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US20110228486 Power supply with low touch-temperature surface  
A power supply provides a low touch-temperature surface by utilizing a plurality of spaced apart pegs which extend from a surface of a case away from heat generating components enclosed within the...
US20100302731 Inverter Cooler  
A DC to AC inverter used in a solar cell power system can include an improved structure for cooling itself and increasing power output.
US20130083491 Electronic Devices With Cover Layers Mounted to Displays  
An electronic device may be provided with a display cover layer mounted to the device using an adhesive bond with a display. The display may be a flexible display. The flexible display may include...
US20140167076 LED MODULE WITH SEPARATE HEAT-DISSIPATION AND ELECTRICAL CONDUCTION PATHS, AND RELATED HEAT DISSIPATION BOARD  
A LED module with separate heat-dissipation and electrical conduction paths is disclosed, having a metal substrate; a plastic layer, comprising one or more hollow regions, and attached to the...
US20120140421 ASSEMBLIES INCLUDING HEAT SINK ELEMENTS AND METHODS OF ASSEMBLING  
A heat sink assembly comprises a plurality of components and a plurality of mounting tabs. A component attachment surface of each mounting tab is attached to a component and heat sink attachment...
US20150092354 Pluggable Module Housing Assembly  
A pluggable module housing assembly comprises a base at least partially surrounding a socket having an entrance sized and dimensioned to receive a pluggable module. At least one guide extends...
US20090284933 COMBINATION TYPE HEAT DISSIPATION MODULE  
A combination type heat dissipation module applied to dissipate at least one heat source is disclosed. The combination type heat dissipation module comprises a heat dissipation base and a...
US20120050999 Mechanical arrangement for use within galvanically-isolated, low-profile micro-inverters for solar power installations  
A mechanical arrangement for use in implementing a galvanically-isolated, low-profile micro-inverter primarily, though not exclusively, intended for use with solar panels. The micro-inverter...
US20140098499 ELECTRONIC DEVICE, STRUCTURE, AND HEAT SINK  
An electronic device includes a substrate (101), a conductor plane (104) which is provided on an inner layer of the substrate (101), an electronic circuit (102) which is mounted on the substrate...
US20120262884 POWER CONVERTER ARRANGEMENT AND METHOD FOR OPERATING A POWER CONVERTER ARRANGEMENT  
A power converter arrangement has two static switching element bridges that are alternatively operable and comprise static switching elements. The power converter arrangement has one housing that...
US20100302739 THERMAL INTERFACE MATERIAL AND METHOD OF USING THE SAME AND ELECTRONIC ASSEMBLY HAVING THE SAME  
An electronic assembly includes a heat source having a maximum operating temperature, a heat dissipating device, a thermal interface material sandwiched between the heat source and the heat...
US20130279119 ELECTRONIC ASSEMBLIES AND METHODS OF FABRICATING ELECTRONIC ASSEMBLIES  
Electronic assemblies and methods of fabricating electronic assemblies are provided herein. The electronic assembly includes a heat sink, a metal layer, and an electrical insulator layer. The...
US20110141701 ELECTRONIC CIRCUIT DEVICE  
An electronic circuit device includes a bus bar, a base component and an electronic component. The bus bar has an external connector terminal capable of receiving electric power from an external...
US20140226284 HEAT DISSIPATION STRUCTURE, POWER MODULE, METHOD OF MANUFACTURING HEAT DISSIPATION STRUCTURE, AND METHOD OF MANUFACTURING POWER MODULE  
A heat dissipation structure includes a ceramic substrate having an insulation quality, a metal member containing a metal or an alloy and joined to a surface of the ceramic substrate by a brazing...
US20090067108 CLOSING RESISTOR FOR HIGH-VOLTAGE CIRCUIT BREAKERS  
A closing resistor arrangement for a high-voltage circuit breaker has a large number of resistor elements and a large number of cooling elements, the cooling elements being arranged in series with...
US20140169033 DISPLAY APPARATUS  
In a display apparatus, a display panel displays an image, and a driver is electrically connected to the display panel and applies a control signal to the display panel to control an operation of...
US20140321065 DC-DC CONVERTER  
A DC-DC converter is provided with a transformer provided with a primary coil and a secondary coil; switching elements connected to the primary coil for switching the flow of electrical current to...
US20090168368 DISCRETE ELECTRONIC COMPONENT AND RELATED ASSEMBLING METHOD  
The present invention relates to a substantially package-like discrete electronic component of the type comprising a power electronic circuit, a body or casing, substantially parallelepiped, and...
US20140085832 ELECTRONIC DEVICE WITH EFFICIENT HEAT RADIATION STRUCTURE FOR ELECTRONIC COMPONENTS  
An electronic device includes a metallic body, a circuit substrate having electronic components and wiring conductors, a heat conduction member that absorbs a heat generated by the electronic...
US20100328887 Heat Sink for a Circuit Device  
Various heat sinks, method of use and manufacture thereof are disclosed. In one aspect, a method of providing thermal management for a circuit device is provided. The method includes placing a...
US20140092563 HEAT RADIATING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME  
Disclosed herein is a heat radiating substrate including: a heat radiating plate including a plurality of holes having a predetermined depth and formed in a lower portion of one side thereof; a...
US20120033386 HEAT DISSIPATING DEVICE WITH DELAY FUNCTION AND ELECTRONIC APPARATUS USING SAME  
A heat dissipating device is used in an electronic apparatus. The electronic apparatus includes a standby unit and a power supply. The heat dissipating device includes a delay unit connected to...
US20090135567 METAL THERMAL INTERFACE MATERIAL AND THERMAL MODULE AND PACKAGED MICROELECTRONIC COMPONENT CONTAINING THE MATERIAL  
The invention provides a metal thermal interface material (TIM) with through-holes in its body and/or zigzags or wave shapes on its border, which is suitable for use at thermal interfaces of a...
US20100302736 HEAT RADIATION STRUCTURE OF ELECTRIC APPARATUS  
A heat radiation structure of an electric apparatus provided herein is capable of readily releasing heat of electronic components to the outside and suppressing heat conduction to a rotational...
US20120002375 METHOD AND STRUCTURE FOR DISSIPATING HEAT AWAY FROM A RESISTOR HAVING NEIGHBORING DEVICES AND INTERCONNECTS  
A semiconductor structure for dissipating heat away from a resistor having neighboring devices and interconnects. The semiconductor structure includes a semiconductor substrate, a resistor...
US20110199736 POWER CONVERTER  
An inverter device has a control unit, a power unit, and a capacitor unit. The power unit has six semiconductor devices. Each semiconductor device has a semiconductor module and a pair of heat...
US20110170266 4D DEVICE PROCESS AND STRUCTURE  
a 4D device comprises a 2D multi-core logic and a 3D memory stack connected through the memory stack sidewall using a fine pitch T&J connection. The 3D memory in the stack is thinned from the...
US20070070604 Cooling device and electronic apparatus having cooling device  
According to one embodiment, a cooling device includes: a first heat receiving portion that is configured to be thermally connected to a first heating element; a second heat receiving portion that...
US20170181296 DISPLAY DEVICE, ELECTRONIC DEVICE, AND SUBSTRATE ADJUSTING METHOD  
There is provided a display device including a jig that is provided with an insertion port into which a tip portion of an eccentric driver having the tip portion on an axis different from a...
US20160295745 ELECTRONIC CONTROL UNIT  
An electronic control unit includes a plurality of heating elements, a substrate, a heat sink, and a housing. The substrate includes a heating region on which the plurality of heating elements are...
US20160165716 POWER CONVERSION APPARATUS  
An AC/DC converter of a power conversion apparatus includes filters, a PFC circuit, a first full bridge circuit, a first transformer, and a first rectifier circuit and converts an AC voltage...
US20130294033 THERMALLY ENHANCED ELECTRONIC PACKAGE  
A thermally enhanced electronic package comprises a driver chip, an insulator, a flexible carrier, and carbon nanocapsules. The flexible carrier includes a flexible substrate, a wiring layer...
Matches 1 - 32 out of 32