clamp having a first RC time constant. The system interconnect also includes second RC clamps having a second RC time constant. The...
US20120135564 SOFT ERROR RATE MITIGATION BY INTERCONNECT STRUCTURE  
A method creates a structure that comprises a carrier connected to an integrated circuit chip by pillars and openings. Thus, in this structure, at least one conductive pillar extends a distance or...
US20140015133 SUPPLY VOLTAGE OR GROUND CONNECTIONS FOR INTEGRATED CIRCUIT DEVICE  
Embodiments disclosed herein may relate to supply voltage or ground connections for integrated circuit devices. As one example, two or more supply voltage bond fingers may be connected together...
US20130189812 COAXIAL PLATED THROUGH HOLES (PTH) FOR ROBUST ELECTRICAL PERFORMANCE  
In some embodiments, coaxial plated through holes (PTH) for robust electrical performance are presented. in this regard, an apparatus is introduced comprising an integrated circuit device and a...
US20140332841 HIGH VOLTAGE BREAKOVER DIODE HAVING COMPARABLE FORWARD BREAKOVER AND REVERSE BREAKDOWN VOLTAGES  
In a first embodiment, an ultra-fast breakover diode has a turn on time TON that is less than 0.3 microseconds, where the forward breakover voltage is greater than +400 volts and varies less than...
US20120193804 OHMIC CONNECTION USING WIDENED CONNECTION ZONES IN A PORTABLE ELECTRONIC OBJECT  
The invention relates to portable electronic objects comprising an integrated circuit chip, and a mounting having two connection terminals for a circuit, as well as to a method for manufacturing...
US20120104605 Chip Design having Integrated Fuse and Method for the Production Thereof  
A chip design (1) comprising an external supply connection (VBAT), an internal supply connection (VDD), an integrated circuit (2) that is coupled to the internal supply connection (VDD) for...
US20070141748 EXTENDED MAINFRAME DESIGNS FOR SEMICONDUCTOR DEVICE MANUFACTURING EQUIPMENT  
In a first aspect, a first mainframe is provided for use during semiconductor device manufacturing. The first mainframe includes (1) a sidewall that defines a central transfer region adapted to...
US20060157838 Multimedia card and transfer molding method  
A semiconductor card is made using a method which, in one molding step, forms a plastic body on a substrate attached to a surrounding frame by narrow connecting segments spanning a peripheral...
US20050287714 Enhancing epoxy strength using kaolin filler  
An embodiment of the present invention is a technique to provide a substrate with enhanced strength. A kaolin filler is added to an epoxy resin. The kaolin filler is mixed with the epoxy resin to...
US20120168948 COPPER PILLAR FULL METAL VIA ELECTRICAL CIRCUIT STRUCTURE  
An electrical interconnect including a first circuitry layer with a first surface and a second surface. At least a first dielectric layer is printed on the first surface of the first circuitry...
US20130127010 INTEGRATED CIRCUIT INCLUDING A DIFFERENTIAL POWER AMPLIFIER WITH A SINGLE ENDED OUTPUT AND AN INTEGRATED BALUN  
An integrated circuit, including, a die with an electronic circuit embedded thereon; wherein the electronic circuit includes a differential power amplifier and pads to electronically interface...
US20150037936 Strength of Micro-Bump Joints  
A device includes a work piece including a metal bump; and a dielectric layer having a portion directly over the metal bump. The metal bump and a surface of the portion of the dielectric layer...
US20100047961 Placement Of An Integrated Circuit  
Disclosed herein is a method of positioning and placing an integrated circuit on a printed circuit board. The integrated circuit comprises first geometrical elements. The first geometrical...
US20130004167 OPTICAL FRAME ATTACHED WITH ALIGNMENT FEATURES MICROFABRICTATED IN DIE  
A photonic device assembly including a photonic device fabricated on a chip substrate, the chip substrate having a physical alignment feature fabricated therein, and a frame to couple an external...
US20110275176 Method of Assembly and Assembly Thus Made  
An assembly (100) is provided comprising a first chip (20) and a second chip (30) which are interconnected through solder connections. These comprise, at the first chip, an underbump metallisation...
US20130062786 SOLDER MASK WITH ANCHOR STRUCTURES  
Various substrates or circuit boards for receiving a semiconductor chip and methods of processing the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming...
US20070262429 Perimeter stacking system and method  
A stacked module employs flexible circuitry to connect CSP integrated circuits. A flexible circuit with obverse and reverse sides is disposed between two CSPs oriented face-to-face with the flex...
US20140197882 SWITCHING DEVICE WITH RESISTIVE DIVIDER  
Embodiments provide a switching device including one or more field-effect transistors (FETs). In embodiments, a resistive divider comprising a first resistor and a second resistor may be coupled...
US20150191345 MEMS DEVICE AND METHOD OF MANUFACTURING  
A MEMS device is provided. The device includes a MEMS wafer, a top cap wafer and a bottom cap wafer. The top and bottom cap wafers are respectively bonded to first and second sides of the MEMS...
US20110198746 MEMS DEVICES  
A method of manufacturing a MEMS device comprises forming a MEMS device element (14). A sacrificial layer (20) is provided over the device element and a package cover layer (22) is provided over...
US20150028106 Method Of Manufacturing A Smart Card  
A method of manufacturing a smart card (20) embedded with an integrated circuit module (28) and an antenna coil (8) includes step (a), embedding an antenna coil (8) on a core sheet (6), (b),...
US20080197493 Integrated circuit including conductive bumps  
One embodiment provides an integrated circuit including an electrical contact and a conductive bump elongated via centrifugal forces. The conductive bump has a base and a top. The base is attached...
US20060160267 Under bump metallurgy in integrated circuits  
An integrated circuit package and method of manufacture is provided. A substrate having a number of contact pads exposed through a passivation layer thereon has a first under bump metallurgy layer...
US20140186999 WAFER LEVEL PACKAGING OF MICROBOLOMETER VACUUM PACKAGE ASSEMBLIES  
An apparatus for the wafer level packaging (WLP) of micro-bolometer vacuum package assemblies (VPAs), in one embodiment, includes a wafer alignment and bonding chamber, a bolometer wafer chuck and...
US20060138651 Native incorporation of RF ID technology for the tracking of electronic circuitry  
RF ID transmitter circuits are integrated into semiconductor chips during fabrication of the regular integrated circuits therein for providing identification capabilities for the semiconductor...
US20050099301 Method for fitting a transponder to a metal body, and a transponder module for carrying out the method  
A method for fitting a transponder with a chip and a coil to a metal body is disclosed. The coil is wound in the form of a bar and is electrically connected at its ends to the electrical...
US20080169566 Press-Fit Diode Having a Silver-Plated Wire Termination  
A press-fit diode, e.g., for rectifier applications, includes a diode chip, a base contact for pressing into a substrate, which base contact forms a first terminal of the press-fit diode, and a...
US20060199298 Creation of hermetically sealed dielectrically isolating trenches  
The invention relates to a method and an assembly for forming structures that are dielectrically insulated from each other by means of filled hermetically sealed isolation trenches for the...
US20090091024 Stable Gold Bump Solder Connections  
A metallic interconnect structure (200) for connecting a gold bump (205) and a copper pad (212), as used for example in semiconductor flip-chip assembly. A first region (207) of binary AuSn2...
US20070235848 Substrate having conductive traces isolated by laser to allow electrical inspection  
A semiconductor die substrate panel, and method of forming same, are disclosed wherein plating bars are severed for example by a laser after electroplating of the substrate. Severing the plating...
US20090170239 UTILIZING APERTURE WITH PHASE SHIFT FEATURE IN FORMING MICROVIAS  
A method, comprises drilling a set of one or more microvias in a semiconductor package with an aperture, wherein drilling the set of microvias comprises to use an aperture that has a phase shift...
US20110195543 FLIP-CHIP ASSEMBLY WITH ORGANIC CHIP CARRIER HAVING MUSHROOM-PLATED SOLDER RESIST OPENING  
Disclosed are embodiments of a flip-chip assembly and method using lead-free solder. This assembly incorporates mushroom-plated metal layers that fill and overflow solder resist openings on an...
US20080111219 PACKAGE DESIGNS FOR VERTICAL CONDUCTION DIE  
Embodiments in accordance with the present invention relate to packaging designs for vertical conduction semiconductor devices which include low electrical resistance contacts with a top surface...
US20120273943 Solder Joint Flip Chip Interconnection Having Relief Structure  
A flip chip interconnect has a tapering interconnect structure, and the area of contact of the interconnect structure with the site on the substrate metallization is less than the area of contact...
US20100026290 MICROELECTROMECHANICAL MAGNETOMETER WITH INTEGRATED ELECTRONICS  
A method of manufacturing an apparatus 200 comprising forming an integrated magnetometer package 202. Forming an integrated magnetometer package 202 includes forming a movable part 215 from a MEM...
US20120003791 Method for Packaging Electronic Devices and Integrated Circuits  
The present invention relates to the field of electronic devices and their associated driver and/or controller integrated circuits and in particular to the mechanical packaging of electronic...
US20140011323 PROCESSES RELATING TO CLEANSPACE FABRICATORS  
The present invention provides various methods for utilizing aspects of cleanspace fabricators. In some embodiments methods related to the development of tooling in applications or “apps” type...
US20050251777 Method and structure for implementing enhanced electronic packaging and PCB layout with diagonal vias  
A method and structure are provided for implementing enhanced electronic packaging and printed circuit board (PCB) layout. A diagonal via is formed at a selected angle between a first side and an...
US20090035890 TECHNIQUES FOR DIRECT ENCASEMENT OF CIRCUIT BOARD STRUCTURES  
A technique for processing an electronic apparatus (e.g., manufacturing an assembled circuit board, treating an assembled circuit board, etc.) involves applying encasement material to an area of...
US20140193949 SOCKET TYPE MEMS BONDING  
A method for fabricating an integrated circuit device is disclosed. The method includes providing a first substrate; bonding a second substrate to the first substrate, the second substrate...
US20110012247 SOCKET TYPE MEMS BONDING  
A method for fabricating an integrated circuit device is disclosed. The method includes providing a first substrate; bonding a second substrate to the first substrate, the second substrate...
US20090017578 Application of RFID labels  
Disclosed is a method for producing an RFID label with the aid of a printing process. The aim of the invention is make it easy to apply the parts required onto the label while completing the label...
US20080026505 Electronic packages with roughened wetting and non-wetting zones  
The flow of polymer formulations in in integrated circuit packages can be controlled by altering the roughness and surface chemistry of package surfaces. The surface roughness can be altered by...
US20100099219 MITIGATION OF PLATING STUB RESONANCE BY CONTROLLING SURFACE ROUGHNESS  
Plating stub resonance in a circuit board may be mitigated by increasing surface roughness of the plating stub conductor. Roughening the plating stub increases its resistance due to the skin...
US20070231959 Method for making a wedge wedge wire loop  
A wedge wedge wire loop is formed with the steps: a) lowering the capillary onto the first connection point and applying a predefined bond force and ultrasound for producing a wedge connection on...
US20150004748 Methods of Forming Conductive Jumper Traces  
Methods of forming conductive jumper traces for semiconductor devices and packages. Substrate is provided having first, second and third trace lines formed thereon, where the first trace line is...