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US20090323280 |
ELECTRONIC APPARATUS
An electronic apparatus includes a housing and an airflow regulating device. The housing defines an accommodating space therein, and an air inlet that places the accommodating space in fluid...
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US20090290305 |
ENTRAINMENT HEATSINK USING ENGINE BLEED AIR
An entrainment heatsink system and method using distributed micro jets. Such a system and/or method utilize a pressurized primary flow through arrays of micro nozzles to entrain a much larger...
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US20090284920 |
COMBINATION HEAT SINK
A combination heat sink form of a stack of radiation fins is disclosed. Each radiation fin has retaining flanges at two opposite lateral sides for securing another radiation fin. Each retaining...
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US20090277604 |
DISPLAY UNIT AND VENDING MACHINE HAVING THE SAME
A display unit and a vending machine having the same. The display unit includes a display panel to display an image, a circuit board to control the display panel, a board bracket installed at a...
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US20090279251 |
HEAT DISSIPATION DEVICE WITH HEAT PIPE
A heat dissipation device is used for removing heat from at least two adjacent first and second electronic devices in a computer enclosure. The heat dissipation device includes a first heat sink...
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US20090257190 |
Cooling Structure for Electricity Storage Device
A cooling structure for an electricity storage device includes: a secondary battery ( 10 ) generating heat; a DC-DC converter ( 20 ) generating heat in a quantity different from that of secondary...
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US20090257191 |
Structural Support Module To Prevent Common Interface Deflection
A method and incorporated assembly is provided to enhance structural integrity and prevent interface deflection in a computer rack having a midplane and capable of housing a plurality of nodes. The...
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US20090251860 |
POWER-EFFICENT DATA CENTER
An illustrative power-efficient data center is described for operating in an uncontrolled environment in one scenario. The data center includes an air moving system that applies unconditioned air...
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US20090241578 |
Warm Floor Data Center
A data center cooling system includes a floor structure defining a below-floor warm-air plenum and an above-floor cool air plenum, a plurality of above-floor computer assemblies arranged to exhaust...
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US20090244838 |
Housing for an electronic unit
An electronic unit housing includes (i) a receiving space for receiving a printed circuit board, (ii) at least one foot, which is designed to fasten the electronic unit housing onto a base, and is...
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US20090237877 |
Storage subsystem
The storage subsystem is connected to an external device and comprises a storage device arrangement portion, on which a plurality of storage devices is arranged, and a control device that controls...
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US20090231807 |
Waterproof Ventilated Display Enclosure
A waterproof ventilated enclosure for housing equipment is disclosed having the ability to channel water thru the enclosure without touching the equipment and further with the ability to provide...
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US20090231808 |
Enclosure For Flat Panel Monitors
A device generally intended to be used for providing an enclosure for a wall-mounted flat panel monitor. The device comprises an enclosure with a front face angled to match the mounting angle of...
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US20090225510 |
RUGGEDIZED, SELF ALIGNING, SLIDING AIR SEAL FOR REMOVABLE ELECTRONIC UNITS
An electronics housing system (S) adapted for electronic devices (D) includes a main chassis unit (M) and at least one removable module ( 10 ) mountable with the base unit (M) for supporting...
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US20090213555 |
HEAT DISSIPATION DEVICE
A heat dissipation device, electrically connected to an intermittent power source, is used for dissipating heat generated by a heat-generating element on a circuit board. The heat dissipation...
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US20090213542 |
FLEX CIRCUIT ASSEMBLY WITH THERMAL ENERGY DISSIPATION
In accordance with various embodiments, a printed structure of a flex circuit assembly includes a plurality of adjacent land portions formed on a heat conductive stiffener member and which support...
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US20090207565 |
Ducted Air Temperature Sensor
A temperature isolation duct in a computer system comprising a chassis securing a circuit board and a fan system, wherein the fan system draws air through the chassis in an airflow direction, and a...
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US20090201639 |
CHASSIS OF PORTABLE ELECTRONIC APPARATUS
A chassis of a portable electronic apparatus includes a heat sink assembly disposed therein and carries a keyboard on the top. The chassis has an air inlet and an air outlet on a first surface on...
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US20090190307 |
DUCTED EXHAUST EQUIPMENT ENCLOSURE
An electronic equipment enclosure includes a frame structure at least partially enclosed by a plurality of panels defining a compartment in which one or more electronic components are mounted and...
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US20090190302 |
METHOD, APPARATUS AND COMPUTER SYSTEM FOR VORTEX GENERATOR ENHANCED COOLING
Some embodiments of a method, apparatus and computer system are described for vortex generator enhanced cooling. The computer system may include a housing and an apparatus. The apparatus may...
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US20090180250 |
PEAK-LOAD COOLING OF ELECTRONIC COMPONENTS BY PHASE-CHANGE MATERIALS
Cooling device for electronic components, in particular for power electronics in an aircraft, comprising an energy storage device which is in heat-conducting communication with at least one...
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US20090180251 |
MULTI-POSITION HOUSING MADE OF METAL EXTRUDED SECTION MEMBER FOR MANUFACTURING A WATERPROOF POWER ELECTRONIC DEVICE
The extruded section forms a tunnel that is substantially rectangular and is provided with fins on at least one side of the rectangle. The fins allow air to flow outside the housing by natural...
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US20090168330 |
ELECTRONIC DEVICE WITH AIRFLOW GUIDING DUCT
An electronic device includes an enclosure ( 30 ), a circuit board ( 40 ), and an airflow guiding duct ( 10 ). The enclosure includes a bottom wall ( 31 ) and a rear wall ( 32 ) perpendicular to...
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US20090168332 |
AIR MOVER FOR DEVICE SURFACE COOLING
Embodiments disclosed herein include an apparatus that includes an component capable of generating heat, an external wall with an interior surface, an air mover to be positioned to generate airflow...
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US20090166000 |
HEAT SINK WITH HEAT PIPES
A heat sink adapter for cooling an electronic component includes a lower plate, an upper plate, an upper fin set and a lower fin set respectively fixed on the upper plate and the lower plate, and a...
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US20090168344 |
THERMAL DEVICE WITH ELECTROKINETIC AIR FLOW
In some embodiments a thermal device such as a heat sink cools an electronic device. An electrokinetic airflow generating device uses a positively charged source and also uses at least a portion of...
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US20090147472 |
Means to Utilize Conduction-cooled Electronics Modules in an Air Cooled System
A means to utilize conduction-cooled VME electronics modules in an air cooled system is provided. Such means comprises a modified convection-cooled VME compatible chassis that includes a convection...
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US20090133852 |
COOLING APPARATUS FOR ELECTRONIC EQUIPMENT
A cooling apparatus for use in electronic equipment, being small in sizes and simple in the structures thereof, for achieving an increasing cooling capacity, comprises: a heat receiving member,...
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US20090134005 |
Oven Observing Equipment and Push-Out Ram Having the Same
An oven observing equipment capable of observing the inside of an oven turned to a high temperature precisely includes: a housing 13 having an intake part for cooling air, and a discharging part...
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US20090129011 |
Liquid cooled module
A thermal module is provided for absorbing and dissipating heat from a heat generating component. The module comprises a module body, input and output ports, and a channel disposed within the...
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US20090129000 |
INTER-RACK AIRFLOW ARRESTING APPARATUS AND METHOD FOR FACILITATING COOLING OF AN ELECTRONICS RACK OF A DATA CENTER
An airflow arrester is provided and configured to reside between electronics racks disposed in a row within a data center. The airflow arrester includes a panel, which when operatively disposed,...
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US20090129013 |
ELECTRONIC EQUIPMENT ENCLOSURE WITH EXHAUST AIR DUCT AND ADJUSTABLE FILLER PANEL ASSEMBLIES
An electronic equipment enclosure includes a frame structure, one or more enclosure panels mounted on the frame structure, an exhaust duct, and at least one adjustable filler panel assembly. The...
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US20090129012 |
METHOD AND APPARATUS FOR HEAT TRANSFER
A heat transfer apparatus for a memory module with a heat spreader that includes a channel being attachable on top of the memory module, and further includes attachment parts that are in thermal...
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US20090129016 |
AIRFLOW ARRESTING APPARATUS AND METHOD FOR FACILITATING COOLING OF AN ELECTRONICS RACK OF A DATA CENTER
An airflow arresting apparatus is provided configured to reside above an electronics rack within a data center. The apparatus includes an airflow arrester and a track mechanism. The airflow...
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US20090116186 |
Cooling unit and electronic apparatus
According to an aspect of an embodiment, a cooling unit includes a first heat dissipating fin member including first heat dissipating fins extending along parallel planes, respectively, the first...
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US20090103265 |
ELECTRONIC DEVICE
According to one embodiment, an electronic device includes a housing including an opening, a partition wall which partitions an interior part of the housing into a first chamber and a second...
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US20090080154 |
ELECTRO-OPTIC APPARATUS AND ELECTRONIC EQUIPMENT
An electro-optic apparatus includes an electro-optic panel, a wiring board, and an integrated circuit unit. The integrated circuit unit including a heat radiating member arranged so as to overlap...
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US20090073662 |
Weather cover for electronic equipment, use thereof for hanging on a mast tower, or mono-pole, and antenna carrier for weather cover
Weather cover for electronic equipment designed to be mounted on towers, hanged on masts, towers or mono-poles, which weather cover ( 10 ) comprises: a housing ( 1 ) that can be opened for service...
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US20090057879 |
STRUCTURE AND PROCESS FOR ELECTRICAL INTERCONNECT AND THERMAL MANAGEMENT
A structure and method for thermal management of integrated circuits. The structure for thermal management of integrated circuits includes first and second substrates bonded together, at least one...
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US20090056920 |
Cooling Apparatus and Electronic Device Comprising Same
A cooling apparatus comprises cover 4 equipped with pump body 1 , and a housing on which cover 4 is removably mounted. The housing includes a vent forming surface formed with a vent for...
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US20090059519 |
Air duct flow optimization device
A device adapted to optimize air duct flow in an electronic system including a printed circuit board configured to support one or more electronic components having various heights. The device...
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US20090046422 |
Protection structure for heat dispersing device of power supplier
The present invention includes a metal housing, a power input end, a power output end, and an accommodating space thereinside between the power input end and the power output end, the accommodating...
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US20090034187 |
PRESSURE-BASED FAN SPEED ADJUSTMENT
A system comprising a container adapted to house an electronic device. The system also comprises a fan adapted to transfer air between different portions of the container and pressure sensing logic...
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US20090027852 |
AIRFLOW REDIRCTION DEVICE
An air flow redirection device is disclosed. The air flow redirection device comprises a frame with a main hinge coupled to a top back edge of the frame. A plate is coupled to the main hinge and...
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US20090009963 |
Fastener and heat-dissipating device having the fastener
A fastener for a heat-dissipating device is adapted to secure a heat sink on a securing seat. The fastener includes a fastening arm having a plate body and a coupling member adapted to couple with...
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US20090009958 |
System and Method for Rack Mounted Information Handling System Supplemental Cooling
Thermal management for information handling systems is provided with a bypass cooling module that allows passive airflow from an exhaust aisle to a cooling aisle in a data center. A thermal...
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US20090002941 |
AIR-PERMEABLE, HYDROPHOBIC MEMBRANE USED IN A COMPUTER DEVICE
A mechanism to reduce liquid intrusion into an internal volume of a computer device. In some embodiments of the invention, air-permeable, hydrophobic means reduces an intrusion of liquid into a...
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US20090000766 |
Cooling Structure for Heat Generating Device
The disclosed embodiments relate to a system and method that is adapted to cool a heat generating device. An electronic device in accordance with an exemplary embodiment of the present invention...
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US20080310103 |
AIR BACKFLOW PREVENTION IN AN ENCLOSURE
An air backflow prevention member includes a frame assembly including a plurality of vanes and a plurality of stops. The plurality of vanes are rotatable between an open position, wherein the...
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US20080266789 |
Telecommunication cabinet with airflow ducting
A telecommunications cabinet in which active equipment can be mounted. The cabinet including an airflow ducting arrangement located in the interior region of the cabinet. The airflow ducting...
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