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US20120135260 FABRICATION OF NANO-TWINNED NANOPILLARS  
Nanopillars with nanoscale diameters are provided where the nanopillar has uniformly aligned nano-twins either perpendicular or inclined by 1-90° to the pillar-axis with no grain-boundaries or any...
US20120110524 METHODS, PHOTOMASKS AND METHODS OF FABRICATING PHOTOMASKS FOR IMPROVING DAMASCENE WIRE UNIFORMITY WITHOUT REDUCING PERFORMANCE  
A method of improving damascene wire uniformity without reducing performance. The method includes simultaneously forming a multiplicity of damascene wires and a multiplicity metal dummy shapes in...
US20150241788 FLEXURE AND METHOD OF FORMING PART OF FLEXURE  
A flexure includes a metal substrate whose front end supports a slider and a wiring part having a base insulating layer and a conductor layer formed on the base insulating layer. The wiring part...
US20120193762 REVERSAL LITHOGRAPHY APPROACH BY SELECTIVE DEPOSITION OF NANOPARTICLES  
A novel reversal lithography process without etch back is described. The reversal material comprises nanoparticles that are selectively deposited into the gaps between features without overcoating...
US20110260200 METHOD OF FABRICATING NON-METAL LED SUBSTRATE AND NON-METAL LED SUBSTRATE AND METHOD OF FABRICATING LED DEVICE USING THE NON-METAL LED SUBSTRATE AND LED DEVICE WITH THE NON-METAL LED SUBSTRATE  
The present invention discloses a method of fabricating non-metal substrate having steps of (a) providing a non-metal board having two opposite first and second surfaces; (b) drilling at least one...
US20080073213 Sieve Eop Pump  
An electroosmotic flow pump for generating a flow in an electrolyte from an inlet to an outlet in a channel, the electroosmotic flow pump comprising a housing with the channel for holding the...
US20120121983 Lithium Deposited Anode for a Lithium Second Battery and Its Manufacturing Method  
The present invention relates to a lithium deposited anode for a lithium secondary battery and a method for preparing the same, and more particularly, to an anode suitable for a lithium secondary...
US20090004575 Exposure mask with double patterning technology and method for fabricating semiconductor device using the same  
An exposure mask for forming a G-type active region with a double patterning technology includes a bar shaped first light-blocking pattern to define an I-type active region, and an island shaped...
US20100291385 FABRICATION OF VERTICALLY ALIGNED METALLIC NANOPILLARS  
Solid and hollow cylindrical nanopillars with nanoscale diameters are provided. Also provides is a method of making such nanopillars using electron beam lithography followed by the electroplating.
US20100261095 Methods, Photomasks and Methods of Fabricating Photomasks for Improving Damascene Wire Uniformity Without Reducing Performance  
A method of improving damascene wire uniformity without reducing performance. The method includes simultaneously forming a multiplicity of damascene wires and a multiplicity metal dummy shapes in...
US20090023100 Patterning a surface comprising silicon and carbon  
Patterning a surface, comprising at least one feature having silicon coupled to a substrate, is described herein. In one embodiment a method is described for patterning a surface which comprises...
US20100215543 METHODS FOR FABRICATING HIGH ASPECT RATIO PROBES AND DEFORMING HIGH ASPECT RATIO NANOPILLARS AND MICROPILLARS  
Methods for fabricating of high aspect ratio probes and deforming micropillars and nanopillars are described. Use of polymers in deforming nanopillars and micropillars is also described.
US20100330506 METHOD FOR TRANSFERRING AN EPITAXIAL LAYER FROM A DONOR WAFER TO A SYSTEM WAFER APPERTAINING TO MICROSYSTEMS TECHNOLOGY  
For bonding a donor wafer (1) and a system wafer (9) an edge bead (3) of an epitaxial layer (2) on the donor wafer is flattened or completely removed by etching so that a reliable contact after...
US20060051974 Mask and manufacturing method using mask  
A mask 12 includes half-tone layer 16 and light blocking layer 20. The half-tone layer 16 is of silicon rich silicon nitride SiNx:H. x may be in the range 0 to 1, preferably 0.2 to 0.6, so that...
US20120288802 METHOD OF FORMING GATE CONDUCTOR STRUCTURES  
A method of forming gate conductor structures. A substrate having thereon a gate electrode layer is provided. A multi-layer hard mask is formed overlying the gate electrode layer. The multi-layer...
US20090246706 PATTERNING RESOLUTION ENHANCEMENT COMBINING INTERFERENCE LITHOGRAPHY AND SELF-ALIGNED DOUBLE PATTERNING TECHNIQUES  
A method for providing regular line patterns using interference lithography and sidewall patterning techniques is provided according to one embodiment. The method comprising may include producing...
US20080131793 Method for forming hard mask patterns having a fine pitch and method for forming a semiconductor device using the same  
A method for forming hard mask patterns includes, sequentially forming first, second, and third hard mask layers formed of materials having different etching selectivities on a substrate, forming...
US20100086875 Method of making sub-resolution pillar structures using undercutting technique  
A method of making a device includes forming an underlying mask layer over an underlying layer, forming a first mask layer over the underlying mask layer, patterning the first mask layer to form...
US20110195360 METHODS TO FABRICATE A PHOTOACTIVE SUBSTRATE SUITABLE FOR MICROFABRICATION  
A method of fabrication and device with holes for electrical conduction made by preparing a photosensitive glass substrate comprising at least silica, lithium oxide, aluminum oxide, and cerium...
US20090087622 Directed Assembly of Carbon Nanotubes and Nanoparticles Using Nanotemplates With Nanotrenches  
The present invention provides methods and tools for directed assembly of nanoelements across a large area using a nanosubstrate. The nanosubstrate has a substrate layer, an adhesive layer, a...
US20090092927 IMAGE DRUM AND FABRICATING METHOD THEREOF  
A method of fabricating an image drum includes preparing a hollow drum body having a slot extending in a longitudinal direction, preparing a printed circuit board (PCB) having a plurality of board...
US20150125674 FORMING CONDUCTIVE METAL PATTERNS USING REACTIVE POLYMERS  
A conductive pattern is prepared in a polymeric layer that has (a) a reactive polymer comprising pendant tertiary alkyl ester groups, (b) a compound that provides an acid upon exposure to...
US20090183901 Wiring Boards and Processes for Manufacturing the Same  
A wiring board includes an insulating substrate and a wiring pattern. The wiring pattern includes a main body and an upper end portion and is embedded in the insulating substrate while exposing at...
US20110151359 INTEGRATED CIRCUIT LAYOUT DESIGN  
Provided is a photolithography apparatus including a photomask. The photomask includes a pattern having a plurality, of features, in an example, dummy line features. The pattern includes a first...
US20080314723 METHOD OF MAKING CONTACT POSTS FOR A MICROELECTROMECHANICAL DEVICE  
A device 20 includes a substrate 22 coupled with a substrate 24 such that a volume 32 is formed between the substrates 22, 24. Contact posts 48, 50 on the substrate 22 and a cantilever beam...
US20120044187 Capacitive Touch Screen  
One embodiment in accordance with the invention can include a capacitive touch screen. The capacitive touch screen includes a substantially transparent substrate and a plurality of electrodes...
US20080044773 METHOD OF MANUFACTURING A PATTERNED COLOR CONVERSION LAYER, AND METHODS OF MANUFACTURING A COLOR CONVERSION FILTER AND AN ORGANIC EL DISPLAY THAT USE A COLOR CONVERSION LAYER OBTAINED BY THE METHOD  
A method of manufacturing a color conversion layer with a predetermined pattern is disclosed which does not cause any damage on the color conversion layer formed by a dry process such as an...
US20110200948 Method of Fabricating Micro-Devices  
A new and novel method utilizing current nano-technological processes for fabricating a range of micro-devices with significantly expanded capabilities, unique functionalities at microscopic...
US20120103507 Photosensitive composite and build-up insulation film with the photosensitive composite, and method for manufacturing circuit board using the build-up insulation film  
Disclosed herein is a method for manufacturing a circuit board. The method for manufacturing a circuit board includes: preparing a photosensitive composite; preparing a build-up insulating film by...
US20060281031 Production of two superposed elements within an integrated electronic circuit  
A method is presented for forming two superposed elements within an integrated electronic circuit. In accordance with the method, a first circuit element, which is reflective with respect to...
US20100035187 METHOD FOR SMOOTHING PRINTED CIRCUIT BOARDS  
A method for smoothing a printed circuit board (PCB), comprising: providing a PCB having a first smooth outer surface and an opposite second outer surface, the second outer surface including a...
US20110171582 Three Dimensional Integration With Through Silicon Vias Having Multiple Diameters  
A method is disclosed which includes patterning a photoresist layer on a substrate of a structure, removing a first portion of the photoresist layer to expose a first area of the substrate,...
US20050100828 Mass production method for three-dimensional micro structure having high aspect ratio  
The present invention relates to mass production method for three-dimensional micro structure and especially to the mass production method for three-dimensional metal micro structure having high...
US20100291488 Manufacturing method for multilayer core board  
A method for manufacturing a cone board including: preparing a core insulation layer including one or more resins selected from the group consisting of epoxy resins and bismaleimide triazine...
US20070224795 DUMMY VIAS FOR DAMASCENE PROCESS  
A method of making an integrated circuit includes providing a low-k dielectric layer on a substrate, the low-k dielectric layer including or adjacent to a plurality of conductive features;...
US20060192928 Pattern transferring apparatus and pattern transferring method  
A pattern transferring apparatus is disclosed which can prevent damage to a transferred pattern and realize fast mold release regardless of the type of resist. The pattern transferring apparatus...
US20090044971 Printed Wiring Board, Process for Producing the Same and Usage of the Same  
The printed wiring board includes an insulating base and a plurality of wirings formed on the surface of the insulating base, wherein the wiring circuit has a conductive undercoat layer formed on...
US20090317748 Method for Forming Fine Patterns of Semiconductor Device  
A method for forming fine patterns of a semiconductor device employs a double patterning characteristic using a mask for forming a first pattern including a line pattern and a mask for separating...
US20070298335 Exposure Condition Setting Method, Substrate Processing Device, and Computer Program  
A method includes forming a resist film on an etching target layer disposed on a test substrate, and performing sequential light exposure with a predetermined test pattern on the resist film...
US20080003510 Correction method and correction system for design data or mask data, validation method and validation system for design data or mask data, yield estimation method for semiconductor integrated circuit, method for imporving design rule, mask production method, and semiconductor integrated circuit production method  
The subject invention provides a correction method for design data or mask data comprising the steps of: (i) carrying out PPC of design data or mask data;(ii) exposing and developing a resist with...
US20090087712 Fabrication method of thin film solid oxide fuel cells  
A silicon-based solid oxide fuel cell (SOFC) with high surface area density in a limited volume is provided. The structure consists of a corrugated nano-thin film electrolyte and a silicon...
US20090170036 METHOD FOR MANUFACTURING TRANSPARENT ELECTRODE PATTERN AND METHOD FOR MANUFACTURING ELECTRO-OPTIC DEVICE HAVING THE TRANSPARENT ELECTRODE PATTERN  
Provided are a method for manufacturing a transparent electrode pattern and a method for manufacturing an electro-optic device having the transparent electrode pattern. The method for...
US20060274236 Display device, method of manufacturing the same and mask for manufacturing the same  
A mask is provided. The mask includes a mask body, a first exposing part and a second exposing part. The first exposing part is on the mask body. The first exposing part includes a first light...
US20050003307 Method for forming DRAM cell bit-line contact  
A method for forming DRAM cell bit-line contact is provided. First a dielectric layer is formed on a substrate on which a plurality of control gates has already been formed, and then a patterned...
US20050153249 Electronic component manufacturing apparatus, electronic component manufacturing method, and electronic component  
There are provided a metal particulate spraying step to spray metal particulates over a substrate having an insulating pattern formed of thermosetting resin, a heating step to heat and dissolve...
US20080076064 METHOD OF CREATING PHOTOLITHOGRAPHIC STRUCTURES WITH DEVELOPER-TRIMMED HARD MASK  
Novel, developer-soluble, hard mask compositions and methods of using those compositions to form microelectronic structures are provided. The composition comprises the compound a compound for...
US20110123931 High-precision ceramic substrate preparation process  
A high-precision ceramic substrate preparation process is disclosed to bond a dry film to a metal layer on a ceramic plate, and then to coat a conductive layer on the metal layer and an...
US20100086872 Metal oxide-containing film-forming composition, metal oxide-containing film-formed substrate, and patterning process  
There is disclosed a thermosetting metal oxide-containing film-forming composition for forming a metal oxide-containing film to be formed in a multilayer resist process used in lithography, the...
US20060163740 Semiconductor mounting board  
A semiconductor mounting board 80 is prepared by electrically joining an IC chip 70 via an interposer 60 of high rigidity to external pads 41 and internal pads 43, which are formed on the...
US20080180783 Critical dimension control for photolithography for microelectromechanical systems devices  
A method of making a microelectromechanical system (MEMS) device is disclosed. The method includes forming a stationary layer and a moving layer spaced from the stationary layer. The method also...

Matches 1 - 50 out of 103 1 2 3 >