Matches 1 - 44 out of 44


Match Document Document Title
US20110261535 POWER MODULE  
A power module includes a power module board including an insulating layer and a conductive circuit formed on the insulating layer, a power device provided on the power module board and...
US20150237763 EFFICIENT HEAT TRANSFER FROM CONDUCTION-COOLED CIRCUIT CARDS  
A conduction-cooled card assembly is disclosed that includes a conduction-cooling frame, a printed wiring board mounted on the frame, and a wedgelock fastener. The conduction-cooling frame has a...
US20150116943 THERMOELECTRIC HEAT PUMP WITH A SURROUND AND SPACER (SAS) STRUCTURE  
A heat pump includes a SAS structure with a wall defining a first open side and a second open side. The heat pump also includes an interconnect board, enclosed within the SAS structure including...
US20050088823 VARIABLE DENSITY GRAPHITE FOAM HEAT SINK  
A heat sink is disclosed for directing heat away from an electronic component dissipating heat. The heat sink includes a thermally conductive base formed of a variable density graphite foam...
US20100046170 COMPOSITE AVIONICS CHASSIS  
An avionics chassis for protecting against damage, dust, dirt and incidental moisture over an extended temperature range, EMI shielding to prevent radiation of internal circuit energy and...
US20080298021 Notebook computer with hybrid diamond heat spreader  
Embodiments of a device are described. This device includes an integrated circuit and a heat spreader coupled to the integrated circuit. This heat spreader includes a first layer of an allotrope...
US20090213551 INTEGRATED CIRCUIT NANOTUBE-BASED STRUCTURE  
Carbon nanotube material is used in an integrated circuit substrate. According to an example embodiment, an integrated circuit arrangement (100) includes a substrate (110) with a carbon nanotube...
US20090059531 Endotherm Systems and Methods Utilizing Carbohydrate In Non-Oxidizing Environment  
The increase of temperature in heat sensitive devices during heat generating conditions is prevented through the absorption of heat, by providing a carbohydrate endotherm in an amount sufficient...
US20110279979 Constructions Comprising Rutile-Type Titanium Oxide; And Methods Of Forming And Utilizing Rutile-Type Titanium Oxide  
Some embodiments include methods of forming rutile-type titanium oxide. A monolayer of titanium nitride may be formed. The monolayer of titanium nitride may then be oxidized at a temperature less...
US20090279218 THERMAL ISOLATION OF ELECTRONIC DEVICES IN SUBMOUNT USED FOR LEDS LIGHTING APPLICATIONS  
The present invention relates to an electronic device for providing improved heat transporting capability for protecting heat sensitive electronics and a method for producing the same. The present...
US20070159799 High Performance Large Tolerance Heat Sink  
A heat sink apparatus for electronic components provides a heat sink and a deformable, convex foil construction affixed to the heat sink around a periphery of the foil construction and adapted to...
US20090067132 Heat spreader and method of making the same  
A heat spreader having at least two adjoining strips of pyrolytic graphite material is made by cutting a strip from a sheet of pyrolytic graphite in the z direction. Thermal conductivity in the xy...
US20090095461 Layered Heat Spreader and Method of Making the Same  
A heat spreader having at least two adjoining layers each having at least two pyrolytic graphite strips cut from a sheet of pyrolytic graphite along the z direction. Thermal conductivity in the xy...
US20130148304 EPOXY RESIN COMPOSITION FOR ELECTRONIC PARTS ENCAPSULATION AND ELECTRONIC PARTS-EQUIPPED DEVICE USING THE SAME  
The present invention relates to an epoxy resin composition for electronic parts encapsulation, including the following components (A) to (E), (A) an epoxy resin having an ICI viscosity of from...
US20130094148 INTEGRAL HEATER ASSEMBLY AND METHOD FOR CARRIER OR HOST BOARD OF ELECTRONIC PACKAGE ASSEMBLY  
A multilayer printed circuit board has an embedded heater layer having at least one elongated heater element trace of copper which is densely arranged in a predetermined circuitous path over at...
US20090122491 UNIVERSAL PATTERNED METAL THERMAL INTERFACE  
The present invention is a universal patterned metal thermal interface. The thermal interface eliminates the need for surface processing of one or both contact surfaces that are to accommodate the...
US20130329352 SOLID-STATE DRIVE WITH PASSIVE HEAT TRANSFER  
The disclosed embodiments relate to a system that facilitates thermal conductance in a system that includes a module comprising a circuit board with integrated circuits, such as a solid-state...
US20150077942 ELECTRONIC POWER MODULE ARRANGEMENT  
The invention provides an electrical power module, including power transistors, and control components for controlling said power transistors, said module being cooled, in particular, by heat...
US20100315783 HEAT SPREADER AND METHOD OF MAKING THE SAME  
A heat spreader having at least two adjoining strips of pyrolytic graphite material is made by cutting a strip from a sheet of pyrolytic graphite in the z direction. Thermal conductivity in the xy...
US20050270746 Insulating structure having combined insulating and heat spreading capabilities  
The present invention provides an insulating structure comprising an insulating material and a heat spreading material. The invention further provides a portable electronic device comprising at...
US20150257249 Heat Sink With Protrusions On Multiple Sides Thereof And Apparatus Using The Same  
Embodiments of a thermal management unit and an electronic apparatus utilizing the thermal management unit are described. In one aspect, the thermal management unit includes a heat sink. The heat...
US20080068803 Heat dissipating device holder structure with a thin film thermal conducting medium coating  
In a heat dissipating device holder structure with a thin film thermal conducting medium coating, at least two thermal conducting medium coating blocks are set on attaching surfaces of a heat...
US20100110637 HIGH THERMAL CONDUCTIVITY METAL MATRIX COMPOSITES  
Discontinuous diamond particulate containing metal matrix composites of high thermal conductivity and methods for producing these composites are provided. The manufacturing method includes...
US20090154107 ONE-DIMENSIONAL HIERARCHICAL NESTED CHANNEL DESIGN FOR CONTINUOUS FEED MANUFACTURING PROCESSES  
A series of hierarchical channels are formed in a first member surface of a first member using a continuous-feed manufacturing process. The channels are configured to control particle stacking....
US20110141698 HEAT SPREADING STRUCTURE  
The disclosed is a thermal interface layer disposed between a heat-generating apparatus and a thermal dissipation component. The thermal interface layer is composed of a mixture of a resin matrix...
US20090034203 Cr-Cu ALLOY, METHOD FOR PRODUCING THE SAME, HEAT-RELEASE PLATE FOR SEMICONDUCTOR, AND HEAT-RELEASE COMPONENT FOR SEMICONDUCTOR  
In a Cr—Cu alloy that is formed by powder metallurgy and contains a Cu matrix and flattened Cr phases, the Cr content in the Cr—Cu alloy is more than 30% to 80% or less by mass, and the average...
US20060018098 PCB board incorporating thermo-encapsulant for providing controlled heat dissipation and electromagnetic functions and associated method of manufacturing a PCB board  
A circuit board assembly includes a substantially planar shaped printed circuit board (PCB) having a first side and a second side separated by a determined thickness. At least one electrically...
US20070035930 Methods and devices for cooling printed circuit boards  
Methods and devices for cooling printed circuit boards having at least one heat source are disclosed and described. The method can include coating a layer of diamond-like carbon (DLC) over at...
US20090237886 SHEET STRUCTURE AND METHOD OF MANUFACTURING SHEET STRUCTURE  
The sheet structure includes a plurality of linear structures of carbon atoms, a filling layer filled in gaps between the linear structures for supporting the plurality of linear structures, and a...
US20130271921 PLASTICIZED CERAMIC THERMAL DISSIPATION MODULE  
A plasticized ceramic thermal dissipation module comprises a heating electrical component, a cooling body, and a thermal conductive device. They are located orderly. The thermal conductive device...
US20050111188 Thermal management device for an integrated circuit  
Embodiments of the present invention include an apparatus, method, and system for an electronic assembly with a thermal management device including a porous medium.
US20120218713 HEAT RADIATION MATERIAL, ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE  
The electronic device includes a heat generator 54, a heat radiator 58, and a heat radiation material 56 disposed between the heat generator 54 and the heat radiator 58 and including a plurality...
US20090166852 SEMICONDUCTOR PACKAGES WITH THERMAL INTERFACE MATERIALS  
A method comprises providing a layer of nano particles between a semiconductor die and a slug; and sintering the layer of nano particles to provide thermal interface material to bond the...
US20090190312 Heat transfer film, semiconductor device, and electronic apparatus  
A heat transfer film includes a heat transfer layer formed of a first constituent material containing C (carbon) for transferring heat in an in-plane direction thereof and a layer thickness...
US20080291634 THERMAL INTERCONNECT AND INTERFACE MATERIALS, METHODS OF PRODUCTION AND USES THEREOF  
Thermal interface materials are disclosed that include at least one matrix material component, at least one high conductivity filler component, at least one solder material; and at least one...
US20100124025 HEAT RADIATION MATERIAL, ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE  
The electronic device includes a heat generator 54, a heat radiator 58, and a heat radiation material 56 disposed between the heat generator 54 and the heat radiator 58 and including a plurality...
US20070131448 Circuit board structure with heat radiating layer  
A circuit board structure includes a heat radiating layer that is integrally pressed to bond to a copper foil layer or a substrate for a circuit board and then machined to form a plurality of...
US20080291633 PACKAGE ASSEMBLY WITH HEAT DISSIPATING STRUCTURE  
A package assembly with a heat dissipating structure includes a thermal conductive lower metal layer, an electric insulating ceramic layer, a patterned upper metal layer and an electronic...
US20170164460 CIRCUIT BOARD AND DISPLAY DEVICE HAVING THE SAME  
A circuit board includes a base layer, a circuit layer disposed on the base layer, where an air gap is defined in the circuit layer, a heat blocking part disposed in the air gap, and an electronic...
US20160381782 LIGHT EMITTING ELEMENT MODULE  
A light emitting element module according to an embodiment of the present invention includes a first metal substrate; a second metal substrate on the first metal substrate; an insulation layer on...
US20160338228 HEAT DISSIPATING COMPONENT, MANUFACTURING METHOD FOR HEAT DISSIPATING COMPONENT, ELECTRONIC DEVICE, MANUFACTURING METHOD FOR ELECTRONIC DEVICE, INTEGRATED MODULE, AND INFORMATION PROCESSING SYSTEM  
A heat dissipating component comprising: a main body formed from a first material; a heat dissipating sheet that is formed from a second material having higher thermal conductivity than the first...
US20150327393 HEAT-DISSIPATING RESIN COMPOSITION, AND COMPONENT AND ELECTRONIC DEVICE INCLUDING THE SAME  
Provided is a heat-dissipating resin composition including: a rubber material having an average emissivity of 80% or higher in a wavelength range from 5 μm to 20 μm; and a filler having a grain...
US20150303362 Ceramic Substrate and Semiconductor Package Having the Same  
A ceramic substrate is provided, including: a board having a first surface and a second surface opposing the first surface; first electrical contact pads disposed on the first surface; second...
US20120120609 PACKAGE STRUCTURE HAVING A SEMICONDUCTOR COMPONENT EMBEDDED THEREIN AND METHOD OF FABRICATING THE SAME  
A package structure includes: a first dielectric layer having a first surface and a second surface opposing the first surface; a semiconductor chip embedded in the first dielectric layer in a...

Matches 1 - 44 out of 44