Matches 1 - 50 out of 253 1 2 3 4 5 6 >


Match Document Document Title
US20150138744 PRINTED CIRCUIT BOARD  
A printed circuit board includes a baseboard, first and second conductive wires, a fuse, a 5V connector, a USB connector, and a CPU. The 5V connector is electrically connected to a first end of...
US20120026707 PRINTED CIRCUIT BOARD  
A printed circuit board includes first and second layers, a control chip, bonding pads, and several electronic elements. The bonding pads can be selectively applied to interconnect the first and...
US20130135835 PRINTED CIRCUIT BOARD CAPABLE OF DECREASING ELECTROMAGNETIC INTERFERENCE  
A printed circuit board includes an antenna, an EMI source, and inductor. The EMI source is connected to the printed circuit board by a pin. The inductor is connected between the pin and a ground...
US20110090660 PRINTED CIRCUIT BOARD  
A printed circuit board includes a board body, a number of filtering capacitors, and a chip. The board body includes a chip mount area. The chip mount area includes a first area and a second area....
US20110304997 PRINTED WIRING BOARD, ELECTRONIC DEVICE, AND PRINTED WIRING BOARD MANUFACTURING METHOD  
A printed wiring board includes an insulating resinous substrate having an aperture unit, a first terminal unit and a second terminal unit consisting of a conductor and formed on top of the...
US20110279991 SOLDERABILITY ENHANCEMENT BY SILVER IMMERSION PRINTED CIRCUIT BOARD MANUFACTURE  
A process used during manufacture of printed circuit boards comprises protecting metal pads and/or through-holes to provide a tarnish-resistant and solderable coating. In the method, the pads...
US20130141834 CAPACITANCE TRIMMING WITH AN INTEGRATED HEATER  
The present disclosure is directed to a device and a method for achieving a precise capacitance of a capacitor. The method includes trimming a first capacitance of the capacitor to a second...
US20120092350 WRAPAROUND ASSEMBLY FOR COMBINATION TOUCH, HANDWRITING AND FINGERPRINT SENSOR  
This disclosure provides systems, methods and apparatus for a combined sensor device. In some implementations, a combined sensor device includes a wrap-around configuration wherein an upper...
US20140268614 COUPLED VIAS FOR CHANNEL CROSS-TALK REDUCTION  
Capacitively coupled vertical transitions may be configured with a desired amount of mutual capacitance to at least partially cancel crosstalk for an overall channel crosstalk (e.g., FEXT)...
US20140323968 MATERIALS, ELECTRONIC SYSTEMS AND MODES FOR ACTIVE AND PASSIVE TRANSIENCE  
The invention provides transient devices, including active and passive devices that electrically and/or physically transform upon application of at least one internal and/or external stimulus....
US20120147579 PRINTED CIRCUIT BOARD  
A printed circuit board includes a high-speed differential signal control chip, first to eighth coupling capacitor pads, first to fourth connector pads, a first transmission line, a second...
US20150062853 TOUCH SCREEN HAVING INTEGRATED NFC ANTENNA  
A touch screen (100) having integrated an NFC antenna (103). The NFC antenna (103) is arranged on the touch screen (100) and is connected to a mainboard having a control chip. The NFC antenna...
US20130154411 ELECTROMAGNETIC COMPATIBILITY PRINTED CIRCUIT BOARD  
An electromagnetic compatibility (EMC) shielding printed circuit board (PCB) has at least a routing layer and a ground layer. The shielding PCB has an opening that receives a motor bushing and at...
US20140268617 SUPERCAPACITOR STRUCTURES  
Supercapacitor structures are provided which include, for example: one or more layers of supercapacitors; and one or more contact tabs. The one or more contact tabs electrically contact and extend...
US20140218841 LOW ACOUSTIC NOISE CAPACITORS  
The described embodiments relate generally to a capacitor assembly for mounting on a printed circuit board (PCB) and more specifically to designs for mechanically isolating the capacitor assembly...
US20140063754 PRINTED-CIRCUIT BOARD ARRANGEMENT FOR MILLIMETER-WAVE SCANNERS  
A printed-circuit board arrangement electrically connects the at least one transmitter and/or receiver unit with at least one antenna element, whereas the at least one transmitter and/or receiver...
US20110211321 MULTILAYER CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME  
A multilayer circuit board (1) includes resin bases (101 to 10N) stacked while placing separators (121 to 12N−1) in between, interconnect patterns (111 to 11N) respectively formed on one surface...
US20130258627 INTERPOSER-BASED DAMPING RESISTOR  
Various resistor circuits and methods of making and using the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a resistor onboard an interposer. The...
US20150163927 CIRCUIT BOARD AND METHOD FOR PRODUCING SAME  
A circuit board includes a main portion and at least one uneven portion. The main portion is obtained by stacking a plurality of base sheets made of a flexible material in a predetermined...
US20120170237 SUBSTRATE ASSEMBLY PROVIDED WITH CAPACITIVE INTERCONNECTIONS, AND MANUFACTURING METHOD THEREOF  
An assembly including: a first substrate having a first surface and housing a first electrical-interconnection element and a second electrical-interconnection element in a position corresponding...
US20090251851 TELECOM POWER DISTRIBUTION UNIT WITH INTEGRATED FILTERING AND TELECOM SHELF COOLING MECHANISMS  
The present invention provides highly efficient system level EMI filtering in a dual feed Power Distribution Unit (PDU) using custom designed magnetic components that are uniquely designed to...
US20100321910 PRINTED CIRCUIT BOARD  
A printed circuit board includes a first signal layer, a first reference layer, a second reference layer, and a second signal layer. An integrated circuit mounted on the first signal layer...
US20120155043 PRINTED CIRCUIT BOARD  
A printed wiring board is formed by laminating a power supply layer, a ground layer, a first signal wiring layer, and a second signal wiring layer with insulating layers respectively interposed...
US20120262895 LOW-COST TRANSFORMER ASSEMBLY  
A transformer assembly is disclosed. An example circuit board assembly includes a circuit board. A drum core inductor is also included and has a drum core, a first winding, and first and second...
US20050207132 Printed circuit board with electromagnetic interference (EMI) radiation suppressed  
A printed circuit board with EMI radiation suppression is disclosed. An integrated circuit and an RC filter are disposed and wired in the printed circuit board including a top layer and a bottom...
US20130201645 MULTI-FUNCTION INDUCTOR AND MANUFACTURE THEREOF  
An inductor assembly comprising a first magnetic core and an electrically conductive material configured to wind around at least a portion of the first magnetic core. The electrical conductive...
US20150116972 DC-DC Converter Assembly with an Output Inductor Accommodating a Power Stage Attached to a Circuit Board  
A DC-DC converter assembly includes a board having a first side and a second side opposite the first side, a power stage die of a DC-DC converter attached to the first side of the board, and an...
US20050139385 Input transient protection for electronic devices  
A circuit board assembly which includes an electrically insulating layer, a conductive printed wiring layer formed on the surface of the electrically insulating layer and includes a plurality of...
US20140233189 CIRCUIT BOARD ASSEMBLY USING METAL PLATES AS CONDUCTING MEDIUM EMBEDDED THEREIN  
A circuit board assembly includes metal plates to be used as conducting medium, an encapsulation enclosing therein the metal plates and provided with holes defined in the encapsulation to allow...
US20120020041 DEVICE AND MANUFACTURING METHOD OF THE SAME  
A device includes a wiring board, an element mounted on the wiring board, a spacer member intervening between the wiring board and the element to form a space therebetween, and an encapsulation...
US20110222255 ELECTRONIC CIRCUIT  
An electronic circuit is obtained that has reduced EMI levels. The circuit includes an integrated circuit, which is a source of noise, a bypass capacitor, and a circuit substrate on which they are...
US20110149539 BASE PLATE FOR USE IN A MULTI-CHIP MODULE  
A base mechanism for use in a multi-chip module (MCM) is described. This base mechanism includes a substrate having top and bottom surfaces. The bottom surface includes first electrical connectors...
US20080205015 LEAD FRAME MOUNT FOR CIRCUIT COMPONENT  
An integrated circuit includes a positive lead defining a first pocket and a negative lead spaced apart from the positive lead that defines a second pocket that is aligned with the first pocket....
US20060146508 Low-inductance circuit arrangement  
The invention relates to a circuit arrangement comprising at lest two electrical components (1, 2) and an energy accumulator (Cd) which are arranged on electroconductive plates (3, 5 and 6) in...
US20120147580 PRINTED CIRCUIT BOARD  
A power source terminal and a ground terminal for a semiconductor integrated circuit are connected to a conductor pattern through a capacitor. The conductor pattern is connected, through a filter,...
US20150235952 INTEGRATED VOLTAGE REGULATOR WITH EMBEDDED PASSIVE DEVICE(S) FOR A STACKED IC  
A stacked integrated circuit includes a first tier IC and a second tier IC. Active faces of the first tier IC and the second tier IC face each other. An interconnect structure, such as microbumps,...
US20110317387 Integrated Voltage Regulator with Embedded Passive Device(s) for a Stacked IC  
A stacked integrated circuit includes a first tier IC and a second tier IC. Active faces of the first tier IC and the second tier IC face each other. An interconnect structure, such as microbumps,...
US20150070864 Electronic Device With Printed Circuit Board Noise Reduction Using Elastomeric Damming and Damping Structures  
An electronic device may be provided with integrated circuits and electrical components such as capacitors that are soldered to printed circuit boards. Liquid polymer adhesive such as encapsulant...
US20140085851 SMALL FORM FACTOR STACKED ELECTRICAL PASSIVE DEVICES THAT REDUCE THE DISTANCE TO THE GROUND PLANE  
The described embodiments relate generally to electronic components and more specifically to a capacitor array that can increase component density on a printed circuit board and reduce a distance...
US20110096521 ELECTRONIC PASSIVE DEVICE  
A capacitive interposer, electronic package having the capacitive interposer and electronic device with the electronic package is described. The interposer has a first planar face and a second...
US20120147578 Radio-Frequency Packaging with Reduced RF Loss  
A device includes an interposer and a radio-frequency (RF) device bonded to a first side of the interposer. The interposer includes a first side and a second side opposite to the first side. The...
US20140321090 DEVICE FOR ASSEMBLING CAPACITORS FOR AN ELECTRONIC CONVERTER  
The device (100) for assembling capacitors (200) is intended for an electronic converter with a plurality of arms provided with transistors. The device comprises a bus bar (11) with positive...
US20140092574 INTEGRATED VOLTAGE REGULATORS WITH MAGNETICALLY ENHANCED INDUCTORS  
Magnetically enhanced inductors integrated with microelectronic devices at chip-level. In embodiments, magnetically enhanced inductors include a through substrate vias (TSVs) with fill metal to...
US20120081870 ELECTRONIC PASSIVE DEVICE  
A capacitive interposer, electronic package having the capacitive interposer and electronic device with the electronic package is described. The interposer has a first planar face and a second...
US20110199745 MOUNTABLE ELECTRONIC CIRCUIT MODULE  
A mountable electronic circuit module which produces appropriate characteristics without a complicated structure can be a DC-DC converter including a baseboard made of a magnetic material. A...
US20100039784 PRINTED CIRCUIT BOARD  
A power source terminal and a ground terminal for a semiconductor integrated circuit are connected to a conductor pattern through a capacitor. The conductor pattern is connected, through a filter,...
US20150109750 HEAT DISSIPATING HIGH POWER SYSTEMS  
An electronic system includes a printed circuit board (PCB), and a heat dissipating element. The PCB includes one or more first electronic components mounted on a first side of the PCB, and one or...
US20080253059 LAND GRID FEEDTHROUGH LOW ESL TECHNOLOGY  
Disclosed are apparatus and methodology for providing land grid feedthrough capacitor designs having broad applicability to signal and power filtering technologies. Such capacitor designs provide...
US20100124035 Integrating Capacitors Into Vias Of Printed Circuit Boards  
A printed circuit board (‘PCB’) with a capacitor integrated within a via of the PCB, the PCB including layers of laminate; a via that includes a via hole traversing layers of the PCB, the via hole...
US20110310579 Inductive Structure and Method of Forming the Inductive Structure with an Attached Core Structure  
An inductor is formed on a wafer by attaching a first core structure to the wafer with a pick and place operation, forming a coil with one or more thick metal layers over the first core structure,...

Matches 1 - 50 out of 253 1 2 3 4 5 6 >