Matches 1 - 50 out of 81 1 2 >


Match Document Document Title
US20120148862 Copper Foil for Printed Circuit Board and Copper Clad Laminate for Printed Circuit Board  
A copper foil for a printed circuit board is provided. The copper foil includes a layer including nickel, zinc, a compound of nickel and that of zinc (hereinafter referred to as a “nickel zinc...
US20150104667 CLADDING MATERIAL FOR STAINLESS STEEL CLAD STEEL PLATE, STAINLESS STEEL CLAD STEEL PLATE INCLUDING THE SAME, AND METHOD OF MANUFACTURING THE SAME  
A cladding material for stainless steel clad steel plate, includes, by mass %, 0.03% or less carbon, 1.5% or less silicon, 2.0% or less manganese, 0.04% or less phosphorus, 0.03% or less sulfur,...
US20070082214 Stainless steel strip coated with aluminium  
A coated stainless steel strip product with a dense and evenly distributed aluminum layer on one side or both sides of said strip is provided. Said layer consists of essentially pure aluminum, the...
US20090095515 ELECTRO-DEPOSITED COPPER FOIL, SURFACE-TREATED COPPER FOIL USING THE ELECTRO-DEPOSITED COPPER FOIL AND COPPER CLAD LAMINATE USING THE SURFACE-TREATED COPPER FOIL, AND A METHOD FOR MANUFACTURING THE ELECTRO-DEPOSITED COPPER FOIL  
An object of the present invention is to provide an electro-deposited copper foil having the equivalent low-profile surface as in a conventional low-profile electro-deposited copper foil and...
US20110080164 MAGNETO-SENSITIVE WIRE, MAGNETO-IMPEDANCE ELEMENT AND MAGNETO-IMPEDANCE SENSOR  
The magneto-sensitive wire of the invention has a vortex-spin structure and hence includes no magnetic domain walls, so that the magneto-sensitive wire of the invention has an excellent hysteresis...
US20150195909 Ultrathin Copper Foil And Method Of Manufacturing The Same, And Ultrathin Copper Layer  
Provided is an ultrathin copper foil which has improved thickness accuracy of an ultrathin copper layer on a supporting copper foil. An ultrathin copper foil which is provided with a supporting...
US20110189499 SURFACE TREATED COPPER FOIL AND COPPER CLAD LAMINATE  
To provide a surface treated copper foil satisfying all of the bonding strength to polyimide film, chemical resistance, and etching property, and to provide a CCL using the surface treated copper...
US20130216854 Vacuum Insulated Panels of Arbitrary Size and Method for Manufacturing the Panels  
The present invention is a vacuum insulated panel (VIP) for increasing the thermal insulation surrounding a structure or volume, and a novel method for manufacturing the VIP. The VIP comprises at...
US20070237978 FUNCTIONAL DIRECT COATING OF AN ALUMINIUM FOIL  
A method of manufacturing a coated aluminium foil wherein the aluminium foil is manufactured from a hot strip or a cast strip of aluminium or an aluminium alloy by cold-rolling with or without...
US20150184302 TIN-PLATED COPPER-ALLOY TERMINAL MATERIAL  
By forming a nickel-based coating layer or a cobalt-based coating layer having a coating thickness of 0.005 μm or larger and 0.05 μm or smaller on an outermost surface of a tin-based surface layer...
US20070207336 Metal foil having different indentations and assembly, honeycomb body and exhaust gas treatment device having a metal foil  
A metal foil has a material thickness in a range of from 0.15 mm to 0.02 mm and a structure with elevations and depressions which extend over a length of the metal foil and are disposed adjacent...
US20050181228 Metal-cladded metal matrix composite wire  
Metal-cladded metal matrix composite wires that include a hot worked metal cladding associated with the exterior surface of a metal matrix composite wire comprising a plurality of continuous,...
US20130240257 COPPER FOIL FOR PRINTED WIRING BOARD  
Provided is a copper foil for a printed wiring board, the copper foil being suitable for achieving finer pitch, favorable in terms of manufacturing cost, and excellent both in etching ability and...
US20110123822 NANOSIZE STRUCTURES COMPOSED OF VALVE METALS AND VALVE METAL SUBOXIDES AND PROCESS FOR PRODUCING THEM  
A strip-like or sheet-like valve metal or valve metal suboxide structure which has a transverse dimension of from 5 to 100 nm.
US20140272450 NEAR EUTECTIC COMPOSITION NICKEL BASE SANDWICH BRAZE FOIL  
A braze foil (10) formed of a plurality of layers (12, 14, 16) of differing compositions wherein a combined melt of the foil has a desired braze composition, and wherein each layer is sufficiently...
US20070259198 Joining material for positioning brazing material, process for producing a honeycomb body, corresponding honeycomb body and motor vehicle having a honeycomb body  
A joining material for positioning brazing material on at least one discrete joining region of an at least partially metallic surface, includes a brazing material formed discontinuously on a...
US20060154102 Soft thin laminated substrate  
A soft thin laminated substrate including a plastic substrate, an alloy copper layer overlaid on the plastic substrate and a copper foil overlaid on the alloy copper layer. The alloy copper layer...
US20060147742 Composite copper foil, method of production thereof and high frequency transmission circuit using said composite copper foil  
A composite copper foil excellent in conductivity and surface shape, having high strength and able to be used for applications such as high frequency transmission circuits and a method of...
US20130040162 SURFACE-TREATED COPPER FOIL, METHOD FOR PRODUCING SAME, AND COPPER CLAD LAMINATED BOARD  
Provided is an industrially excellent surface-treated copper foil which satisfies requirements for adhesiveness to an insulating resin such as polyimide, heat-resistant adhesiveness, chemical...
US20120164470 SILVER-NICKEL CORE-SHEATH NANOSTRUCTURES AND METHODS TO FABRICATE  
Embodiments of the invention generally provide core-sheath nanostructures and methods for forming such nanostructures. In one embodiment, a method for forming core-sheath nanostructures includes...
US20070141379 Powder-coated spinning wire and fabrication method thereof  
The invention relates to a powder-coated spinning wire used for a main cable of a suspension bridge and a fabrication method thereof. The powder-coated spinning wire has a shot-blasted plating...
US20110088933 LOW DIELECTRIC LOSS WIRING BOARD, MULTILAYER WIRING BOARD, COPPER FOIL AND LAMINATE  
A wiring board comprising a copper wiring, and an insulating layer which is a cured product of a resin composition containing a compound having a carbon-carbon unsaturated double bond as a...
US20060240272 Stabilized aluminum laminate having aluminum and stabilizing layer laminated thereon  
An aluminum stabilization stacked body formed by stacking a stabilization layer formed with a metal and having a thickness of 0.001-1 μm with any of a sputtering method, a deposition method and an...
US20100316884 COPPER-CLAD LAMINATE  
A copper-clad laminate is composed of a copper foil and an aromatic polyimide film placed thereon, in which the copper foil is bonded to the polyimide film at a bonding strength of ≧500 N/m and...
US20150064493 COPPER FOIL COMPOSITE, FORMED PRODUCT AND METHOD OF PRODUCING THE SAME  
A copper foil composite comprising a copper foil and a resin layer laminated thereon, satisfying an equation 1: (f3×t3)/(f2×t2)=>1 wherein t2 (mm) is a thickness of the copper foil, f2 (MPa) is a...
US20130295407 SURFACE-TREATED COPPER FOIL  
An object of the present invention is to provide a copper foil excellent in softening resistance performance which reduces decrease in tensile strength after heat treatment at about 350° C. to...
US20090047539 SURFACE-TREATED ELECTRO-DEPOSITED COPPER FOIL AND METHOD FOR MANUFACTURING THE SAME  
It is an object to provide a surface-treated electro-deposited copper foil which has a low profile at a level equal to or excellent than that of low-profile surface-treated electro-deposited...
US20090029186 SURFACE-TREATED COPPER FOIL, MANUFACTURING METHOD OF THE SURFACE-TREATED COPPER FOIL, AND SURFACE-TREATED COPPER FOIL COATED WITH VERY THIN PRIMER RESIN LAYER  
It is an object of the present invention to provide a surface-treated copper foil comprising an electrodeposited copper foil with a chromium-free rust-proofing layer which exhibits good...
US20090305076 FOIL BASED SEMICONDUCTOR PACKAGE  
The present inventions relate to methods and arrangements for using a thin foil to form electrical interconnects in an integrated circuit package. In one embodiment, a foil carrier structure is...
US20100261033 Copper Foil for Printed Circuit Board and Copper Clad Laminate for Printed Circuit Board  
Provided is a copper foil for a printed circuit board comprising a layer including nickel, zinc, a compound of nickel and that of zinc (hereinafter referred to a “nickel zinc layer”) on a...
US20150162576 SURFACE-TREATED STEEL SHEET FOR BATTERY CONTAINERS, BATTERY CONTAINER, AND BATTERY  
There is provided a surface-treated steel sheet for battery containers. The surface-treated sheet is used to form a battery container for a battery. The battery uses a nonaqueous electrolytic...
US20120196144 ULTRA THIN COPPER FOIL WITH VERY LOW PROFILE COPPER FOIL AS CARRIER AND ITS MANUFACTURING METHOD  
The present invention relates to an ultra thin copper foil with a very low profile copper foil as a carrier, comprising a carrier foil a release layer and an ultra thin copper foil. The copper...
US20110297641 Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circuit, and Method of Forming Electronic Circuit using same  
Provided is a rolled copper foil or electrolytic copper foil for an electronic circuit to be used for forming a circuit by etching, wherein the copper foil comprises a nickel or nickel alloy layer...
US20150262725 COMPOSITE CONDUCTOR  
A composite conductor is composed of a core including a titanium or a titanium alloy, a cladding layer including a copper and being provided to clad an outer periphery of the core, and an...
US20110293960 Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circuit, and Method of Forming Electronic Circuit using same  
Provided is a rolled copper foil or electrolytic copper foil for an electronic circuit to be used for forming a circuit by etching, wherein the copper foil comprises a heat resistance layer...
US20110300401 Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circuit, and Method of Forming Electronic Circuit using same  
A rolled copper foil or electrolytic copper foil for an electronic circuit to be used for forming a circuit by etching, characterized in comprising a layer of metal of one or more types among a...
US20140349133 HOT-DIP GALVANIZED STEEL SHEET HAVING EXCELLENT ADHESIVENESS AT ULTRA-LOW TEMPERATURES AND METHOD MANUFACTURING THE SAME  
Provided is a hot-dip galvanized steel sheet having excellent adhesiveness at ultra-low temperatures as well as fine spangles, and a method of manufacturing the same. According to the present...
US20130270218 Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circuit, and Method of Forming Electronic Circuit Using Same  
A rolled copper foil or electrolytic copper foil for an electronic circuit to be used for forming a circuit by etching, characterized in comprising a layer of metal of one or more types among a...
US20140287259 STEEL FOIL AND METHOD FOR MANUFACTURING THE SAME  
A steel foil according to an aspect of the present invention includes a rolled steel foil; and a Ni having <111>//RD texture plated on an outermost layer of the rolled steel foil. Regarding the...
US20130236737 METAL FOIL FOR BASE MATERIAL  
A metal foil including: a steel layer whose thickness is 10 to 200 μm; an alloy layer which contains Fe and Al and which is formed on the steel layer; and an Al-containing metal layer arranged on...
US20070138961 CONDUCTIVE ELEMENT HAVING A CORE AND COATING AND METHOD OF MAKING  
A conductive element including a core and a coating, wherein the core comprises a material selected from the group consisting of molybdenum, molybdenum alloys, rhenium, rhenium alloys,...
US20090291319 COPPER FOIL WITH CARRIER SHEET, METHOD FOR MANUFACTURING COPPER FOIL WITH CARRIER SHEET, SURFACE-TREATED COPPER FOIL WITH CARRIER SHEET AND COPPER-CLAD LAMINATE USING THE SURFACE-TREATED COPPER FOIL WITH CARRIER SHEET  
An object of the present invention is to provide a copper foil with carrier sheet which permits releasing of the carrier sheet from the copper foil layer even when hot pressing at a temperature...
US20130330567 REACTIVE METALLIC SYSTEMS AND METHODS FOR PRODUCING REACTIVE METALLIC SYSTEMS  
The invention relates to reactive metallic systems and to methods of producing reactive metallic systems. Such systems consist of metallic particles in the form of powders or pastes, or of...
US20150086806 Carrier-Attached Copper Foil  
The present invention provides a carrier-attached copper foil, wherein an ultrathin copper foil is not peeled from the carrier prior to the lamination to an insulating substrate, but can be peeled...
US20130216855 CARRIER-ATTACHED COPPER FOIL  
The present invention provides a carrier-attached copper foil, wherein an ultrathin copper foil is not peeled from the carrier prior to the lamination to an insulating substrate, but can be peeled...
US20080145689 Adhesion Assisting Agent Fitted Metal Foil, and Printed Wiring Board Using Thereof  
Provided is an adhesion assisting agent fitted metal foil, comprising an adhesion assisting agent layer having a thickness of 0.1 to 10 μm on a metal whose surface has a ten-point average...
US20130065074 GRAPHITE OXIDE-CONTAINING RESIN FORMULATION, COMPOSITION, AND COMPOSITE THEREOF  
The present disclosure is related to a carbon-nanomaterial-supported catalyst, including: a carbon nanomaterial, and a polymer grafted onto the carbon nanomaterial, wherein the polymer has a...
US20070141378 Low melting temperature alloy structure for enchanced thermal interface  
A method and associated apparatus for providing an enhanced thermal interface. The interface is formed by application of a structure or foil embedded in an alloy in solid form between two...
US20150024943 COMPOUND SUPERCONDUCTING WIRE AND METHOD FOR MANUFACTURING THE SAME  
A compound superconducting wire 10 includes a reinforcement portion 12 and a compound superconductor 11. In the reinforcement portion 12, an assembly of plural reinforcement elements 4 are...
US20100132408 Coating for a device for forming glass products  
The invention relates to a coating for a device for forming glass products, comprising: a first quasicrystalline or approximant or amorphous metallic phase; anda second phase composed of a...

Matches 1 - 50 out of 81 1 2 >