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US20110143159 Fine-Grained Metallic Coatings Having The Coeficient Of Thermal Expansion Matched To One Of The Substrate  
Fine-grained (average grain size 1 nm to 1,000 nm) metallic coatings optionally containing solid particulates dispersed therein are disclosed. The fine-grained metallic materials are significantly...
US20140057054 CO-EVAPORATION ALLOY MATERIAL AND EVAPORATION COATING METHOD USING THE SAME  
A co-evaporation alloy material includes a first evaporation material and a second evaporation material, the first evaporation material being completely covered by the second evaporation material....
US20140079957 PROCESS FOR TIN COATING A METALLIC SUBSTRATE, PROCESS FOR HARDENING A TIN LAYER AND WIRE HAVING A TIN COATING  
The present invention is directed to a process for tin coating a metallic substrate, and a process for hardening a tin layer and wire having a tin coating The invention relates in particular to a...
US20120177945 Whisker-Free Coating Structure and Method for Fabricating the Same  
The present invention relates to a whisker-free coating structure and a method for fabricating the same. The whisker-free coating structure comprises a substrate, a tungsten doped copper layer and...
US20130029177 COLD SPRAYED AND HEAT TREATED COATING FOR MAGNESIUM  
Methods of coating a magnesium substrate are provided along with coated magnesium substrates. A low melting point material is cold sprayed onto a region of the magnesium substrate. A corrosion...
US20140141278 MULTI-COATED METALLIC PRODUCTS AND METHODS OF MAKING THE SAME  
The present invention relates generally to a coated jewelry article or a coated component of a jewelry article, comprising a jewelry article or a component of a jewelry article, a first metallic...
US20060204779 Precursor for fabricating Nb3Sn superconducting wire, and Nb3Sn superconducting wire and method for fabricating same  
A method for fabricating a Nb3Sn superconducting wire includes the steps of loading or inserting a core material containing at least Sn into a pipe member made of Nb or a Nb alloy, inserting the...
US20120308844 MULTI-COATED METALLIC PRODUCTS AND METHODS OF MAKING THE SAME  
The present invention relates generally to methods for producing a coated jewelry article or a coated component of a jewelry article, comprising a jewelry article or a component of a jewelry...
US20070122646 SOLDER COMPOSITION AND SOLDERING STRUCTURE  
A solder composition for reacting with aluminum is provided. The main alloying components in the solder includes tin (Sn), zinc (Zn) and chromium (Cr) with 0.01 wt % to 20 wt % zinc and 0.01 wt %...
US20140141277 COATED METALLIC PRODUCTS AND METHODS FOR MAKING THE SAME  
The present invention relates generally to jewelry articles comprising a substrate and a metallic, external coating.
US20120148870 SELF-REMOVAL ANTI-STICTION COATING FOR BONDING PROCESS  
A bond free of an anti-stiction layer and bonding method is disclosed. An exemplary method includes forming a first bonding layer; forming an interlayer over the first bonding layer; forming an...
US20130330572 WINDSCREEN WIPER DEVICE  
The invention relates to a layered composite material for sliding elements, comprising a base layer, applied to the surface of a sliding element, made of an alloy comprising copper or aluminum and...
US20110268920 TIN-PLATED PRODUCT AND METHOD FOR PRODUCING SAME  
A tin-plated product formed by electroplating a substrate in a tin plating solution, which contains carbon particles and an aromatic carbonyl compound, to form a coating of a composite material,...
US20090197114 MODIFICATION OF PB-FREE SOLDER ALLOY COMPOSITIONS TO IMPROVE INTERLAYER DIELECTRIC DELAMINATION IN SILICON DEVICES AND ELECTROMIGRATION RESISTANCE IN SOLDER JOINTS  
A solder joint comprising a solder capture pad on a substrate having a circuit; and a lead free solder selected from the group comprising Sn—Ag—Cu solder and Sn—Ag solder adhered to the solder...
US20070224444 Plating film and forming method thereof  
Tin plating film composed of tin or tin alloy is formed on a front surface and a rear surface of a substrate composing a lead frame. As tin alloy, for example, tin-copper alloy (content of copper:...
US20080050611 Tin-Based Plating Film and Method for Forming the Same  
The present invention provides a tin-based two-layered plating film exhibiting suppressed whisker growth comprising a lower layer of a tin plating film or tin alloy plating film comprising 5% by...
US20120114971 WEAR RESISTANT LEAD FREE ALLOY SLIDING ELEMENT METHOD OF MAKING  
A sliding element 20, such as a bushing or bearing, includes a sintered powder metal base 24 deposited on a steel backing 22. The base 24 includes a tin, bismuth, first hard particles 40, such as...
US20130004792 MICROFEATURE WORKPIECES HAVING ALLOYED CONDUCTIVE STRUCTURES, AND ASSOCIATED METHODS  
Microfeature workpieces having alloyed conductive structures, and associated methods are disclosed. A method in accordance with one embodiment includes applying a volume of material to a target...
US20140030634 METHOD FOR BONDING ALUMINUM-BASED METALS  
An inexpensive bonding method is provided to bond materials constituted of an aluminum-based metal to each other at a low temperature and a low pressure while inhibiting deformation, without...
US20150190984 DEGRADABLE METAL COMPOSITES, METHODS OF MANUFACTURE, AND USES THEREOF  
A metal composite comprises: a first matrix comprising magnesium, a magnesium alloy, or a combination thereof; a second matrix comprising aluminum, an aluminum alloy, steel, a zinc alloy, a tin...
US20080182124 MODIFICATION OF SOLDER ALLOY COMPOSITIONS TO SUPPRESS INTERFACIAL VOID FORMATION IN SOLDER JOINTS  
A solder joint comprising a solder capture pad on a substrate having a circuit; and a lead containing or a lead free solder selected from the group comprising Sn—Ag—Cu solder, Sn—Cu solder and...
US20120321909 Multilayered bearing shell  
The invention relates to a multilayered bearing shell (2) comprising a back metal layer (3) as a carrier element for the layer structure and at least one further bearing layer joined to the back...
US20110236712 COPPER ALLOY AND ELECTRICALLY CONDUCTIVE MATERIAL FOR CONNECTING PARTS, AND MATING-TYPE CONNECTING PART AND METHOD FOR PRODUCING THE SAME  
The surface roughness of a copper sheet is adjusted to have an arithmetic mean roughness Ra of 0.5 μm or more and 4.0 μm or less in a direction parallel to a sliding direction upon connection, a...
US20100266870 SOLDER JOINT  
A solder joint manufactured of an alloy essentially composed of 0.01-7.6 wt % Cu, 0.001-6 wt % Ni, and the remaining of Sn. Each of Cu and Ni has a maximum concentration range. The lower limit of...
US20110240279 HYBRID LIQUID METAL-SOLDER THERMAL INTERFACE  
The present invention is hybrid liquid metal-solder thermal interface. In one embodiment, a thermal interface for coupling a heat generating device to a heat sink includes a first metal interface...
US20110293962 SOLDER JOINTS WITH ENHANCED ELECTROMIGRATION RESISTANCE  
Electronic assemblies and solders used in electronic assemblies are described. One embodiment includes a die and a substrate, with a solder material positioned between the die and the substrate,...
US20050095489 Metallic separator for fuel cell and manufacturing method therefor  
A metallic separator for a fuel cell (and a manufacturing method therefore) can reduce damage to an electrode assembly, open up the maximum capacity of the reducing effect of contact resistance...
US20110003171 STRONG, LIGHTWEIGHT ARTICLE CONTAINING A FINE-GRAINED METALLIC LAYER  
Articles for automotive, manufacturing and industrial applications including shafts or tubes used, for example, as golf club shafts, ski and hiking poles, fishing rods or bicycle frames, skate...
US20070275262 Reducing formation of tin whiskers on a tin plating layer  
A plated substrate comprises a plating layer disposed outwardly from a substrate. The substrate comprises a substrate material, where the substrate material comprises a metal. The plating layer...
US20140144613 ALUMINUM ALLOY CLAD MEMBER ADOPTED TO HEAT EXCHANGER, AND CORE MATERIAL FOR THE SAME  
A core material for an aluminum alloy clad material contains Si in a content of 0.3% to 1.5% (hereinafter “%” means “percent by mass”), Mn in a content of 0.3% t 2.0%, Cu in a content of 0.3% to...
US20120112201 HIGH MELTING POINT SOLDERING LAYER AND FABRICATION METHOD FOR THE SAME, AND SEMICONDUCTOR DEVICE  
A high melting point soldering layer includes a low melting point metal layer, a first high melting point metal layer disposed on a surface of the low melting point metal layer, and a second high...
US20110220704 COMPOSITE SOLDER ALLOY PREFORM  
Various embodiments of the invention provide laminate composite preform foils for high-temperature Pb-free soldering applications. The laminate composite preform foil is composed of a...
US20070059548 Grid array package using tin/silver columns  
Techniques have been developed to provide, in some embodiments, an attachment structure for mechanically and electrically connecting substrates that is robust to differences in coefficients of...
US20050123784 Terminal having surface layer formed of Sn-Ag-Cu ternary alloy formed thereon, and part and product having the same  
A terminal obtained by forming a surface layer formed of an Sn—Ag—Cu ternary alloy with electroplating on a whole surface or a portion of a conductive base, wherein the Sn—Ag—Cu ternary alloy is...
US20070031696 Plain bearing composite material comprising a sputtered bearing coating  
The invention relates to a plain bearing composite material comprising a steel carrier layer, a carrier layer which is cast, sintered or cladded thereon, the carrier layer being made of bronze or...
US20100203353 Pb-Free Sn-Ag-Cu-Mn Solder  
A solder alloy comprises Sn, Ag, Cu, and Mn and has a melting temperature of about 211 degrees C. A solder joint and solder process embody the solder alloy as well as solder balls and solder paste...
US20140370328 Tin Whisker Mitigation Material Using Thin Film Metallic Glass Underlayer  
The present invention relates to a tin whisker mitigation material using thin film metallic glass underlayer, which is a thin film metallic glass (TFMG) formed between a metal substrate and a tin...
US20130323530 ACTIVE SOLDER  
An active solder is revealed. The active solder includes an active material and a metal substrate. There are two kinds of active materials, titanium together with rare earth elements and...
US20130029178 ACTIVE SOLDER  
An active solder is revealed. The active solder includes an active material and a metal substrate. There are two kinds of active materials, titanium together with rare earth elements and...
US20110072976 METHOD OF REDUCING THE QUANTITY OF LEAD RELEASED BY BRONZE AND/OR BRASS WATER-SYSTEM COMPONENTS INTO LIQUIDS THAT ARE INTENDED FOR HUMAN CONSUMPTION  
A method of reducing the quantity of lead released by water-system components made of metal alloys containing lead when they are in contact with liquids intended for making beverages for human use...
US20140045392 COPPER ALLOY AND ELECTRICALLY CONDUCTIVE MATERIAL FOR CONNECTING PARTS, AND MATING-TYPE CONNECTING PART AND METHOD FOR PRODUCING THE SAME  
A copper sheet is adjusted to have arithmetic mean roughness Ra of from 0.5 μm to 4.0 μm in a direction parallel to a sliding direction upon connection, mean projection-depression interval of from...
US20130195580 Fastening Means and Associated Production Method  
A fastening mechanism includes a basic body made from a base metal, onto which at least one corrosion-resistant layer is applied. A further layer is applied at least partially onto the at least...
US20090023011 Systems and Methods for Forming Conductive Traces on Plastic Substrates  
Systems and methods for forming conductive traces on plastic substrates. In one embodiment, conductive traces are formed by forming a polyelectrolyte layer on a polymeric substrate and growing...
US20110206946 METHOD FOR PRODUCING A CARBON NANOTUBE-, FULLERENE- AND/OR GRAPHENE-CONTAINING COATING  
A method for producing a carbon nanotube-, fullerene- and/or graphene-containing coating on a substrate includes the steps of applying carbon nanotubes, fullerenes and/or graphenes onto a...
US20050069725 Lead-free solder composition for substrates  
A lead-free solder composition for soldering onto a substrate includes a solder having Tin (Sn) and Silver (Ag); and an additive having a low coefficient of thermal expansion.
US20120021247 Refrigeration Circuit-Forming Member  
Disclosed is a refrigeration circuit-forming member which has a metal surface and is used for a refrigeration circuit in which HFO-1234yf that is a refrigerant configured of molecules having a...
US20080157359 Crack-resistant solder joint, electronic component such as circuit substrate having the solder joint, semiconductor device, and manufacturing method of electronic component  
An electronic component according to the present invention includes a land 112 having a flat reference surface p1 and having a solder joint p3 to be solder bonded, wherein the solder joint p3 as a...
US20070172690 Joining method, method of mounting semiconductor package using the same, and substrate-joining structure prepared by the joining method  
A joining method, a method of mounting a semiconductor package (PKG) using the same, and a substrate-joining structure prepared thereby are provided. The joining method may comprise placing a...
US20110033728 Method and System for Repairing Cracks in Structures  
A first material with a known maximum temperature of operation is coated with a second material on at least one surface of the first material. The coating has a melting temperature that is greater...
US20150047879 METALLIC MATERIAL FOR ELECTRONIC COMPONENTS, AND CONNECTOR TERMINALS, CONNECTORS AND ELECTRONIC COMPONENTS USING SAME  
The present invention provides a metallic material for electronic components having a low degree of whisker formation and a high durability, and connector terminals, connectors and electronic...
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