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US20090268404 |
ENERGY EFFICIENT APPARATUS AND METHOD FOR COOLING AN ELECTRONICS RACK
Apparatus and method are provided for cooling an electronics rack in an energy efficient, dynamic manner. The apparatus includes one or more extraction mechanisms for facilitating cooling of the...
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US20090122487 |
SYSTEM OF FACILITATING COOLING OF ELECTRONICS RACKS OF A DATA CENTER EMPLOYING MULTIPLE COOLING STATIONS
A cooling system and method are provided for cooling air exiting one or more electronics racks of a data center. The cooling system includes at least one cooling station separate and freestanding...
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US20090103266 |
COOLING SYSTEM EMPLOYING A HEAT EXCHANGER WITH PHASE CHANGE MATERIAL, AND METHOD OF OPERATION THEREOF
A heat exchanger for use, e.g., in a rear door of a server rack in a computer room, made up of pipes clad with a layer of a phase change material, such as a paraffin, so that latent heat is...
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US20090040722 |
HEAT DISSIPATION MODULE AND DETACHABLE EXPANSION CARD USING THE SAME
A heat-dissipation module dissipating heat for a heat-generating element on circuit board and including a heat-transferring base, a base, a first heat-dissipation unit, a heat pipe and a second...
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US20080307806 |
COOLING SYSTEM AND METHOD UTILIZING THERMAL CAPACITOR UNIT(S) FOR ENHANCED THERMAL ENERGY TRANSFER EFFICIENCY
A cooling system and method are provided which include a facility cooling unit, a cooling tower, and one or more thermal capacitor units. The facility cooling unit, which includes a heat...
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US20080298016 |
COOLING AN ELECTRONIC DEVICE UTILIZING SPRING ELEMENTS WITH FINS
A method for cooling an electronic device includes forming a spring structure by coupling a plurality of spring elements with a fin portion oriented at an angle, wherein a first end of the fin...
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US20080273306 |
SYSTEM AND METHOD OF FACILITATING COOLING OF ELECTRONICS RACKS OF A DATA CENTER EMPLOYING MULTIPLE COOLING STATIONS
A cooling system and method are provided for cooling air exiting one or more electronics racks of a data center. The cooling system includes at least one cooling station separate and freestanding...
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US20080174961 |
HYBRID COOLING SYSTEM FOR A MULTI-COMPONENT ELECTRONICS SYSTEM
A hybrid cooling system and method of fabrication are provided for a multi-component electronics system. The cooling system includes an air moving device for establishing air flow across at least...
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US20080110594 |
AIR/FLUID COOLING SYSTEM
The present invention is an air/fluid cooling system. In one embodiment an apparatus for dissipating heat from a heat-generating device includes a base having a first side configured for thermal...
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US20080043435 |
System for controlling the temperature of electronic devices
The system for controlling the temperature of electronic devices under test includes a housing, a seal, a heat-exchanger within the housing, and a Peltier module within the housing. The housing is...
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US20080011455 |
Composite heat-dissipating module
A composite heat-dissipating module includes a base, at least one fin unit, a stirring unit, and at least two horizontal air-feeding units. The base includes a top face, a bottom face, and a...
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