Matches 1 - 50 out of 383 1 2 3 4 5 6 7 8 >


Match Document Document Title
US20110267779 LED LIGHTING SYSTEM WITH A THERMAL CONNECTOR  
There is described an LED lighting system comprising: at least one light emitting diode (LED); a heat sink thermally connected to the at least one LED for dissipating heat generated by the at...
US20110299249 HEAT SINK MOUNTING FRAME APPLICABLE TO A VARIETY OF CIRCUIT BOARDS  
An exemplary heat sink mounting frame is for mounting a heat sink onto a circuit board. The heat sink mounting frame includes a circular guide rail, and mounting arms movably connected with and...
US20110157833 RETENTION MODULE FOR TOOLLESS HEAT SINK INSTALLATION  
An integrated circuit is disposed on a circuit board. A heat sink retention module includes a bracket, members, and coil springs. The members extend through the coil springs and corresponding...
US20110002104 BRACKET FOR MOUNTING HEAT SINK  
A bracket is used to mount a heat sink to a printed circuit board (PCB). The heat sink can dissipate heat for an electronic component mounted on the PCB. Cantilevers can be detached from the...
US20110007762 OPTICAL MODULE  
To constitute an optical module in which a comb-shaped submount is fixed on a heat sink and a device having an optical functioning unit is mounted on the comb-shaped submount, a stress buffering...
US20120001809 RADIO FREQUENCY UNIT AND INTEGRATED ANTENNA  
A radio frequency unit and an integrated antenna are provided. The radio frequency unit includes a duplexer, a power amplifier circuit board, and a transceiver circuit board. The duplexer connects...
US20110279968 HEAT SINK HAVING AUTO SWITCHING FUNCTION, HEAT SINK SYSTEM AND HEAT SINKING METHOD FOR THE SAME  
A heat sink having auto switching function, a heat sink system and a heat sinking method are disclosed. The heat sink receives a control command sent by an external device. An internal heat sink...
US20120044649 HEAT DISSIPATION DEVICE  
A heat dissipation device is used for heat dissipating for an electronic element. The heat dissipation device includes a heat sink and a buffer arranged between the heat sink and the electronic...
US20100315785 ELECTRONIC EQUIPMENT  
An electronic equipment includes: an attachment plate; attachments disposed on the attachment plate and each provided with a female screw; a printed circuit board placed on the attachments;...
US20140111943 METAL INJECTION MOLDED HEAT DISSIPATION DEVICE  
A heat dissipation device is provided. The heat dissipation device includes an integrated heat spreader and a base plate coupled to the integrated heat spreader, wherein the base plate comprises a...
US20100321894 HEATSINK MOUNTING SYSTEM  
A heatsink mounting system (10) is provided for containing and engaging a heatsink (16) against a heat generating component, typically an IC chip (18). The system (10) is includes a rectangular...
US20140301042 MANUFACTURING OF A HEAT SINK BY WAVE SOLDERING  
An electronic device is attached to a first surface of a board which includes vias. A heat sink precursor for the electronic device is attached to the second surface of the electronic board. The...
US20110182034 COMPOSITE COVER WITH INTEGRAL HEAT SINK  
A composite cover for a portion of a motor vehicle transmission has an integral, internal heat sink to which an electronic controller is attached. The cover, which may be fabricated of any...
US20100122795 HEAT DISSIPATION DEVICE  
A heat dissipation device includes a heat sink, a plurality of heat pipes extending in the heat sink, a heat-conducting plate attached to the heat pipes, and a mounting member located between the...
US20130170136 PCB HEAT SINK FOR POWER ELECTRONICS  
A PCB with improved cooling. Openings are provided below electronic components on the PCB of an electronics device. Raised mounts or bosses on the device housing or base extend into the openings...
US20100271784 HEAT SINK ASSEMBLY HAVING A CLIP  
A heat sink assembly includes a heat sink adapted for thermally contacting an electronic component of a printed circuit board, and a clip pressing the heat sink and engaging with the printed...
US20100309632 MOTHERBOARD WITH MOUNTING HOLES  
A motherboard includes a printed circuit board, and a heat generating component mounted on the printed circuit board. A plurality of mounting holes is defined in the printed circuit board for...
US20130093991 Backplane of Backlight Module, Backlight Module and LCD Device  
The present invention discloses a backplane of a backlight module, a backlight module and an LCD device. The backplane of the backlight module comprises a heatsink plate with good heat dispersion...
US20110051373 CAGE HAVING A HEAT SINK DEVICE SECURED THERETO IN A FLOATING ARRANGEMENT THAT ENSURES THAT CONTINUOUS CONTACT IS MAINTAINED BETWEEN THE HEAT SINK DEVICE AND A PARALLEL OPTICAL COMMUNICATIONS DEVICE SECURED TO THE CAGE  
A floating heat sink device is provided that attaches to a cage in a floating configuration that enables the heat sink device to move, or “float”, as the parallel optical communications device...
US20110116238 HEAT DISSIPATION MODULE FOR ELECTRONIC APPARATUS  
A heat dissipation module for an electronic apparatus including a heat-generating structure is provided. The heat dissipation module includes a heat dissipation structure and a heat-conducting...
US20130170145 THERMAL CONNECTOR  
A thermal connector for use with a printed circuit board assembly is disclosed. The thermal connector includes a top segment configured for thermal engagement with a heat source disposed on a top...
US20130094145 THERMAL EXPANSION-ENHANCED HEAT SINK FOR AN ELECTRONIC ASSEMBLY  
A heat sink and method of fabrication are provided for removing heat from an electronic component(s). The heat sink includes a heat sink base and frame. The base has a first coefficient of thermal...
US20110090647 PRINTED CIRCUIT BOARD ASSEMBLY  
A printed circuit board assembly includes a printed circuit board, a first heat dissipating module, and a second heat dissipating module. The printed circuit board includes a first heat generating...
US20140168900 SCALABLE AND MODULAR APPROACH FOR POWER ELECTRONIC BUILDING BLOCK DESIGN IN AUTOMOTIVE APPLICATIONS  
A power electronic building block includes a housing; a power module mounted within the housing; a controller mounted within the housing and coupled to the power module; a capacitor assembly...
US20130170144 ELECTRONIC DEVICE WITH HEAT SINK MECHANSIM  
An electronic device includes an electronic component and a heat sink mechanism. The electronic component includes at least one heat sink portion defining a plurality of heat sink holes. The heat...
US20130107462 HIDDEN PIN TYPE HIGH-POWER LED SUPPORT AND HIDDEN PIN TYPE HIGH-POWER LED PACKAGING STRUCTURE AND TECHNOLOGY USING SAME  
The invention discloses a hidden pin type high-power LED support, which comprises conductive pins and a base for packing the conductive pins, wherein a cavity is formed on the top of the base; a...
US20130077251 HEAT SINK MOUNTING DEVICE  
A heat sink mounting device includes a touching plate and a mounting member. The touching plate defines a locking hole. The mounting member includes a locking post. The locking post includes a...
US20110044003 Heatsink structure  
An improved heatsink structure is disclosed. The present invention provides a type of heatsinks formed by stacking a plurality of particulates, in order to achieve a larger heat-dissipation...
US20150116944 ELECTRICAL ASSEMBLY WITH A SOLDER SPHERE ATTACHED HEAT SPREADER  
An electrical assembly that includes a circuit board, an electrical device, a heat spreader, and a solder sphere. The electrical device is a surface mount type package attached to the circuit...
US20100328897 HEAT SINK ASSEMBLY WITH TEMPERATURE DISPLAY  
A heat sink assembly dissipates heat of a chip on a circuit board. A temperature collecting module of the heat sink assembly senses temperature of the chip and generates corresponding analog...
US20110026226 VEHICULAR ELECTRONICS ASSEMBLY  
An electronics assembly for use in a vehicle is provided. The assembly comprises a heat sink, a dam coupled to the heat sink, the dam and the heat sink combining to form a reservoir, an electronic...
US20130094149 STRUCTURE FOR MOUNTING HEAT SINK, AND HEAT SINK MOUNTED USING THE STRUCTURE  
A new mounting structure is provided in which, when a heat sink is mounted (fixed) on a circuit board using a spring member, an anchor for fixing the spring member is formed in a very small size...
US20120039044 ELECTRONIC DEVICE AND HEAT DISSIPATION APPARATUS OF THE SAME  
A heat dissipation apparatus is arranged in a housing of an electronic device. The electronic device includes a motherboard mounted in the housing. The heat dissipation apparatus includes a heat...
US20130050946 FASTENING MECHANISM FOR FIXING RADIATOR  
A fastening mechanism for fixing a radiator having a plurality of heat sinks to a circuit board includes two fixing rods fixed on the circuit board, a connecting member positioned between the heat...
US20120281363 HEAT SPREADER FOR ELECTRICAL COMPONENTS  
A heat spreader for a resistive element is provided, the heat spreader having a body portion that is arranged over a top surface of the resistive element and electrically insulated from the...
US20120300405 ELECTRONIC CONTROL DEVICE  
The invention relates to an electronic control device (10) having electronic components (160, 162) on a circuit board (110) which are shielded from electrical and/or magnetic interference fields....
US20080089077 Heatsink and illumination system with a heatsink  
A heatsink (2), comprising a heatsink body (3) extending between two endsides (4, 5) of the heatsink body. The heatsink is designed for introducing the heatsink with the first endside ahead into...
US20140321061 SLIDING THERMAL CONTACT FOR PLUGGABLE OPTIC MODULES  
Present thermal solutions to conduct heat from pluggable optical modules into heat sinks use a metal heat sink attached with a spring clip. The interface between the pluggable module and the heat...
US20150201486 Stacked Heatsink Assembly  
A stacked heatsink comprises a first thermally conductive plate and a second thermally conductive plate. The first thermally conductive plate defines one or more recesses. The first and second...
US20100284151 Sealed Power Supply and Platform for Military Radio  
An AC/DC power supply and platform for a military radio has been developed. The apparatus includes a base that supports at least one SINCGARS RT-1523 radio. The base is connected to an AC power...
US20110134607 SOLID STATE SWITCH ARRANGEMENT  
A solid state switching arrangement includes at least one bus bar configured to carry electrical current and at least one switch that is gallium nitride based. The switch is secured relative to...
US20150223362 ELECTRONIC DEVICE  
An electronic device includes a base plate, a plurality of modules detachably fitted and connected to the base plate, a plurality of mounting members configured to detachably mount the base plate...
US20090219696 POWER CONVERSION DEVICE AND FABRICATING METHOD FOR THE SAME  
A power conversion device in which the inductance of a main circuit is reduced, a surge voltage is suppressed, elements are properly cooled, which is miniaturized and reduced in weight as a whole,...
US20130335921 SUBSTRATE FOR POWER MODULE, SUBSTRATE WITH HEAT SINK FOR POWER MODULE, POWER MODULE, METHOD FOR PRODUCING SUBSTRATE FOR POWER MODULE, AND METHOD FOR PRODUCING SUBSTRATE WITH HEAT SINK FOR POWER MODULE  
Provided is a power module substrate including a ceramic substrate, and a metal plate which contains aluminum or an aluminum alloy, and which is stacked and bonded on a surface of the ceramic...
US20120206881 SYSTEMS AND METHODS FOR THERMAL MANAGEMENT FOR TELECOMMUNICATIONS ENCLOSURES USING HEAT PIPES  
Systems and methods for thermal management for telecommunications enclosures are provided. In one embodiment, a method for thermal management for modular radio frequency (RF) electronics housed...
US20150201530 Heat Spreading Packaging Apparatus  
This invention is related to a new heat spreading packaging design and the constituting method, especially mounting a heat spreader into an electronic device, so that it can reduce the internal...
US20100157539 HEATSINK MOUNTING SYSTEM  
A heatsink system (10) is provided for containing and engaging a heatsink (16) against a heat generating component, typically an IC chip (18). The system (10) includes a rectangular integrally...
US20130279118 THERMALLY CONDUCTIVE ADHESIVE  
A thermally conductive adhesive having: a thermosetting adhesive containing a curable component and a curing agent for the curable component, and a metal filler dispersed in the thermosetting...
US20080174966 Modular Power Converters Usable Alone or in a Multiphase Power Converter  
A power converter module for use alone or with other modules in a multiphase power converter. The power converter module has an enclosure that surrounds internal components to prevent radiation of...
US20140185243 HEAT SINK-INTEGRATED DOUBLE-SIDED COOLED POWER MODULE  
A power module for an inverter that is used in an eco-friendly vehicle, such as a hybrid vehicle, an electrical vehicle, or a fuel cell vehicle, i.e., a heat sink-integrated double-sided cooled...

Matches 1 - 50 out of 383 1 2 3 4 5 6 7 8 >