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US20070077524 Method for forming patterns of semiconductor device  
Provided is a method for forming patterns of a semiconductor device. According to the method, first mask patterns may be formed on a substrate, and second mask patterns may be formed on sidewalls...
US20100075261 Methods for Manufacturing a Contact Grid on a Photovoltaic Cell  
Processes for fabricating a contact grid for a photovoltaic cell generally includes providing a photovoltaic cell having an antireflective coating disposed on a sun facing side, the photovoltaic...
US20150119673 NEURAL ELECTRODE SYSTEM WITH A CARRIER HAVING A TAPE SPRING-TYPE SHAPE  
A neural probe comprising an array of stimulation and/or recording electrodes supported on a tape spring-type carrier is described. The neural probe comprising the tape spring-type carrier is used...
US20090251646 ARRAY SUBSTRATE, MANUFACTURING METHOD THEREOF AND LIQUID CRYSTAL DISPLAY  
An embodiment of the invention provides an array substrate for a liquid crystal display comprising a substrate and a gate scanning line, a thin film transistor, a data line, and a passivation...
US20110272295 Electrochemical Biosensor Structure and Measuring Method Using the Same  
The present invention provides there is provided an electrochemical biosensor electrode structure that includes: a working electrode and a reference electrode used as electrodes for sample...
US20100209854 Method For Producing An Electro-Optical Printed Circuit Board With Optical Waveguide Structures  
An electro-optical printed circuit board contains electrical conductor tracks on the one hand and optical waveguide structures on the other hand. The optical waveguide structures comprise a bottom...
US20100301457 Lithography Masks, Systems, and Manufacturing Methods  
Lithography masks, lithography systems, methods of manufacturing lithography masks, methods of altering material layers of semiconductor devices, and methods of manufacturing semiconductor devices...
US20080122125 Methods to reduce the critical dimension of semiconductor devices and partially fabricated semiconductor devices having reduced critical dimensions  
A method of forming features on a target layer. The features have a critical dimension that is triple- or quadruple-reduced compared to the critical dimension of portions of a resist layer used as...
US20080185039 CONDUCTOR FABRICATION FOR OPTICAL ELEMENT  
A system may provide an optical element including conductive material deposited on the optical element using a thick film process, dielectric material disposed on the conductive material and...
US20090179203 DISPLAY SUBSTRATE  
A display substrate includes an insulating substrate, a thin-film transistor (TFT), a pixel electrode, a signal line and a pad part. The insulating substrate has a display region and a peripheral...
US20090305167 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE  
In the method for manufacturing a semiconductor device, a resist film is formed on a substrate and is processed to be provided with openings to form a first resist pattern. Additive-containing...
US20070018286 Substrate, lithographic multiple exposure method, machine readable medium  
A method for imaging using a lithographic system includes decomposing a desired pattern to be printed on the substrate into at least two constituent sub-patterns that are capable of being...
US20090004603 Method for Forming Fine Pattern of Semiconductor Device  
A method for forming a fine pattern of a semiconductor device comprises: forming anti-reflection coating patterns over an underlying layer of a semiconductor substrate using an anti-reflection...
US20080213701 POLYMER FOR ORGANIC ANTI-REFLECTIVE COATING LAYER AND COMPOSITION INCLUDING THE SAME  
A polymer which has siloxane group at a main chain thereof and a composition including the same, for forming an organic anti-reflective coating layer are disclosed. The polymer for forming an...
US20090246707 Semiconductor buried grating fabrication method  
Methods for forming grating profiles in semiconductor laser structures comprise the steps of providing a semiconductor wafer comprising a wafer substrate, an etch stop layer disposed over the...
US20100243603 SILICON-METAL COMPOSITE MICROMECHANICAL COMPONENT AND METHOD OF MANUFACTURING THE SAME  
The invention relates to a method (1) of manufacturing a silicon-metal composite micromechanical component (51) combining DRIE and LIGA processes. The invention also relates to a micromechanical...
US20140240939 METHOD FOR PRODUCING A MICROELECTRONIC DEVICE  
The invention concerns a method for producing a microelectronic device comprising a substrate and a stack comprising at least one electrically conductive layer and at least on dielectric layer,...
US20070072132 Method of forming device structure, method of manufacturing magnetoresistive element, and method of manufacturing thin film magnetic head  
The present invention provides a method of forming a device structure realizing a narrowed pattern width without using a lift off method. A first device layer is selectively etched through using a...
US20050147923 Method of manufacturing fine T-shaped electrode  
A method of manufacturing a fine T-shaped electrode includes a step of forming a laminated resist which includes at least a photoresist layer as an uppermost layer; a step of forming an uppermost...
US20080026499 METHOD FOR FORMING PATTERN, AND METHOD FOR MANUFACTURING LIQUID CRYSTAL DISPLAY  
A method for forming a pattern, comprises: forming a bank film on a substrate; performing a lyophobic treatment on a surface of the bank film; patterning the bank film on which the lyophobic...
US20080299495 Methods of fabricating metal contact structures for laser diodes using backside UV exposure  
Methods of fabricating a metal contact structure for a laser diodes are provided, wherein the method comprises providing a UV transparent semiconductor substrate, a UV transparent semiconductor...
US20100244997 WAVEGUIDE OF MULTI-LAYER METAL STRUCTURE AND MANUFACTURING METHOD THEREOF  
A waveguide of a multi-layer metal structure and a manufacturing method thereof are provided, the method including applying a plurality of metal layers on a substrate and a plurality of insulating...
US20080261157 SEMICONDUCTOR LASER DEVICE AND METHOD OF MANUFACTURING THE SAME  
Disclosed is a method of manufacturing a distributed feedback semiconductor laser device. In order to form a grating in only a channel, an etching mask, which is used when forming a ridge...
US20120168210 Methods and Structures Involving Terminal Connections  
A method for forming a conductive contact includes forming a copper contact region in an intermediary layer, depositing an insulator layer over the copper contact region and the intermediary...
US20090220893 Method for Patterning a Semiconductor Wafer  
A method for etching a pattern on a surface is disclosed. A mask layer is disposed over a surface and a resist is disposed over the mask layer. The resist is exposed to light through the mask...
US20080131668 ARRAY SUBSTRATE, DISPLAY DEVICE, AND METHOD FOR MANUFACTURING THE ARRAY SUBSTRATE  
An array substrate has regions in which an intermediate resist film thickness is formed and processed by an intermediate exposure amount which does not completely expose a resist, respectively on...
US20050118531 METHOD FOR CONTROLLING CRITICAL DIMENSION BY UTILIZING RESIST SIDEWALL PROTECTION  
A method for controlling line width critical dimension is disclosed. A semiconductor layer is deposited on a substrate. A cap layer is formed on the semiconductor layer. A patterned photoresist is...
US20050158664 Method of integrating post-etching cleaning process with deposition for semiconductor device  
A method of integrating a post-etching cleaning process with deposition for a semiconductor device. A substrate having a damascene structure formed by etching a dielectric layer formed thereon...
US20110300487 METHOD FOR PRODUCING A MATRIX OF INDIVIDUAL ELECTRONIC COMPONENTS AND MATRIX PRODUCED THEREBY  
The invention relates to a method for producing a matrix of electronic components, comprising a step of producing an active layer on a substrate, and a step of individualizing the components by...
US20100187658 MULTI-MATERIAL HARD MASK OR PREPATTERNED LAYER FOR USE WITH MULTI-PATTERNING PHOTOLITHOGRAPHY  
A method of fabricating integrated circuits is described. A multi-material hard mask is formed on an underlying layer to be patterned. In a first patterning process, portions of the first material...
US20110027719 PHOTOMASK ETCHING METHOD FOR CHEMICAL VAPOR DEPOSITION FILM  
The present invention discloses a photomask etching method for a CVD film, which comprises steps: exposing an optical resin layer to an ultraviolet ray through a photomask; baking the optical...
US20050158666 Lateral etch inhibited multiple etch method for etching material etchable with oxygen containing plasma  
A method for etching a pattern within a dual-layer stack dielectric layer employed within a microelectronics fabrication. A first low dielectric constant dielectric layer employing HSQ polymer...
US20090236627 METHOD OF FORMING METAL WIRING  
Provided is a method of forming metal wiring. The method includes forming a photosensitive film pattern on a substrate, hydrophobicizing at least part of the photosensitive film pattern, coating...
US20090209109 PATTERN FORMING METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING APPARATUS  
Provided is a pattern forming method for forming a pattern serving as a mask, which includes: a process for forming a first pattern 105 made of a photoresist; a process for forming a boundary...
US20120168203 INTEGRATED CIRCUIT SYSTEM WITH ULTRA-LOW K DIELECTRIC AND METHOD OF MANUFACTURE THEREOF  
A method of manufacturing an integrated circuit system includes: providing a etch stop layer; forming a layer stack over the etch stop layer with the layer stack having an anti-reflective coating...
US20090114430 METHOD FOR PATTERNING OF CONDUCTIVE POLYMER  
Disclosed herein is a method of patterning a circuit using a self-assembly lithography. More specifically, the present invention is directed to a method of a circuit by a self-assembly...
US20150253673 PATTERN FORMING METHOD, RESIST PATTERN FORMED BY THE METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE USING THE SAME, AND ELECTRONIC DEVICE  
There is provided a pattern forming method including (1) forming a film by an actinic ray-sensitive or radiation-sensitive resin composition containing a resin (A) capable of increasing the...
US20100279078 STRUCTURE AND METHOD FOR CREATING SURFACE TEXTURE OF COMPLIANT COATINGS ON PIEZO INK JET IMAGING DRUMS  
This is structure and method for providing a textured surfaced that can be used in a plurality of systems including ink jet printing. In ink jet printing, the textured surface of this invention...
US20100203299 Hardmask Process for Forming a Reverse Tone Image Using Polysilazane  
The present invention relates to a process for forming an reverse tone image on a device comprising; a) forming an optional absorbing organic underlayer on a substrate; b) forming a coating of a...
US20100176492 Method for Forming a Pattern on a Semiconductor Using an Organic Hard Mask  
A composition for the organic hard mask includes a polyamic acid compound, and a method for forming a pattern is used in a manufacturing process of semiconductor devices by coating the composition...
US20100112486 METHOD AND SYSTEM FOR PROVIDING A PERPENDICULAR MAGNETIC RECORDING HEAD  
A method and system for providing a PMR pole in a magnetic recording transducer including an intermediate layer are disclosed. The method and system include providing a mask on the intermediate...
US20100112483 SYSTEM AND METHOD FOR SELF-ALIGNED DUAL PATTERNING  
A system and a method for self-aligned dual patterning are described. The system includes a platform for supporting a plurality of process chambers. An etch process chamber coupled to the...
US20100040982 METHOD FOR FORMING AN OPENING  
A method for forming an opening is disclosed. First, a semiconductor substrate is provided, in which the semiconductor substrate includes at least one metal interconnects therein. A stacked film...
US20090291388 Method for Forming a Self-Aligned Hard Mask for Contact to a Tunnel Junction  
A method of forming a hard mask in a semiconductor device which is self-aligned with a MTJ formed in the device is provided. The method includes the steps of: forming a hard mask material layer on...
US20090202949 Producing method of wired circuit board  
A producing method of a wired circuit board includes the steps of preparing a two-layer base material including a metal supporting layer and an insulating layer, covering an upper surface of the...
US20080261158 Method of manufacturing printed circuit board  
A method of manufacturing a printed circuit board is disclosed. The method includes: forming a relievo pattern and an intaglio pattern on a surface of a base plate; forming a metal plate, which...
US20170087784 WAFER-LEVEL MANUFACTURE OF DEVICES, IN PARTICULAR OF OPTICAL DEVICES  
The wafer-level method for applying N≧2 first elements to a first side of a substrate, wherein the substrate has at the first side a first surface including the steps of providing the substrate,...
US20160202613 GRAPHENE SENSOR AND METHOD OF FABRICATING THE SAME AND TOUCH-SENSITIVE DISPLAY DEVICE  
The present disclosure provides a method of fabricating a graphene touch sensor, a graphene sensor and a touch-sensitive display device. The method comprises: forming a graphene layer on a...
US20160007653 MEMS Vaporizer  
A MEMS vaporizer is described which can be used for electronic cigarettes. The vaporizer mainly composes: a silicon substrate, a micro-channel array, a membrane suspending over the micro-channel...
US20150301447 Self Aligned Patterning With Multiple Resist Layers  
A method for using self aligned multiple patterning with multiple resist layers includes forming a first patterned resist layer onto a substrate, forming a spacer layer on top of the first...
Matches 51 - 100 out of 103 < 1 2 3 >