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US20110085939 NODE POLYPEPTIDES FOR NANOSTRUCTURE ASSEMBLY  
Engineered proteins are used in the assembly of two-dimensional and three-dimensional nanostructure assemblies, based on systematic design and production of protein node structures that can be...
US20060103295 Non-pixellated display  
A non-pixellated segmented display is disclosed. The display comprises a first electrode having a first pattern, an insulator layer having a second pattern, an electroluminescent layer, and a...
US20120110524 METHODS, PHOTOMASKS AND METHODS OF FABRICATING PHOTOMASKS FOR IMPROVING DAMASCENE WIRE UNIFORMITY WITHOUT REDUCING PERFORMANCE  
A method of improving damascene wire uniformity without reducing performance. The method includes simultaneously forming a multiplicity of damascene wires and a multiplicity metal dummy shapes in...
US20050175907 Photo mask including scattering bars and method of manufacturing the same  
A photo mask includes a transparent substrate, a main pattern, and scattering bars. The image of the main pattern is that which is transferred to photosensitive material by rays of exposure light...
US20100028810 ETCHING METHOD FOR USE IN DEEP-ULTRAVIOLET LITHOGRAPHY  
In a lithography process using an ultraviolet process, the applied ultraviolet resist can be removed by intentionally condensing the ultraviolet resist before removing the ultraviolet resist.
US20130280660 METHOD OF PATTERING NONMETAL CONDUCTIVE LAYER  
A method of patterning a nonmetal conductive layer on a circuit board is provided. A nonmetal conductive layer and a negative photoresist layer are sequentially formed on a substrate of a circuit...
US20060223011 Method for manufacturing optical semiconductor element, and optical semiconductor element  
A method for manufacturing an optical semiconductor element having a light emitting element section and a functional section. The method includes conducting dry etching, and then conducting wet...
US20090325081 EXPOSURE MASK AND MANUFACTURING METHOD OF A SEMICONDUCTOR USING THE SAME  
An exposure mask for EUV comprises an absorber formed over a mask substrate and a reflecting pattern formed over the absorber. The exposure mask for EUV prevents re-absorption of light reflected...
US20090023079 Photomask and Method of Forming Overlay Vernier of Semiconductor Device Using the Same  
This patent relates to a photomask and a method of forming an overlay vernier of a semiconductor device employing the same. The photomask includes a reticle formed of a first material through...
US20070281219 Masking techniques and contact imprint reticles for dense semiconductor fabrication  
A reticle comprising isolated pillars is configured for use in imprint lithography. In some embodiments, on a first substrate a pattern of pillars pitch-multiplied in two dimensions is formed in...
US20060008709 Mask and method for determining mask pattern line length  
A mask on which the line length of a mask pattern can be determined with great accuracy. Auxiliary patterns used for determining line length are formed near edges of a pattern to be determined....
US20060073397 Masking arrangement and method for producing integrated circuit arrangements  
A masking arrangement and method for producing integrated circuit. arrangements are described. The masking arrangement includes a substrate with lithographic patterns. The lithographic patterns...
US20050250021 Utilizing compensation features in photolithography for semiconductor device fabrication  
A photomask set includes at least two masks that combine to form a device pattern in a semiconductor device. Orthogonal corners may be produced in a semiconductor device pattern to include one...
US20050123845 Method of adjusting deviation of critical dimension of patterns  
A method of adjusting a deviation of a critical dimension of patterns formed by a photolithography process is disclosed. The method comprises measuring the deviation of the critical dimension of...
US20060183028 Method for producing a mask layout avoiding imaging errors for a mask  
In a method for producing a final mask layout for a mask, a provisional auxiliary mask layout is generated in accordance with an electrical circuit diagram. The provisional mask layout includes a...
US20050069788 Photomask, photomask manufacturing method and semiconductor device manufacturing method using photomask  
The present invention provides a photomask including a field which attenuates exposure light and causes the exposure light passed therethrough to have the same phase as that of exposure light...
US20090174036 PLASMA CURING OF PATTERNING MATERIALS FOR AGGRESSIVELY SCALED FEATURES  
A methodology is disclosed that enables the fabrication of semiconductor devices (i.e., STI structures, gates, and interconnects) with significantly reduced line edge roughness (LER) and line...
US20090246705 DI Water Rinse of Photoresists with Insoluble Dye Content  
A method of forming a pattern in a photoresist layer which contains a dye that is insoluble in the developer solution is disclosed. A rinse liquid, typically deionized water, is dispensed onto the...
US20070037101 Manufacture method for micro structure  
A micro structure manufacture method includes the steps of: (a) preparing an etching object having an etching target film, provided with a lower hard mask layer and an upper hard mask layer...
US20100321831 WRITE POLE FABRICATED USING A CARBON HARD MASK AND METHOD OF MAKING  
A magnetic writer comprises a write pole, a substrate and a non-magnetic, oxygen-free buffer material. The write pole has a leading edge, a trailing edge, a first side and second side. The...
US20080254392 FLEXIBLE CIRCUIT WITH COVER LAYER  
The invention relates to flexible circuits and more particularly to flexible printed circuits having cover layers. The cover layers may be a chemically-etchable adhesive polyimide. The cover...
US20090029559 PHOTO MASK OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING PATTERN USING THE SAME  
There is provided a photo mask for forming a specific pattern and a specific pattern formed using the photo mask. Unlike in a related method of forming a specific pattern using a photo mask...
US20070015088 METHOD FOR LITHOGRAPHICALLY PRINTING TIGHTLY NESTED AND ISOLATED HOLE FEATURES USING DOUBLE EXPOSURE  
A mask pattern including a group of small-pitched contact hole features with pitch being less than a predetermined value and isolated contact hole features with pitch being greater than the...
US20050118533 Planarization of substrate pits and scratches  
Ion-beam based deposition technique are provided for the planarization of pit and scratch defects in conjunction with particle defects. One application of this planarization technique is to...
US20070202445 Method for manufacturing micro structure  
A method for forming a pattern includes the steps of: (a) preparing a lower hard mask layer and an upper hard mask layer stacked on an etching target film; (b) forming a resist pattern above the...
US20090197208 METHOD FOR MANUFACTURING A PERPENDICULAR MAGNETIC WRITE POLE USING AN ELECTRICAL LAPPING GUIDE FOR TIGHT WRITE POLE FLARE POINT CONTROL  
A method for manufacturing a magnetic write head for perpendicular magnetic recording. The method provides for accurate definition of a device feature such as a write pole flare point. A...
US20060115747 Photo mask structure used during twice-performed photo process and methods of using the same  
A photo mask structure used during a twice-performed photo process and methods of using the same. The photo mask structure may include first mask patterns that correspond to first photoresist...
US20050250019 Mask device for photolithography and application thereof  
A mask device includes a single layer of reflection mask on a transparent substrate to simply the growth fabricating of the reflection mask, therefore, using single layer of reflection mask can...
US20070045606 Shaping a phase change layer in a phase change memory cell  
A phase change memory cell includes a phase change layer of a phase change material on a semiconductor body. A hard mask structure is formed on the phase change layer and a resist mask is formed...
US20090053487 CERAMIC CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF  
A ceramic circuit board and a manufacturing method thereof are disclosed. The method includes the steps of providing a first pre-mold plate and a first ceramic thin plate, stacking the first...
US20090142674 Photo Mask and Method for Manufacturing Semiconductor Device Using the Same  
A photo mask includes a dot pattern formed between a line pattern and an island pattern. Methods of making a semiconductor device employing such a photo mask improves yield and productivity of the...
US20080158725 Vibration damping utilizing a patterned visco-elastic polymer  
A micro-machined vibration-damping device comprises a patterned visco-elastic polymer and a substrate for receiving the patterned visco-elastic polymer.
US20070148558 Double metal collimated photo masks, diffraction gratings, optics system, and method related thereto  
A photo mask having at least 2 mask pattern layers disposed to collimate light patterns passing through the mask. An improved optical photo lithographic system utilizing light collimating photo...
US20090233183 EXPOSURE MASK AND A METHOD OF MAKING A SEMICONDUCTOR DEVICE USING THE MASK  
Disclosed herein are an exposure mask and a method of making a semiconductor device using the mask. The exposure mask includes a transparent substrate; and a light blocking pattern having first...
US20060127816 Double photolithography methods with reduced intermixing of solvents  
The present invention provides a double photolithography method in which, after a first photoresist pattern including a crosslinkable agent is formed on a semiconductor substrate, a crosslinkage...
US20120223047 METHOD OF FORMING MULTILAYER CAPACITORS IN A PRINTED CIRCUIT SUBSTRATE  
Methods of forming embedded, multilayer capacitors in printed circuit boards wherein copper or other electrically conductive channels are formed on a dielectric substrate. The channels may be...
US20060046200 Mask material conversion  
The dimensions of mask patterns, such as pitch-multiplied spacers, are controlled by controlled growth of features in the patterns after they are formed. To form a pattern of pitch-multiplied...
US20110195360 METHODS TO FABRICATE A PHOTOACTIVE SUBSTRATE SUITABLE FOR MICROFABRICATION  
A method of fabrication and device with holes for electrical conduction made by preparing a photosensitive glass substrate comprising at least silica, lithium oxide, aluminum oxide, and cerium...
US20080138581 Masking high-aspect aspect ratio structures  
A method of masking high-aspect ratio structures on a wafer includes submerging the wafer in a resist material so that the high-aspect ratio structures are at least partially embedded within the...
US20080299494 DOUBLE PATTERNING WITH A DOUBLE LAYER CAP ON CARBONACEOUS HARDMASK  
Methods to etch features in a substrate with a multi-layered double patterning mask. The multi-layered double patterning mask includes a carbonaceous mask layer, a first cap layer on the...
US20150227042 PHOTOSENSITIVE ELEMENT  
The present invention relates to a photosensitive element comprising a support film, and a photosensitive layer on the support film, wherein a haze of the support film is 0.01 to 1.0% and a total...
US20070178388 Semiconductor devices and methods of manufacturing thereof  
Semiconductor devices and methods of manufacturing thereof are disclosed. A plurality of features is formed on a workpiece, the plurality of features being located in a first region and a second...
US20060240361 Method of forming small pitch pattern using double spacers  
A method of forming a small pitch pattern using double spacers is provided. A material layer and first hard masks are used and characterized by a line pattern having a smaller line width than a...
US20050147920 Method and system for immersion lithography  
A system (100) and method for immersion lithography is disclosed in which an immersion medium (112) interfaces with a proximal lens (110) that focuses a patterned light beam on a light sensitive...
US20060257795 METHOD FOR FORMING COMPOSITE PATTERN INCLUDING DIFFERENT TYPES OF PATTERNS  
A method for forming a composite pattern including different types of patterns is described. A substrate having a material layer thereon is provided, and two or more masks each having at least one...
US20080020327 METHOD OF FORMATION OF A DAMASCENE STRUCTURE  
A method in which during the formation of damascene features in a semiconductor structure, a planarization material is added to vias formed in the dielectric to protect the vias during subsequent...
US20100129754 Hot melt compositions  
Hot melt compositions include acid waxes and acrylate functional monomers free of acid groups. Upon application of actinic radiation, the hot melt compositions cure to form and etch resist. The...
US20080182208 Method and System for Closing Plate Take-Over in Immersion Lithography  
Aspects of the present disclosure provide a method and a system for closing plate take-over in immersion lithography. A plate holder is provided for a closing plate in a wafer holder of an...
US20060240330 Exposure method, mask, semiconductor device manufacturing method, and semiconductor device  
To provide an exposure method and mask capable of suppressing a fluctuation of a dimension of a resist pattern caused by a flexure of a membrane and a semiconductor device formed with a fine...
US20100151392 ANTIREFLECTIVE COATING COMPOSITIONS  
The present invention relates to an organic spin coatable antireflective coating composition comprising a polymer, a linking component, a crosslinker, and an acid generator. The invention further...

Matches 1 - 50 out of 271 1 2 3 4 5 6 >