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US20130094141 |
HEAT REMOVAL IN COMPACT COMPUTING SYSTEMS
A low profile heat removal system suitable for removing excess heat generated by a component operating in a compact computing environment is disclosed.
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US20130016477 |
Electronic Assembly Including Die on Substrate With Heat Spreader Having an Open Window on the Die
An electronic assembly includes a workpiece, a through substrate via (TSV) die including a substrate and a plurality of TSVs, a topside and a bottomside having TSV connectors thereon. The TSV die...
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US20120162922 |
COOLING OF COPLANAR ACTIVE CIRCUITS
In one aspect, a system includes a first circuit board that includes integrated circuits, a first thermal spreader coupled to the integrated circuits of the first circuit board, a first compliant...
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US20130088836 |
HEAT DISSIPATION STRUCTURE FOR ELECTRONIC DEVICE
A heat dissipation structure in which an IC chip that generates heat is mounted on a substrate and a heat dissipation sheet is interposed between a cover member and the IC chip to dissipate heat,...
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US20120020028 |
STACKED INTERCONNECT HEAT SINK
An electronic device includes an integrated circuit and a heat spreader. The integrated circuit includes a substrate with an active via located therein. The heat spreader includes a thermally...
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US20130077256 |
HEAT DISSIPATION STRUCTURE FOR ELECTRONIC DEVICE
Disclosed is a heat dissipation structure of dissipating heat through a heat dissipation sheet disposed between a cover member and an IC chip, which is a heat-generating element, mounted on a...
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US20120201007 |
SYSTEMS AND METHODS PROVIDING THERMAL SPREADING FOR AN LED MODULE
A Light Emitting Diode (LED) module includes a circuit board having a front side and a back side, a heat sink coupled to the back side of the circuit board, a thermal pad disposed on a front side...
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US20120106089 |
WIRELESS NETWORK RECEIVER
A wireless network receiver includes a heat-dissipating unit, a wireless network receiving module, an electrical connecting unit, and a shell unit. The heat-dissipating unit has at least one main...
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US20090154111 |
RETICULATED HEAT DISSIPATION
Embodiments described herein may include example embodiments of methods, apparatuses, devices, and/or systems for heat dissipation.
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US20120224328 |
INNER-LAYER HEAT-DISSIPATING BOARD, MULTI-CHIP STACK PACKAGE STRUCTURE HAVING THE INNER LAYER HEAT-DISSIPATING BOARD AND FABRICATION METHOD THEREOF
An inner-layer heat-dissipating board and a multi-chip stack package structure having the inner-layer heat-dissipating board are disclosed. The inner-layer heat-dissipating board includes a metal...
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US20100226097 |
DOUBLE BONDED HEAT DISSIPATION
Embodiments described herein may include example embodiments of methods, apparatuses, devices, and/or systems for heat dissipation.
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US20120236506 |
PASSIVE, LOW-PROFILE HEAT TRANSFERRING SYSTEM
A media content receiving device, such as a set top box, includes a thermally conductive chassis having at least one panel with opposing surfaces. One of the opposing surfaces is exposed to an...
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US20100290194 |
MOUNTING ASSEMBLY FOR HEAT SINK
A mounting assembly includes a circuit board, a chip socket mounted on a topside of the circuit board with a chip attached thereon, a heat sink positioned on a top surface of the chip, and a...
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US20100232114 |
Solid state relay with internal heat sink
A solid state relay having an internal heat sink for dissipating heat produced by a solid state switching device. The relay being enclosed within a nonmetallic housing and mountable on a DIN type...
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US20080101031 |
WEDGE LOCK
Various apparatus and methods are disclosed wherein a wedge member and a support engage one another to lock a first structure and a second structure to one another along an axis.
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US20090122493 |
OPTOELECTRONIC SUBASSEMBLY WITH INTEGRAL THERMOELECTRIC COOLER DRIVER
Optical subassemblies including optical transmit and receive subassemblies. The optical subassemblies comprise a housing; a substrate mounted within the housing; a thermoelectric cooler (TEC)...
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US20110320065 |
NETWORK NODE WITH INTEGRATED POWER DISTRIBUTION
A control network comprises a plurality of network nodes arranged in a plurality of tiers, with first-tier nodes and lower tier nodes. A master control bus interconnects the first-tier nodes, which...
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US20070109749 |
WAFER SCALE HEAT SLUG SYSTEM
A wafer scale heat slug system is presented providing dicing an integrated circuit from a semiconductor wafer, forming a heat slug blank equivalent in size to the semiconductor wafer, dicing the...
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US20050117305 |
Integrated heat sink assembly
Some disclosed embodiments include an integrated heat sink assembly having a standoff press disposed through the bottom of a bore in a support base of the heat sink, a screw disposed through the...
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US20130016479 |
SELF ORIENTING MICRO PLATES OF THERMALLY CONDUCTING MATERIAL AS COMPONENT IN THERMAL PASTE OR ADHESIVE
The present invention relates generally to thermally-conductive pastes for use with integrated circuits, and particularly, but not by way of limitation, to self-orienting microplates of graphite.
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US20060139890 |
Fastening device II
A fastening device II has a body and four fixed handles. The body is integrated with a frame, extending arms, elastic hooking arms, and linking-up arms. The fixed handles respectively have an...
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US20100157543 |
TELEPHONY AND DIGITAL MEDIA SERVICES DEVICE
An electronic device includes a housing, a printed circuit board, a first heat sink and a second heat sink. The printed circuit board is disposed internal to the housing and supports at least one...
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US20100165579 |
CIRCUIT BOARD ASSEMBLY
A circuit board assembly includes a circuit board with two heat dissipating assemblies mounted thereon and an L-shaped back plate attached to an underside of the circuit board. Each of the heat...
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US20090103269 |
HEAT DISSIPATING DEVICE FOR MEMORY CARD
A heat dissipating device for a memory card includes a first dissipation element and a second dissipation element. The first dissipation element is attached to one side of the memory card for...
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US20130100614 |
ELECTRONIC DEVICE USING FASTENER FOR FIXING
An electronic device includes a circuit board, a communication chip, a ceramic heat sink and an elastic fastener. The circuit board has first and second fixing members. The communication chip is...
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US20130128463 |
HEAT SINK ASSEMBLY
A heat sink assembly is for attachment to a chip of a printed circuit board. The heat sink assembly includes a heat sink, a frame and a plurality of fasteners. The heat sink is attached on the...
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US20120162923 |
THERMAL LOADING MECHANISM
Electronic assemblies and methods are described. One embodiment includes a circuit board and a socket coupled to the circuit board. The assembly also includes a package positioned in the socket,...
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US20070121300 |
BACK PLATE ASSEMBLY FOR MOUNTING A HEAT SINK ASSEMBLY TO A MOTHERBOARD
A back plate assembly for a motherboard includes a back plate, four posts and four plastic rings. The back plate abuts against an underside of the motherboard. The posts extend from the back plate...
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US20130083489 |
ELECTRONIC SYSTEM FOR REFLOW SOLDERING
An electronic system includes an insulating structural element with a coupling surface configured for coupling the electronic system with at least one further electronic system. The electronic...
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US20060227514 |
Digital micro-mirror device (DMD) assembly for an optical projection system
A digital micro-mirror assembly for an optical projection system includes a DMD module with a control board. The control board is provided with a first fixing member, and a DMD is mounted on one...
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US20050057903 |
Cooling structure for electronic element
A cooling structure for an electronic element is disclosed in which smooth heat transfer can be carried out via a variety of heat transfer routes of conduction and convention without recourse to a...
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US20070097620 |
Heat sink verification
In one embodiment, a printed circuit board assembly comprises a printed circuit board including a processor, a heat sink mountable to the printed circuit board proximate the processor, and a memory...
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US20080192440 |
Connection assembly
A connection assembly for an electronic device includes a hollow sheath and a fastener. In this case, the hollow sheath has a head portion, an axle portion, and a fastening portion. The axle...
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US20110292612 |
ELECTRONIC DEVICE HAVING ELECTRICALLY GROUNDED HEAT SINK AND METHOD OF MANUFACTURING THE SAME
An electronic device includes an integrated circuit (IC) package attached to a substrate and a heat sink attached to the IC package. Additionally, the electronic device also includes a film having...
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US20060039120 |
Expansion board for desktop personal computer
An expansion board connected to an expansion slot of a main board of a desktop PC is provided. The expansion board has a plurality of components, including ICs, formed on its lower surface. The...
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US20070070607 |
Applied heat spreader with cooling fin
A heat spreader is devised with one or more extensions to increase effective surface area exposed to air. Whether air flow is forced or ambient, and where preferred high thermal conductivity...
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US20060187647 |
Test kit semiconductor package and method of testing semiconductor package using the same
A test kit for a semiconductor package and a method of testing a semiconductor package using the same are provided. The test kit may include a pick-and-place tool for loading/unloading a...
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US20050018403 |
BGA ball vision enhancement
According to one aspect of the invention, a method and apparatus for handling semiconductor packages is provided. The semiconductor packages include package substrates with a plurality contact...
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US20050180122 |
Electronic circuit module
An electronic circuit module mounting a plurality of electronic circuit units in which an area thereof can be reduced without increase in the number of module substrate layers while the performance...
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US20100053894 |
SYSTEM AND METHOD FOR COOLING USING IMPINGING JET CONTROL
A system (50) for cooling a target element (56) includes a structure (52) having an opening (62) extending through the layer (52), a pumping device (32) positioned behind the structure (52), and a...
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US20070091578 |
Circuit board having heat dissipation through holes
A circuit board having heat dissipation through holes, wherein a plurality of through holes are provided in the perimeter of the chip on the circuit board, and heat conduction elements are utilized...
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US20080186680 |
Monolithic Controller for the Generator Unit of a Motor Vehicle
A monolithic controller for the generator unit of a motor vehicle, which is fixedly connected to a cooling body. The cooling body preferably is a thermally conductive ceramic substrate, which is...
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US20110310567 |
HEAT SINK AND ELECTRONIC DEVICE USING THE SAME
An electronic device includes a chassis, a circuit board installed in the chassis, a memory card coupled to the circuit board, and a heat sink for cooling the memory card. The heat sink includes a...
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US20070230138 |
Heat sink and fan unit
A heat sink and fan unit including a heat sink and a cooling fan is provided. The heat sink has a plurality of heat-dissipating fins. The cooling fan is arranged to create a current of a cooling...
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US20060067057 |
Heat sink module
A heat sink module is used for a central processing unit (CPU). The CPU is located on a top surface of a circuit board. The heat sink module includes a heat conducting structure for conducting and...
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US20080266807 |
ELECTRONIC ASSEMBLY WITH EMI SHIELDING HEAT SINK
An example electronic assembly includes a substrate that has a first surface and a second surface. The first surface of the substrate includes a grounding ring. The electronic assembly further...
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US20080101033 |
Component retention with distributed compression
A retention assembly comprises a hinged load plate configured for rotational closure over a component and compression of a pre-compressed spring that distributes force of the spring across the...
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US20100165578 |
Heat Sink Mount for Providing Non-Rigid Support of Overhanging Portions of Heat Sink
A computer adapted for force-air cooling of a processor. The computer includes a board supporting the processor and a heat sink mounted such with its base plate contacting the processor. A primary...
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US20070195505 |
Memory module device
A memory module device includes a printed circuit board, a plurality of memory modules and a buffer module. Lines are provided in or on the printed circuit board to connect the buffer module to the...
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US20110149521 |
THERMALLY CONDUCTIVE, ELECTRICALLY INSULATING COMPOSITE FILM AND STACK CHIP PACKAGE STRUCTURE UTILIZING THE SAME
Disclosed is a thermally conductive, electrically insulating composite film, including interface layers disposed on the top and bottom surface of a metal substrate, and an insulation layer. Because...
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