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US20110235271 MOTHER AND DAUGHTER BOARD CONFIGURATION TO IMPROVE CURRENT AND VOLTAGE CAPABILITIES OF A POWER INSTRUMENT  
An arrangement of a mother circuit board and daughter circuit boards in a power instrument improves current and voltage capabilities. A mother board is mounted to a base panel of an enclosure, and...
US20110044000 TRANSPARENT HEAT-SPREADER FOR OPTOELECTRONIC APPLICATIONS  
An optoelectronic cooling system is equally applicable to an LED collimator or a photovoltaic solar concentrator. A transparent fluid conveys heat from the optoelectronic chip to a hollow cover...
US20110075367 COMPLIANT CONDUCTION RAIL ASSEMBLY AND METHOD FACILITATING COOLING OF AN ELECTRONICS STRUCTURE  
Compliant conduction rail assembly and method are provided for facilitating cooling of an electronics structure. The rail assembly includes a first thermally conductive rail mounted to a surface...
US20120281358 COOLED ELECTRONIC SYSTEM WITH THERMAL SPREADERS COUPLING ELECTRONICS CARDS TO COLD RAILS  
Liquid-cooled electronic systems are provided which include an electronic assembly having an electronics card and a socket with a latch at one end. The latch facilitates securing of the card...
US20110317366 FIXING STRUCTURE AND FIXING METHOD OF CIRCUIT BOARD WITH EMBEDDED ELECTRONIC PARTS TO COOLER  
In a fixing structure of a circuit board to a cooler, the circuit board includes a wiring part, electronic parts electrically connected to the wiring part and an insulating base material embedding...
US20140126150 HEAT DISSIPATION LID HAVING DIRECT LIQUID CONTACT CONDUITS  
A heat dissipation lid that includes a plate having a first surface, an opposing second surface, and at least one sidewall extending from the plate second surface. The heat dissipation lid also...
US20080304236 Maintaining cooling system air above condensation point  
A cooling system cools air that flows through an electronic system to cool heat generating components. The cooling system maintains a temperature of the air near a set point above a condensation...
US20120287655 HEAT DISSIPATION DEVICE  
The present invention relates to a heat dissipation device, which comprises: a fluid, a fluid delivery device, and a circular pipe. The fluid delivery device is for propelling and delivering the...
US20120063084 CIRCUIT BOARD CHASSIS AND METHOD INCLUDING SIDEWALL APERTURE AND BACKPLANE INSERTION SLOTS FOR SIDE ASSEMBLED BACKPLANE  
A circuit board chassis and a method for assembling a backplane and a circuit board into the circuit board chassis include an aperture within at least one sidewall of the circuit board chassis....
US20110177954 SUPERCONDUCTING ELECTRICITY TRANSMISSION SYSTEM  
The present disclosure generally relates to a superconducting power grid having one or more AC/DC converters. The superconducting grid may further include one or more pairs of superconducting DC...
US20130235526 ELECTRICAL PART FIXING STRUCTURE FOR HYBRID VEHICLES  
A battery charger (21) is disposed above an exhaust pipe (8), and a junction box (22) is disposed above the charger (21), the charger (21) including a cooler (21C) having a forced cooling function.
US20130094145 THERMAL EXPANSION-ENHANCED HEAT SINK FOR AN ELECTRONIC ASSEMBLY  
A heat sink and method of fabrication are provided for removing heat from an electronic component(s). The heat sink includes a heat sink base and frame. The base has a first coefficient of thermal...
US20070089867 Magneto-hydrodynamic hot spot cooling heat sink  
A heat sink is configured to cool at least one hot spot of an integrated circuit. The heat sink has a first pipe and a second pipe disposed interior to and concentric with the first pipe, where at...
US20120069519 FLUID-COOLED ELECTRICAL EQUIPMENT, AVIONIC RACK TO RECEIVE SUCH EQUIPMENT AND AIRCRAFT EQUIPPED WITH SUCH RACKS  
This invention relates to a fluid-cooled electronic equipment item, an avionic rack to receive such an equipment item and an aircraft equipped with such racks. The electronic equipment items are...
US20130301220 MOUNTING STRUCTURE FOR POWER CONTROL UNIT  
A PCU (20) comprises an anchoring pedestal (22) that is attached to the opening of a transaxle and that has been molded from resin so as to be formed integrally with a terminal block (21); a...
US20070297136 MODULAR LIQUID COOLING OF ELECTRONIC COMPONENTS WHILE PRESERVING DATA CENTER INTEGRITY  
The integrity of the data center cooling system is maintained by using separate and independent cooling loops to collect heat from electronic components housed in modular units. According to one...
US20110286183 WATER-COOLED COMMUNICATION CHASSIS  
A water-cooled communication chassis includes a chassis body and a water cooling unit. The chassis body includes at least one heat receiving portion, at least one heat dissipation portion, and at...
US20100315779 WATER-COOLED COMMUNICATION CHASSIS  
A water-cooled communication chassis includes a chassis body and a water cooling unit. The chassis body includes at least one heat receiving portion, at least one heat dissipation portion, and at...
US20150138729 Solar Inverter  
A solar inverter is provided having a cooling module, a DC module, an inverter module and an AC module provided side-by-side within a chassis. The DC module includes an input accessible from a...
US20150146376 HEAT-RECEIVING DEVICE, COOLING DEVICE, AND ELECTRONIC DEVICE  
A heat-receiving device includes: a first heat receiver into which a refrigerant flows, and that receives heat from a heat-generating part; and a second heat receiver into which the refrigerant...
US20110242760 POWER CONVERTER MODULE WITH A COOLED BUSBAR ARRANGEMENT  
A power converter module has a first liquid-cooled heat sink, a busbar arrangement having at least two busbars which are electrically insulated from one another and at least one power...
US20050067147 Loop thermosyphon for cooling semiconductors during burn-in testing  
A burn-in testing cooling system including an evaporator comprising an upright tubular body having an interior surface and a central passageway with a wick disposed on the interior surface of the...
US20120224326 MODULAR BATTERY STRUCTURE  
A module system is provided that includes at least one module support and at least one module support and at least one energy storage module that is connected to the at least one module support....
US20150043165 ELEVATED TEMPERATURE COOLING WITH EFFICIENCY OPTIMIZATION CONTROL  
Apparatus, systems, and method for efficiently cooling computing devices having heat-generating electronic components, such as, for example, independently operable servers, immersed in a...
US20090231807 Waterproof Ventilated Display Enclosure  
A waterproof ventilated enclosure for housing equipment is disclosed having the ability to channel water thru the enclosure without touching the equipment and further with the ability to provide...
US20140126149 SEPARATE CONTROL OF COOLANT FLOW THROUGH COOLANT CIRCUITS  
Methods and coolant distribution systems are provided for automated coolant flow control for, for instance, facilitating cooling of multiple different electronic systems. The methods include, for...
US20140126151 SEPARATE CONTROL OF COOLANT FLOW THROUGH COOLANT CIRCUITS  
Methods are provided for automated coolant flow control for, for instance, facilitating cooling of multiple different electronic systems. The methods include, for instance, automatically...
US20120257353 Carriage Chassis With A Tri-Lobed Torsion Stop  
Carriage chassis for installation of a component assembly in a support structure. The support structure includes a power connector in a connector housing. The carriage chassis includes: rails...
US20120188717 POWER ELECTRONICS ASSEMBLY FOR A MAGNETIC RESONANCE DEVICE  
A power electronics assembly for a magnetic resonance device includes a housing and at least one printed circuit board (PCB) arranged in the housing with at least one power electronics component...
US20150146368 SCALABLE LIQUID SUBMERSION COOLING SYSTEM  
A scalable liquid submersion cooling system for electronics. The system includes a plurality of modular system components, such as electronics enclosures, manifolds, pumps, and heat exchanger...
US20110188203 PLUG IN LED ARRAY  
An LED device comprises an LED (16) mounted upon a circuit board (10), an electrical connector (14) carried by the circuit board (10), and a heat sink (20) carried by the circuit board (10) and...
US20140369004 HEAT-TRANSFER PLATE, HEAT-TRANSFER PLATE MODULE, AND SUBMARINE APPARATUS  
A heat-transfer plate includes a pool portion configured to have a partially-depressed surface and to be loaded with thermally-conductive resin that is in contact with a heating component so as to...
US20110069454 LIQUID-COOLED ELECTRONICS APPARATUS AND METHODS OF FABRICATION  
Liquid-cooled electronics apparatuses and methods are provided. The cooled electronics apparatuses include a liquid-cooled cold rail and an electronics subassembly. The liquid-cooled cold rail has...
US20140369005 PASSIVE THERMAL MANAGEMENT DEVICE  
A thermal management device including a first face configured to be in contact with a hot source and a second face opposite the first face configured to be in contact with a cold source, and at...
US20130050936 HEAT TRANSFERRING MODULE AND START UP METHOD OF ELECTRONIC DEVICE  
A heat transferring module adapted to an electronic device is provided. The electronic device includes at least one heat source and a plurality of ready-to-heat elements. The heat transferring...
US20090052134 LIQUID-COOLED GROUNDED HEATSINK FOR DIODE RECTIFIER SYSTEM  
A diode rectifier system for generator excitation includes a plurality of diode modules mounted on a heatsink and a coolant tube provided in the heatsink. The heatsink is electrically grounded. A...
US20060254752 Radiator and heatsink apparatus having the radiator  
A radiator includes: an inlet header having a hollow shape and being provided with an inlet for the coolant to enter; a plurality of flat tubes connecting to the inlet header on one end; and an...
US20150116941 FABRICATING COOLED ELECTRONIC SYSTEM WITH LIQUID-COOLED COLD PLATE AND THERMAL SPREADER  
Methods are provided for facilitating cooling of an electronic component. The method includes providing a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold...
US20050241803 Liquid cooling loop using tubing and bellows for stress isolation and tolerance variation  
A liquid loop cooling apparatus includes rigid or semi-rigid tubing enclosing an interior bore or lumen within which a cooling fluid can circulate among at least one heat-generating component in a...
US20120188718 Assembly of an Electronic Device Casing, A Heat-Dissipating Module and a Waterproofing Module, and the Waterproofing Module  
An assembly includes an electronic device casing, a heat-dissipating module and a waterproofing module. The electronic device casing is formed with an encircling wall. The encircling wall has a...
US20140233175 ELECTRONIC BOARD PROVIDED WITH A LIQUID COOLING SYSTEM  
An electronic board includes a support on which first electronic components are installed, the first electronic components having a height of less than a first threshold height h1; a cold plate...
US20110249402 POWER CONVERTER MODULE WITH COOLED BUSBAR ARRANGEMENT  
A power converter module includes at least two power semiconductor modules, which are mechanically connected to a liquid-cooled heat sink and electrically connected to terminals of the power...
US20150124406 HEAT-RECEIVING DEVICE, COOLING DEVICE, AND ELECTRONIC DEVICE  
A heat-receiving device includes: a plurality of heat receivers into which a refrigerant flows; a series path that comprises a connection path connecting adjacent heat receivers among the...
US20090219693 Cooling system for high voltage systems  
A cooling system for a high voltage system can include a high voltage supply and an electrical component coupled to the high voltage supply. The electrical component can generate heat that needs...
US20150103490 OIL COOLING DEVICE FOR SERVER AND METHOD FOR DRIVING SAME  
The present invention relates to an oil cooling device for a server and a method for driving the same. The oil cooling device for the server comprises: a server tower having a flow passage into...
US20070227709 Multi device cooling  
A micro scale cooling system comprises a first heat exchanger thermally coupled to a first heat source. The cooling system also has a second heat exchanger thermally coupled to a second heat...
US20080264604 COOLING APPARTAUS, COOLED ELECTRONIC MODULE AND METHODS OF FABRICATION EMPLOYING A MANIFOLD STRUCTURE WITH INTERLEAVED COOLANT INLET AND OUTLET PASSAGEWAYS  
A cooling apparatus and method of fabrication are provided for facilitating removal of heat from an electronic device. The cooling apparatus includes a manifold structure having a plurality of...
US20140247555 SELECTIVE CLAMPING OF ELECTRONICS CARD TO COOLANT-COOLED STRUCTURE  
Cooling apparatuses and coolant-cooled electronic assemblies are provided which include a thermal transfer structure configured to couple to an electronics card which operatively inserts into an...
US20150070845 POWER SUPPLY DEVICE  
In a power supply device 1, a first space R1 and a second space R2 are delimited, a coil component 20 is arranged in the first space R1, and heat-generating components and components having weak...
US20140198452 DISASSEMBLABLE ELECTRONIC ASSEMBLY WITH LEAK-INHIBITING COOLANT CAPILLARIES  
Cooled electronic assemblies and methods of fabrication are provided. In one embodiment, the assembly includes a coolant-cooled electronic module with one or more electronic component(s), and one...