Match Document Document Title
US20150216525 AUTHENTICATION SYSTEM FOR REUSABLE SURGICAL INSTRUMENTS  
An authentication system for use in a surgical stapling device includes an authentication board assembly disposed at a proximal end of a loading unit and having a contact assembly, and an adapter...
US20130100624 CIRCUIT BOARD CONTACT PADS  
The present disclosure provides a circuit board with a first via and a second via, the first and second vias providing an electrical path from a top surface of the circuit board to a bottom...
US20140055969 BOARD ASSEMBLIES WITH MINIMIZED WARPAGE AND SYSTEMS AND METHODS FOR MAKING THE SAME  
Board assemblies with minimized warpage and systems and methods for making the same are disclosed. A board may be pre-conditioned by designing the board to mount components in selected areas of...
US20120026707 PRINTED CIRCUIT BOARD  
A printed circuit board includes first and second layers, a control chip, bonding pads, and several electronic elements. The bonding pads can be selectively applied to interconnect the first and...
US20130063916 Protection for Circuit Boards  
A system has a circuit board, an integrated circuit being mounted on the circuit board by external contacts, and a cover irreversibly connected to the circuit board. The cover covers the external...
US20110222256 CIRCUIT BOARD WITH ANCHORED UNDERFILL  
Various circuit boards and methods of manufacturing using the same are disclosed. In one aspect, a method of manufacturing is provided that includes applying a solder mask to a side of a circuit...
US20110304352 Control Board For Connection Between FPGA Boards And Test Device Thereof  
A Field Programmable Gate Arrays (FPGA) connection control board is provided. The FPGA connection control board includes a printed circuit board (PCB), a plurality of first connection terminals...
US20130128485 METHOD FOR ENHANCING RELIABILITY OF WELDING SPOT OF CHIP, PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE  
The present invention relates to processing of PCBA, and provides a method for enhancing reliability of a welding spot of a chip, a printed circuit board and an electronic device. The method for...
US20110226860 PRINTED CIRCUIT BOARD WITH ANTENNA FOR RFID CHIP AND METHOD FOR MANUFACTURING THE SAME  
A printed circuit board with an antenna for an RFID chip and a method for manufacturing the printed circuit board are provided. The method includes steps of providing a printed circuit board...
US20110090660 PRINTED CIRCUIT BOARD  
A printed circuit board includes a board body, a number of filtering capacitors, and a chip. The board body includes a chip mount area. The chip mount area includes a first area and a second area....
US20140016289 NETWORK COMMUNICATION DEVICE  
A network communication device is disclosed. The network communication device includes a circuit board, a network connector, a network chip and a plurality of network magnetic assemblies. The...
US20110286192 PRINTED WIRING BOARD AND METHOD OF SUPPRESSING POWER SUPPLY NOISE THEREOF  
Disclosed is a printed wiring board having signal layers each interposed between a power supply layer and a ground layer, wherein the signal layer includes at least one of a wiring region for a...
US20140063744 Vertically Stacked Power FETS and Synchronous Buck Converter Having Low On-Resistance  
A power FET (100) comprising a leadframe including a pad (110), a first lead (111), and a second lead (112); a first metal clip (150) including a plate (150a), an extension (150b) and a ridge...
US20090129041 Stacked semiconductor module, method of fabricating the same, and electronic system using the same  
A stacked semiconductor module, a method of fabricating the same, and an electronic system using the module are provided. A first semiconductor module having a plurality of semiconductor devices...
US20100124037 THERMOSETTING COMPOSITION AND PRINTED CIRCUIT BOARD USING THE SAME  
A thermosetting composition including an organic solvent, a liquid crystalline thermoset oligomer, and either a crosslinking agent or an epoxy resin or both is disclosed. A printed circuit board...
US20140153266 DISPLAY DEVICE  
A display device includes a flexible display panel for displaying an image, and a printed circuit board electrically connected with the flexible display panel through a circuit film. The printed...
US20140055159 Interposer with Edge Probe Points  
An interposer is shown with contact points on a lateral edge. When assembled between a board under test and an integrated circuit, traces of the interposer carry signals between the board under...
US20090279270 DUAL-CHANNEL OPTICAL NAVIGATION DEVICE  
A dual-channel optical navigation system with vertically aligned sensors. The dual-channel optical navigation system includes a circuit board, a contact navigation sensor, and a free-space...
US20130101871 PROTECTIVE CIRCUIT MODULE AND BATTERY PACK HAVING THE SAME  
A protective circuit module includes a printed circuit board; and an electronic device on the printed circuit board, the electronic device including: an integrated circuit chip; at least one...
US20120268909 Enhanced Modularity in Heterogeneous 3D Stacks  
A three-dimensional computer processing chip stack that includes a host layer disposed on at least one other layer in the stack. The host layer includes cavities formed thereon for receiving chips...
US20120170237 SUBSTRATE ASSEMBLY PROVIDED WITH CAPACITIVE INTERCONNECTIONS, AND MANUFACTURING METHOD THEREOF  
An assembly including: a first substrate having a first surface and housing a first electrical-interconnection element and a second electrical-interconnection element in a position corresponding...
US20150181717 PANEL WITH RELEASABLE CORE  
Generally discussed herein are systems and apparatuses that can include a releasable core panel. The disclosure also includes techniques of making and using the systems and apparatuses. According...
US20140055971 SURFACE MOUNT ACTUATOR  
A silicon MEMS device can have at least one solder contact formed thereupon. The silicon MEMS device can be configured to be mounted to a circuit board via the solder contact(s). The silicon MEMS...
US20100321910 PRINTED CIRCUIT BOARD  
A printed circuit board includes a first signal layer, a first reference layer, a second reference layer, and a second signal layer. An integrated circuit mounted on the first signal layer...
US20120106111 ANISOTROPIC ELECTRICALLY AND THERMALLY CONDUCTIVE ADHESIVE WITH MAGNETIC NANO-PARTICLES  
A composition of matter comprising a plurality of nanoparticles in a non-conductive binder, wherein, the type of nanoparticles form isolated parallel electrically and thermally conductive columns...
US20120087099 Printed Circuit Board For Board-On-Chip Package, Board-On-Chip Package Including The Same, And Method Of Fabricating The Board-On-Chip Package  
Provided is a printed circuit board for a board-on-chip package prepared with a strip level of a plurality of unit substrates and including a reject marking portion for determining whether there...
US20110007489 EPOXY RESIN COMPOSITION, RESIN SHEET, PREPREG, MULTILAYER PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE  
An object of the present invention is to provide an epoxy resin composition that provides, when used for an insulation layer of a multilayer printed wiring board, a multilayer printed wiring board...
US20150022989 UTILIZING CHIP-ON-GLASS TECHNOLOGY TO JUMPER ROUTING TRACES  
A chip-on-glass device comprises a chip-on-glass substrate, a metal layer, and a plurality of chip-on-glass connection bumps. The metal layer comprises a plurality of passive jumper routing...
US20110159815 Wireless Device  
The present invention discloses a wireless device, which includes a substrate and an antenna. The antenna includes a printed antenna element and a 3-dimensional antenna element. The printed...
US20120293973 MULTILAYERED WIRING BOARD AND METHOD FOR FABRICATING THE SAME  
In a multilayered wiring board constituted by laminating to form pluralities of layers of wiring layers 105, 108, 110 and insulating layers 104, 106, 107, in the plurality of laminated insulating...
US20110286190 Enhanced Modularity in Heterogeneous 3D Stacks  
Enhanced modularity in heterogeneous three-dimensional computer processing chip stacks includes a method of manufacture. The method includes preparing a host layer and integrating the host layer...
US20050207132 Printed circuit board with electromagnetic interference (EMI) radiation suppressed  
A printed circuit board with EMI radiation suppression is disclosed. An integrated circuit and an RC filter are disposed and wired in the printed circuit board including a top layer and a bottom...
US20130083504 ELECTRONIC DEVICE  
An electronic device includes: a first plate; a wiring board arranged on the first plate and configured to have a plurality of first terminals on a surface opposite to a surface facing the first...
US20110255258 RESIN COMPOSITION, PREPREG, RESIN SHEET, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, MULTILAYER PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE  
Disclosed is a resin composition exhibiting a low thermal expansion coefficient, as well as higher heat resistance, flame resistance and insulation reliability than ever before when used in a...
US20110157855 INTEGRATED CIRCUITS HAVING LEAD CONTACTS AND LEADLESS CONTACT PADS CONNECTED TO A SURFACE OF A PRINTED WIRING BOARD, AND METHODS FOR CONNECTING THE SAME  
A method is provided for connecting an integrated circuit to a surface of a printed wiring board. The integrated circuit includes lead contacts and leadless contact pads. A first solder paste is...
US20110051388 PRINTED CIRCUIT BOARD WITH A FUSE AND METHOD FOR THE MANUFACTURE OF A FUSE  
Some invention embodiments relate to a method for forming a fuse which electrically connects two metal surfaces (2) that are arranged on a printed circuit board (5) next to each other and spaced...
US20130286621 Pb-FREE SOLDER-CONNECTED STRUCTURE  
Provided are a bonded structure by a lead-free solder and an electronic article comprising the bonded structure. The bonded structure has a stable bonding interface with respect to a change in...
US20140022751 ELECTRIC CIRCUIT APPARATUS AND MANUFACTURING METHOD THEREFOR  
An electric circuit apparatus includes: a first-circuit board that includes a first-through-hole, and a first-electrode disposed on a front side of the first-circuit-board; a second-circuit-board...
US20110211322 ELECTRONIC DEVICE  
An electronic device includes a printed circuit board, conductive portions coated with a solder paste, a chip module installed on the printed circuit board, contact portions formed at the bottom...
US20130114227 Efficient electronics module  
An efficient electronics package comprising an integrated circuit, a transistor case packaging, a power supply, an actuation segment and a sensor segment, wherein engagement of the integrated...
US20090196002 PRINTED WIRING BOARD UNIT  
A printed wiring board unit includes an electronic circuit component, a printed wiring board, a plurality of first conductive terminals disposed between the electronic circuit component and the...
US20120314384 LOW-STRESS TSV DESIGN USING CONDUCTIVE PARTICLES  
A component can include a substrate having a first surface and a second surface remote therefrom, an opening extending in a direction between the first and second surfaces, and a conductive via...
US20110149539 BASE PLATE FOR USE IN A MULTI-CHIP MODULE  
A base mechanism for use in a multi-chip module (MCM) is described. This base mechanism includes a substrate having top and bottom surfaces. The bottom surface includes first electrical connectors...
US20100014264 PRINTED CIRCUIT BOARD FOR ACCOMPLISHING NARROW SCRIBE LANE AND SEMICONDUCTOR PACKAGE INCLUDING THE PRINTED CIRCUIT BOARD  
A PCB (printed circuit board) for manufacturing a semiconductor package. The PCB includes a plurality of semiconductor package unit frames; a scribe lane dividing the plurality of semiconductor...
US20140233201 CARRIER BOARD FOR ATTACHMENT OF INTEGRATED CIRCUIT TO CIRCUIT BOARD  
An electronics system includes a main circuit board; main circuitry located on the main circuit board; a carrier board located on top of the main circuit board; an integrated circuit (IC) located...
US20050168957 Transmission/reception optical module  
A transmission/reception optical module has an optical transmission subassembly 182, an optical reception subassembly 183, and a circuit board 1 wherein the circuit board 1 is formed into one...
US20150173178 THERMOCHROMIC SOLDER MASK FOR ELECTRONIC DEVICES  
An electronic device is disclosed herein. In accordance with certain implementations, the electronic device includes a printed circuit board having electrically conductive traces formed thereon....
US20130265735 METAL NANOPARTICLE PASTE, ELECTRONIC COMPONENT ASSEMBLY USING METAL NANOPARTICLE PASTE, LED MODULE, AND METHOD FOR FORMING CIRCUIT FOR PRINTED WIRING BOARD  
Disclosed is a metal nanoparticle paste that uses the low-temperature sintering characteristics of metal nanoparticles to easily obtain a metal bond with excellent conductivity and mechanical...
US20110051386 Circuit Board, Mounting Structure, and Method for Manufacturing Circuit Board  
A circuit board (2) includes an insulation layer (7) where a via conductor (10) is embedded. The via conductor (10) includes: a first conductor portion (10a) having an lower portion narrower than...
US20150235991 BOTTOM PACKAGE WITH METAL POST INTERCONNECTIONS  
A bottom package substrate is provided that includes a plurality of metal posts that electrically couple through a die-side redistribution layer to a plurality of die interconnects. The metal...