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US20090286186 |
METHOD OF MANUFACTURING A COORDINATE DETECTOR
A method of manufacturing a coordinate detector having a resistive film and a common electrode for applying a voltage to the resistive film is disclosed that includes the steps of (a) applying a...
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US20090255110 |
PHOTO-ETCHED EDM ELECTRODE
An electrical discharge machining electrode includes a body and one or more shaped teeth. The one or more shaped teeth of the body have a diffuser section and a metering section in electrical...
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US20090253076 |
Coating-type underlayer coating forming composition for lithography containing vinylnaphthalene resin derivative
[Object] To provide a coating-type underlayer coating forming composition that is applied for multi-ply coating process by thin film resist in order to prevent collapse of resist pattern after...
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US20090250817 |
METHOD OF FABRICATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
A method of fabricating a semiconductor device according to embodiments includes forming a resist film above an object to be etched, the resist film having a pattern with notches provided in the...
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US20090250253 |
Printed circuit board and manufacturing method thereof
Disclosed are a printed circuit board and a manufacturing method thereof. The method of manufacturing a printed circuit board in accordance with an embodiment of the present invention includes:...
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US20090246705 |
DI Water Rinse of Photoresists with Insoluble Dye Content
A method of forming a pattern in a photoresist layer which contains a dye that is insoluble in the developer solution is disclosed. A rinse liquid, typically deionized water, is dispensed onto the...
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US20090233230 |
Photosensitive Resin Composition and Laminates
The present invention provides a photosensitive resin composition characterized by comprising: (a) 20 to 90% by mass of a thermoplastic copolymer comprising an α,β-unsaturated carboxyl group...
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US20090233183 |
EXPOSURE MASK AND A METHOD OF MAKING A SEMICONDUCTOR DEVICE USING THE MASK
Disclosed herein are an exposure mask and a method of making a semiconductor device using the mask. The exposure mask includes a transparent substrate; and a light blocking pattern having first and...
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US20090226824 |
Hardmask composition and associated methods
A hardmask composition for processing a resist underlayer film includes a solvent and an organosilane polymer, wherein the organosilane polymer is represented by Formula 6:
In Formula 6, R is...
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US20090208865 |
PHOTOLITHOGRAPHY FOCUS IMPROVEMENT BY REDUCTION OF AUTOFOCUS RADIATION TRANSMISSION INTO SUBSTRATE
An anti-reflective coating material, a microelectronic structure that includes an anti-reflective coating layer formed from the anti-reflective coating material and a related method for exposing a...
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US20090201474 |
Semiconductor Devices and Methods of Manufacture Thereof
Methods of manufacturing semiconductor devices, structures thereof, methods of fabricating lithography masks, and lithography masks and systems are disclosed. In one embodiment, a method of...
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US20090197208 |
METHOD FOR MANUFACTURING A PERPENDICULAR MAGNETIC WRITE POLE USING AN ELECTRICAL LAPPING GUIDE FOR TIGHT WRITE POLE FLARE POINT CONTROL
A method for manufacturing a magnetic write head for perpendicular magnetic recording. The method provides for accurate definition of a device feature such as a write pole flare point. A functional...
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US20090189524 |
PLASMA DISPLAY PANEL AND ITS MANUFACTURING METHOD
by using mask patterns of the same shape for electrode formation, an electrode and a dielectric layer are patterned into the same shape so that it is possible to eliminate a positional shift...
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US20090181327 |
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES
The present invention relates to a method of manufacturing semiconductor devices. According to the method, an etch target layer, a chemically amplified photoresist layer, and a Bottom...
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US20090174036 |
PLASMA CURING OF PATTERNING MATERIALS FOR AGGRESSIVELY SCALED FEATURES
A methodology is disclosed that enables the fabrication of semiconductor devices (i.e., STI structures, gates, and interconnects) with significantly reduced line edge roughness (LER) and line width...
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US20090162782 |
Silicon-Containing Resist Underlayer Coating Forming Composition for Forming Photo-Crosslinking Cured Resist Underlayer Coating
There is provided an underlayer coating that is used as an underlayer of photoresists in lithography process of the manufacture of semiconductor devices and that has a high dry etching rate in...
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US20090159321 |
ELECTRONIC DEVICES WITH ULTRAVIOLET BLOCKING LAYERS AND PROCESSES OF FORMING THE SAME
An electronic device can include a conductive feature and an ultraviolet (“UV”) blocking layer overlying the conductive feature. The electronic device can also include an insulating layer...
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US20090142674 |
Photo Mask and Method for Manufacturing Semiconductor Device Using the Same
A photo mask includes a dot pattern formed between a line pattern and an island pattern. Methods of making a semiconductor device employing such a photo mask improves yield and productivity of the...
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US20090135347 |
DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF
A manufacturing method of a display device, wherein the manufacturing method for an embodiment includes: forming color filters in a plurality of pixel regions; forming a conductive layer on the...
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US20090111059 |
Patterning Method of Semiconductor Device
The invention relates to a patterning method of a semiconductor device. In an aspect of the invention, the method may include forming a target etch layer on a semiconductor substrate, forming a...
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US20090111035 |
BINARY MASK, METHOD FOR FABRICATING THE BINARY MASK, AND METHOD FOR FABRICATING FINE PATTERN OF SEMICONDUCTOR DEVICE USING BINARY MASK
Provided are a binary mask, a method for fabricating the binary mask, and a method for fabricating a fine pattern of semiconductor device. In the method for fabricating the fine pattern, a binary...
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US20090065843 |
Semiconductor Constructions, Semiconductor Processing Methods, And Methods Of Forming Flash Memory Structures
Some embodiments include methods of reflecting ions off of vertical regions of photoresist mask sidewalls such that the ions impact foot regions along the bottom of the photoresist mask sidewalls...
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US20090061359 |
RESIST COMPOSITION FOR IMMERSION EXPOSURE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME
According to an aspect of an embodiment, a resist composition for immersion exposure includes a matrix resin so that the matrix resin is turned alkali-soluble by an acid. The resist composition...
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US20090061355 |
PROCESS OF MAKING A LITHOGRAPHIC STRUCTURE USING ANTIREFLECTIVE MATERIALS
A lithographic structure comprising: an organic antireflective material disposed on a substrate; and a silicon antireflective material disposed on the organic antireflective material. The silicon...
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US20090053487 |
CERAMIC CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
A ceramic circuit board and a manufacturing method thereof are disclosed. The method includes the steps of providing a first pre-mold plate and a first ceramic thin plate, stacking the first...
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US20090035590 |
NON-COVALENTLY CROSSLINKABLE MATERIALS FOR PHOTOLITHOGRAPHY PROCESSES
This invention describes compositions and methods of using non-covalently crosslinked resin coatings for lithographic applications. These materials are designed to undergo, after coating, a change...
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US20090029559 |
PHOTO MASK OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING PATTERN USING THE SAME
There is provided a photo mask for forming a specific pattern and a specific pattern formed using the photo mask. Unlike in a related method of forming a specific pattern using a photo mask...
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US20090023079 |
Photomask and Method of Forming Overlay Vernier of Semiconductor Device Using the Same
This patent relates to a photomask and a method of forming an overlay vernier of a semiconductor device employing the same. The photomask includes a reticle formed of a first material through which...
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US20080318165 |
Composition For Forming Antireflective Film And Wiring Forming Method Using Same
A material for forming an antireflective film that enables a large difference in etching rates to be obtained between a resist pattern and an antireflective film. A composition for forming an...
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US20080311527 |
Method of forming protection layer on photoresist pattern and method of forming fine pattern using the same
A method of forming a protection layer on a photoresist pattern and a method of forming a fine pattern using the same are provided. A photoresist layer may be formed on a substrate. Exposure...
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US20080299494 |
DOUBLE PATTERNING WITH A DOUBLE LAYER CAP ON CARBONACEOUS HARDMASK
Methods to etch features in a substrate with a multi-layered double patterning mask. The multi-layered double patterning mask includes a carbonaceous mask layer, a first cap layer on the...
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US20080268210 |
MANUFACTURING METHOD OF ELECTRONIC COMPONENT
A manufacturing method of an electronic component, characterized by having a first step of forming a treated substrate with a reinforcing part having a treated substrate body and a reinforcing part...
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US20080254392 |
FLEXIBLE CIRCUIT WITH COVER LAYER
The invention relates to flexible circuits and more particularly to flexible printed circuits having cover layers. The cover layers may be a chemically-etchable adhesive polyimide. The cover layers...
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US20080252689 |
LIQUID DISCHARGE HEAD AND METHOD FOR MANUFACTURING THE SAME
A method for manufacturing a liquid discharge head including an energy generating element, which generates energy utilized for discharging a liquid, and a discharge portion provided at a position...
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US20080248429 |
METHOD OF FORMING A CONTACT HOLE
A method of forming a contact hole is provided. A pattern is formed in a photo resist layer. The pattern is exchanged into a silicon photo resist layer to form a first opening. Another pattern is...
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US20080241758 |
Photoresist stripping solution and a method of stripping photoresists using the same
A photoresist stripping solution comprising (a) a carboxyl group-containing acidic compound, (b) at least one basic compound (for example, monoethanolamine, tetraalkylammonium) selected from among...
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US20080241748 |
Etch-resistant disilane and saturated hydrocarbon bridged silicon-containing polymers, method of making the same, and method of using the same
A composition includes a copolymer including a mixture of monomeric units having structures (A), (B), and (C), and one or more of structures (D) or (E):
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US20080220223 |
RESIST COVER FILM FORMING MATERIAL, RESIST PATTERN FORMING METHOD, AND ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
To provide a material including: a silicon-containing polymer having at least an alkali-soluble group and is represented by the following general formula (1); and an organic solvent capable of...
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US20080206681 |
METHOD FOR PRODUCING A STRUCTURE ON THE SURFACE OF A SUBSTRATE
The present invention relates to a method for producing a structure serving as an etching mask on the surface of a substrate. In this case, a first method involves forming a first partial structure...
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US20080206680 |
Composition for forming anti-reflective coating for use in lithography
There is provided a composition for forming anti-reflective coating for anti-reflective coating that has a good absorption of light at a wavelength utilized for manufacturing a semiconductor...
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US20080206679 |
Contrast Enhancing Exposure System and Method For Use In Semiconductor Fabrication
Contrast enhancing exposure apparatus and method for use in semiconductor fabrication are described. In one embodiment, a method for forming a pattern on a substrate, wherein the substrate includes...
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US20080182209 |
Method of Fabricating Semiconductor Device, and Developing Apparatus Using the Method
In a resist pattern forming method in which bake processing is performed at a temperature not lower than a glass transition temperature in order to obtain the desired sidewall angle, resist...
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US20080182208 |
Method and System for Closing Plate Take-Over in Immersion Lithography
Aspects of the present disclosure provide a method and a system for closing plate take-over in immersion lithography. A plate holder is provided for a closing plate in a wafer holder of an...
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US20080176172 |
Development processing device
A device includes a rotary base; an approach stage; a substrate holding table and a nozzle head. The substrate holding table holds the work by suction, and comes into intimate contact with the...
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US20080176167 |
PHOTOSENSITIVE ADHESIVE COMPOSITION, AND OBTAINED USING THE SAME, ADHESIVE FILM, ADHESIVE SHEET, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE AND ELECTRONIC PART
A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a...
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US20080166665 |
Method for Forming a Fine Pattern in a Semicondutor Device
A method for forming a fine pattern a semiconductor device includes the steps of forming a first photoresist pattern over a semiconductor substrate having an underlying layer; coating a pattern...
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US20080164472 |
Method of patterning transparent conductive film, thin film transistor substrate using the same and fabricating method thereof
A method of patterning a transparent conductive film adaptive for selectively etching a transparent conductive film without any mask processes, a thin film transistor for a display device using the...
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US20080158725 |
Vibration damping utilizing a patterned visco-elastic polymer
A micro-machined vibration-damping device comprises a patterned visco-elastic polymer and a substrate for receiving the patterned visco-elastic polymer.
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US20080153039 |
Manufacturing Method of Semiconductor Device
A light absorption layer is formed over a substrate, the light absorption layer is selectively irradiated with a laser beam, and a region of the light absorption layer, which is irradiated with the...
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US20080153009 |
Exposure mask, optical proximity correction device, optical proximity correction method, manufacturing method of semiconductor device, and optical proximity correction program
An optical proximity correction is provided that generates a corrected pattern P 0 corresponding to a state M 0 where the focus is in focus and the exposure dose is optimal, a corrected pattern P...
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