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US20090316360 |
COOLING APPARATUS AND METHOD OF FABRICATION THEREOF WITH A COLD PLATE FORMED IN SITU ON A SURFACE TO BE COOLED
A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat-generating electronic device. The method of fabrication includes: obtaining a solder...
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US20090316361 |
Method and apparatus for controlling the output of solar arrays
A method to control the temperature of a circulating fluid and thereby control the electrical output of a PV array is provided along with an apparatus for doing so which adds simple mechanical,...
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US20090316359 |
HEAT-TRANSFER MECHANISM INCLUDING A LIQUID-METAL THERMAL COUPLING
Embodiments of a heat-transfer mechanism are described. This heat-transfer mechanism includes a first heatpipe having a first end and a second end, and a second heatpipe having a third end and a...
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US20090303684 |
SYSTEMS AND METHODS FOR COOLING AN ELECTRONIC DEVICE
Systems and methods for cooling electronic devices via enhanced thermal conduction in the gap separating an electronic device from a heat sink are provided. In one embodiment, a system for cooling...
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US20090294676 |
COOLING DEVICE AND COOLING METHOD
The present invention provides a cooling device that can cool an electronic device in a short amount of time. When an electronic cassette has been accommodated in a housing device, the cooling...
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US20090284922 |
HIGH-POWER THYRISTOR MODULE HAVING COOLING EFFECT
A high-power thyristor module includes a housing configured with an inner receiving space, and a thyristor unit disposed in the inner receiving space in the housing and including a mounting frame,...
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US20090284921 |
Apparatus and Methods for High-Performance Liquid Cooling of Multiple Chips with Disparate Cooling Requirements
Apparatus and methods are provided for packaging multi-chip modules with liquid cooling modules designed to provide different thermal resistances for effectively conducting heat from various chips...
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US20090279259 |
System and method for proportional cooling with liquid metal
A circuit board may include a pump and a channel. The channel may include a liquid metal and a coating. The liquid metal may be pumped through the channel by the pump and the coating reduces...
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US20090279258 |
HINGE CONNECTOR WITH LIQUID COOLANT PATH
A hinge for moving two parts of an electronic apparatus relative to each other is disclosed. The hinge includes two coolant flow paths helically arranged between inlet and outlet connections as...
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US20090279257 |
SYSTEM AND METHOD FOR A SUBSTRATE WITH INTERNAL PUMPED LIQUID METAL FOR THERMAL SPREADING AND COOLING
A circuit board includes a pump and a channel. The channel includes a liquid metal and a coating. The liquid metal is pumped through the channel by the pump and the coating reduces diffusion and...
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US20090268404 |
ENERGY EFFICIENT APPARATUS AND METHOD FOR COOLING AN ELECTRONICS RACK
Apparatus and method are provided for cooling an electronics rack in an energy efficient, dynamic manner. The apparatus includes one or more extraction mechanisms for facilitating cooling of the...
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US20090251862 |
SILICON BASED MICROCHANNEL COOLING AND ELECTRICAL PACKAGE
A chip package includes: a substrate; a plurality of conductive connections in contact with the silicon carrier; a silicon carrier in a prefabricated shape disposed above the substrate, the silicon...
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US20090237884 |
Electromagnetically-actuated micropump for liquid metal alloy
The present invention discloses a method of confining a liquid metal alloy within a closed-loop system; distributing a first portion of the liquid metal alloy in a cavity within the closed-loop...
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US20090237883 |
BOARD UNIT AND ELECTRONIC APPARATUS
A board unit comprises a board, a heat generating component mounted on a front surface of the board, a first heat transfer plate whose inner surface faces the front surface of the board and is...
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US20090236666 |
Integrated Circuitry
Some embodiments include formation of at least one cavity in a first semiconductor material, followed by epitaxially growing a second semiconductor material over the first semiconductor material...
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US20090231807 |
Waterproof Ventilated Display Enclosure
A waterproof ventilated enclosure for housing equipment is disclosed having the ability to channel water thru the enclosure without touching the equipment and further with the ability to provide...
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US20090231810 |
DIRECT DIPPING COOLED POWER MODULE AND PACKAGING
A power module package including a fully enclosed package comprising sidewalls; wherein at least one of said sidewalls includes a conductive substrate; wherein circuit elements are mounted on said...
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US20090231811 |
Electric Power Conversion Apparatus
An electric power conversion apparatus includes: a channel case in which a cooling water channel is formed; a double side cooling semiconductor module that comprises an upper and lower arms series...
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US20090231812 |
DIRECT COOLED POWER ELECTRONICS SUBSTRATE
The disclosure describes directly cooling a three-dimensional, direct metallization (DM) layer in a power electronics device. To enable sufficient cooling, coolant flow channels are formed within...
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US20090225512 |
Electronic module having thermal cooling insert
An electronic module is provided having enhanced thermal cooling of electronics. The module includes a housing, electronic circuitry contained within the housing, and a fluid cooling chamber...
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US20090219694 |
Power Electronics Assembly
The invention concerns a power electronic arrangement comprising an insulating substrate, a cooling element arranged beneath the insulating substrate and one or more power electronic components...
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US20090219692 |
Rack for housing a liquid-cooled electric unit
The present invention provides a rack suitable for housing a liquid-cooled electric unit. A rack 2 comprises an electric connector 12 for supplying electricity to the housed electric unit 50 ,...
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US20090219693 |
Cooling system for high voltage systems
A cooling system for a high voltage system can include a high voltage supply and an electrical component coupled to the high voltage supply. The electrical component can generate heat that needs to...
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US20090213539 |
HEAT DISSSIPATION ASSEMBLY FOR COMPUTING DEVICES
An improvement for an assembly for use in a computing device which includes a microprocessor and a motherboard and a socket for receiving and making electric contact with the microprocessor. A heat...
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US20090213541 |
Cooling Plate Assembly with Fixed and Articulated Interfaces, and Method for Producing Same
A cooling plate assembly for transferring heat from electronic components mounted on a circuit board includes both fixed and articulated interfaces. A fixed-gap coldplate is positioned over and in...
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US20090207568 |
METHOD AND APPARATUS FOR COOLING IN MINIATURIZED ELECTRONICS
A method and apparatus for cooling in miniaturized electronics are provided including in an electronic circuit board. The electronic circuit includes a substrate and at least one integrated channel...
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US20090201644 |
SYSTEMS AND ASSOCIATED METHODS FOR COOLING COMPUTER COMPONENTS
Computer systems and associated methods for cooling computer components are disclosed herein. One embodiment of a computer system includes a computer cabinet having an air inlet spaced apart from...
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US20090201643 |
INTEGRATED MICRO-CHANNELS FOR 3D THROUGH SILICON ARCHITECTURES
Some embodiments of the present invention include apparatuses and methods relating to integrated micro-channels for removing heat from 3D through silicon architectures.
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US20090195093 |
Hybrid Vehicle
An electric motor radiator ( 34 ), a feeding mechanism ( 30 ), and a cooling oil circulation path ( 32 ) constitute a cooling mechanism that cools the electric motor ( 6 ) via an electric motor...
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US20090190310 |
HEAT MANAGEMENT IN AN ELECTRONIC MODULE
In one example, an electronic module includes a printed circuit board and a housing at least partially enclosing the printed circuit board. The printed circuit board includes a heat-generating...
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US20090185343 |
WATER-COOLING RADIATOR FOR A COMPUTER CHIP
A water-cooling radiator for a computer chip is provided to lower the temperature of the computer chip. The radiator includes a body on which other elements can be fixed and providing an interface...
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US20090185190 |
TEMPERATURE-STABLE INTERFEROMETER
This invention provides an interferometer for detecting analyte in a microfluidic chip. The device maintains a stable temperature at the chip with variation of no more than 5 microdegrees C. and/or...
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US20090180255 |
Simple Efficient Assembly and Packaging of RF, FDD, TDD, HTS and/or Cryo-Cooled Electronic Devices
Systems and methods for simple, efficient and/or cost effective manufacturing and assembly of electronic devices are provided. These may include various ways of coupling, attaching, and/or...
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US20090154101 |
LIQUID-COOLED INVERTER ASSEMBLY
An inverter assembly includes a housing and a substrate disposed in the housing. The substrate includes at least a first conductive layer patterned to include an alternating current (AC) path and a...
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US20090147479 |
HEAT DISSIPATION APPARATUS
A heat dissipation apparatus including an insulation substrate, a heat sink, and a heat mass member. The insulation substrate includes a first surface serving as a heated body receiving surface and...
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US20090126909 |
SYSTEM AND METHOD FOR FACILITATING COOLING OF A LIQUID-COOLED ELECTRONICS RACK
Systems and methods are provided for cooling an electronics rack, which includes a heat-generating electronics subsystem across which air flows from an air inlet to an air outlet side of the rack....
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US20090115491 |
PREDICTION STRATEGY FOR THERMAL MANAGEMENT AND PROTECTION OF POWER ELECTRONIC HARDWARE
A hybrid powertrain system includes an engine, an electric machine, a power electronics device including a plurality of electric circuit layers, and a cooling system. A method for managing thermal...
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US20090109713 |
Variable speed drive
Systems and methods for improved Variable Speed Drives are provided. One embodiment relates to apparatus for common mode and differential mode filtering for motor or compressor bearing protection...
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US20090109622 |
THERMAL CONTROL SYSTEM FOR RACK MOUNTING
A thermal control system of a 3U height includes various modules for providing temperature control in a rack environment. The modules may be, for example, a power module, user interface module,...
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US20090080158 |
Comb-shaped power bus bar assembly structure having integrated capacitors
A reconfigurable high performance computer occupies less than 360 cubic inches and has an approximate compute power of 0.7 teraflops per second while consuming less than 1000 watts. The computer...
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US20090074595 |
MINIATURIZED LIQUID COOLING DEVICE HAVING DROPLET GENERATOR AND PIZEOELECTRIC MICROPUMP
A miniaturized liquid cooling device ( 200 ) includes a heat absorber ( 20 ), a heat dissipater ( 30 ), a liquid driving device and a plurality of tubes ( 60 ) connecting the heat absorber, the...
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US20090057879 |
STRUCTURE AND PROCESS FOR ELECTRICAL INTERCONNECT AND THERMAL MANAGEMENT
A structure and method for thermal management of integrated circuits. The structure for thermal management of integrated circuits includes first and second substrates bonded together, at least one...
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US20090052134 |
LIQUID-COOLED GROUNDED HEATSINK FOR DIODE RECTIFIER SYSTEM
A diode rectifier system for generator excitation includes a plurality of diode modules mounted on a heatsink and a coolant tube provided in the heatsink. The heatsink is electrically grounded. A...
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US20090040715 |
SEMICONDUCTOR DEVICE
A semiconductor device of the present invention includes a wiring substrate, a plurality of semiconductor chips mounted on the wiring substrate, and a radiation plate arranged over a plurality of...
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US20090040724 |
POWER INVERTER
In a power inverter, a coolant passage is fixed to a chassis to cool the chassis; the chassis is divided into a first region and a second region by providing the coolant passage in the chassis; a...
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US20090040723 |
HEAT-DISSIPATING DEVICE WITH HIGH HEAT-DISSIPATING EFFICIENCY
A heat-dissipating device includes a housing, a partitioning member, a finned structure, and a high thermal-conductivity strip. The housing defines an inner space, and has a top surface formed with...
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US20090027856 |
BLADE COOLING SYSTEM USING WET AND DRY HEAT SINKS
An enclosure is disclosed. The enclosure comprises a chassis having a plurality of slots configured to hold a plurality of blades. At least one wet heat sink is positioned adjacent to each of the...
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US20090009968 |
Cooling device and electronic apparatus
According to one embodiment, a cooling device has a base substance formed in a plate form and having in its inside a channel through which a refrigerant circulates, and a flow mechanism that...
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US20090001372 |
Efficient cooling of lasers, LEDs and photonics devices
The present invention provides an optoelectronic device comprising a heat source and a heat transfer fluid. The present invention also provides a method of preparing an optoelectronic device, which...
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US20080314559 |
HEAT EXCHANGE STRUCTURE AND HEAT DISSIPATING APPARATUS HAVING THE SAME
A heat exchange structure is connected to a dual water cooling system and a heat dissipating apparatus has the heat exchange structure. The heat exchange structure includes a box as a main body,...
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