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US20130094141 HEAT REMOVAL IN COMPACT COMPUTING SYSTEMS  
A low profile heat removal system suitable for removing excess heat generated by a component operating in a compact computing environment is disclosed.
US20130182392 ELECTRONIC DEVICE WITH HEAT DISSIPATING AND ELECTROMAGNETIC SHIELDING MASK  
An electronic device, including a circuit board, a communication chip, a first heat sink, a fixer and a shielding mask, is provided. The circuit board has a frame having an opening and several rims...
US20130016477 Electronic Assembly Including Die on Substrate With Heat Spreader Having an Open Window on the Die  
An electronic assembly includes a workpiece, a through substrate via (TSV) die including a substrate and a plurality of TSVs, a topside and a bottomside having TSV connectors thereon. The TSV die...
US20120162922 COOLING OF COPLANAR ACTIVE CIRCUITS  
In one aspect, a system includes a first circuit board that includes integrated circuits, a first thermal spreader coupled to the integrated circuits of the first circuit board, a first compliant...
US20130088836 HEAT DISSIPATION STRUCTURE FOR ELECTRONIC DEVICE  
A heat dissipation structure in which an IC chip that generates heat is mounted on a substrate and a heat dissipation sheet is interposed between a cover member and the IC chip to dissipate heat,...
US20120020028 STACKED INTERCONNECT HEAT SINK  
An electronic device includes an integrated circuit and a heat spreader. The integrated circuit includes a substrate with an active via located therein. The heat spreader includes a thermally...
US20130335923 PCB for LCD Device and LCD Device  
The invention relates to the field of LCDs, and more particularly to a PCB for an LCD device and an LCD device. The PCB includes a front face and a back face; the front face of the PCB is a face...
US20130077256 HEAT DISSIPATION STRUCTURE FOR ELECTRONIC DEVICE  
Disclosed is a heat dissipation structure of dissipating heat through a heat dissipation sheet disposed between a cover member and an IC chip, which is a heat-generating element, mounted on a...
US20140002999 ELECTRONIC ASSEMBLY WITH FLEXIBLE FIXTURES FOR SPREADING LOAD  
An exemplary electronic assembly includes a heat spreader, a socket, and an electronic component received in the socket. The electronic component includes a substrate and a chip disposed at a...
US20120201007 SYSTEMS AND METHODS PROVIDING THERMAL SPREADING FOR AN LED MODULE  
A Light Emitting Diode (LED) module includes a circuit board having a front side and a back side, a heat sink coupled to the back side of the circuit board, a thermal pad disposed on a front side...
US20120106089 WIRELESS NETWORK RECEIVER  
A wireless network receiver includes a heat-dissipating unit, a wireless network receiving module, an electrical connecting unit, and a shell unit. The heat-dissipating unit has at least one main...
US20140063744 Vertically Stacked Power FETS and Synchronous Buck Converter Having Low On-Resistance  
A power FET (100) comprising a leadframe including a pad (110), a first lead (111), and a second lead (112); a first metal clip (150) including a plate (150a), an extension (150b) and a ridge...
US20090154111 RETICULATED HEAT DISSIPATION  
Embodiments described herein may include example embodiments of methods, apparatuses, devices, and/or systems for heat dissipation.
US20130242507 HEAT-DISSIPATING ASSEMBLIES AND METHODS OF ASSEMBLING HEAT-DISSIPATING ASSEMBLIES  
Heat-dissipating assemblies may comprise mounting tabs attached to heat-generating electrical components at a first surface of each mounting tab. An opposing second surface of each mounting tab may...
US20120224328 INNER-LAYER HEAT-DISSIPATING BOARD, MULTI-CHIP STACK PACKAGE STRUCTURE HAVING THE INNER LAYER HEAT-DISSIPATING BOARD AND FABRICATION METHOD THEREOF  
An inner-layer heat-dissipating board and a multi-chip stack package structure having the inner-layer heat-dissipating board are disclosed. The inner-layer heat-dissipating board includes a metal...
US20100226097 DOUBLE BONDED HEAT DISSIPATION  
Embodiments described herein may include example embodiments of methods, apparatuses, devices, and/or systems for heat dissipation.
US20120236506 PASSIVE, LOW-PROFILE HEAT TRANSFERRING SYSTEM  
A media content receiving device, such as a set top box, includes a thermally conductive chassis having at least one panel with opposing surfaces. One of the opposing surfaces is exposed to an...
US20100290194 MOUNTING ASSEMBLY FOR HEAT SINK  
A mounting assembly includes a circuit board, a chip socket mounted on a topside of the circuit board with a chip attached thereon, a heat sink positioned on a top surface of the chip, and a...
US20100232114 Solid state relay with internal heat sink  
A solid state relay having an internal heat sink for dissipating heat produced by a solid state switching device. The relay being enclosed within a nonmetallic housing and mountable on a DIN type...
US20080101031 WEDGE LOCK  
Various apparatus and methods are disclosed wherein a wedge member and a support engage one another to lock a first structure and a second structure to one another along an axis.
US20090122493 OPTOELECTRONIC SUBASSEMBLY WITH INTEGRAL THERMOELECTRIC COOLER DRIVER  
Optical subassemblies including optical transmit and receive subassemblies. The optical subassemblies comprise a housing; a substrate mounted within the housing; a thermoelectric cooler (TEC)...
US20110320065 NETWORK NODE WITH INTEGRATED POWER DISTRIBUTION  
A control network comprises a plurality of network nodes arranged in a plurality of tiers, with first-tier nodes and lower tier nodes. A master control bus interconnects the first-tier nodes, which...
US20130286595 THERMAL MANAGEMENT FLOORPLAN FOR A MULTI-TIER STACKED IC PACKAGE  
A first tier die is provided having a thermal management floorplan with a heat region having an area for thermal coupling to a heat sink, a second tier die is provided, shaped and dimensioned to be...
US20070109749 WAFER SCALE HEAT SLUG SYSTEM  
A wafer scale heat slug system is presented providing dicing an integrated circuit from a semiconductor wafer, forming a heat slug blank equivalent in size to the semiconductor wafer, dicing the...
US20050117305 Integrated heat sink assembly  
Some disclosed embodiments include an integrated heat sink assembly having a standoff press disposed through the bottom of a bore in a support base of the heat sink, a screw disposed through the...
US20130343003 HEAT DISSIPATION DEVICE WITH FASTENER AND FLANGE  
A heat dissipation device includes a base and a fastener. The fastener includes a neck portion, a head portion formed at one end of the neck portion, and an engaging portion formed at another...
US20130016479 SELF ORIENTING MICRO PLATES OF THERMALLY CONDUCTING MATERIAL AS COMPONENT IN THERMAL PASTE OR ADHESIVE  
The present invention relates generally to thermally-conductive pastes for use with integrated circuits, and particularly, but not by way of limitation, to self-orienting microplates of graphite.
US20060139890 Fastening device II  
A fastening device II has a body and four fixed handles. The body is integrated with a frame, extending arms, elastic hooking arms, and linking-up arms. The fixed handles respectively have an...
US20100157543 TELEPHONY AND DIGITAL MEDIA SERVICES DEVICE  
An electronic device includes a housing, a printed circuit board, a first heat sink and a second heat sink. The printed circuit board is disposed internal to the housing and supports at least one...
US20100165579 CIRCUIT BOARD ASSEMBLY  
A circuit board assembly includes a circuit board with two heat dissipating assemblies mounted thereon and an L-shaped back plate attached to an underside of the circuit board. Each of the heat...
US20090103269 HEAT DISSIPATING DEVICE FOR MEMORY CARD  
A heat dissipating device for a memory card includes a first dissipation element and a second dissipation element. The first dissipation element is attached to one side of the memory card for...
US20130100614 ELECTRONIC DEVICE USING FASTENER FOR FIXING  
An electronic device includes a circuit board, a communication chip, a ceramic heat sink and an elastic fastener. The circuit board has first and second fixing members. The communication chip is...
US20130128463 HEAT SINK ASSEMBLY  
A heat sink assembly is for attachment to a chip of a printed circuit board. The heat sink assembly includes a heat sink, a frame and a plurality of fasteners. The heat sink is attached on the...
US20120162923 THERMAL LOADING MECHANISM  
Electronic assemblies and methods are described. One embodiment includes a circuit board and a socket coupled to the circuit board. The assembly also includes a package positioned in the socket,...
US20140078677 Heat Sinking and Electromagnetic Shielding Structures  
An electronic device may be provided with electronic components such as radio-frequency transceiver integrated circuits and other integrated circuits that are be sensitive to electromagnetic...
US20070121300 BACK PLATE ASSEMBLY FOR MOUNTING A HEAT SINK ASSEMBLY TO A MOTHERBOARD  
A back plate assembly for a motherboard includes a back plate, four posts and four plastic rings. The back plate abuts against an underside of the motherboard. The posts extend from the back plate...
US20130083489 ELECTRONIC SYSTEM FOR REFLOW SOLDERING  
An electronic system includes an insulating structural element with a coupling surface configured for coupling the electronic system with at least one further electronic system. The electronic...
US20060227514 Digital micro-mirror device (DMD) assembly for an optical projection system  
A digital micro-mirror assembly for an optical projection system includes a DMD module with a control board. The control board is provided with a first fixing member, and a DMD is mounted on one...
US20050057903 Cooling structure for electronic element  
A cooling structure for an electronic element is disclosed in which smooth heat transfer can be carried out via a variety of heat transfer routes of conduction and convention without recourse to a...
US20070097620 Heat sink verification  
In one embodiment, a printed circuit board assembly comprises a printed circuit board including a processor, a heat sink mountable to the printed circuit board proximate the processor, and a memory...
US20080192440 Connection assembly  
A connection assembly for an electronic device includes a hollow sheath and a fastener. In this case, the hollow sheath has a head portion, an axle portion, and a fastening portion. The axle...
US20110292612 ELECTRONIC DEVICE HAVING ELECTRICALLY GROUNDED HEAT SINK AND METHOD OF MANUFACTURING THE SAME  
An electronic device includes an integrated circuit (IC) package attached to a substrate and a heat sink attached to the IC package. Additionally, the electronic device also includes a film having...
US20060039120 Expansion board for desktop personal computer  
An expansion board connected to an expansion slot of a main board of a desktop PC is provided. The expansion board has a plurality of components, including ICs, formed on its lower surface. The...
US20070070607 Applied heat spreader with cooling fin  
A heat spreader is devised with one or more extensions to increase effective surface area exposed to air. Whether air flow is forced or ambient, and where preferred high thermal conductivity...
US20060187647 Test kit semiconductor package and method of testing semiconductor package using the same  
A test kit for a semiconductor package and a method of testing a semiconductor package using the same are provided. The test kit may include a pick-and-place tool for loading/unloading a...
US20050018403 BGA ball vision enhancement  
According to one aspect of the invention, a method and apparatus for handling semiconductor packages is provided. The semiconductor packages include package substrates with a plurality contact...
US20050180122 Electronic circuit module  
An electronic circuit module mounting a plurality of electronic circuit units in which an area thereof can be reduced without increase in the number of module substrate layers while the performance...
US20100053894 SYSTEM AND METHOD FOR COOLING USING IMPINGING JET CONTROL  
A system (50) for cooling a target element (56) includes a structure (52) having an opening (62) extending through the layer (52), a pumping device (32) positioned behind the structure (52), and a...
US20070091578 Circuit board having heat dissipation through holes  
A circuit board having heat dissipation through holes, wherein a plurality of through holes are provided in the perimeter of the chip on the circuit board, and heat conduction elements are utilized...
US20080186680 Monolithic Controller for the Generator Unit of a Motor Vehicle  
A monolithic controller for the generator unit of a motor vehicle, which is fixedly connected to a cooling body. The cooling body preferably is a thermally conductive ceramic substrate, which is...
Matches 1 - 50 out of 152 1 2 3 4 >