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US20120069337 OVERLAY/ALIGNMENT MEASUREMENT METHOD AND OVERLAY/ALIGNMENT MEASUREMENT APPARATUS  
According to one embodiment, a method includes preliminarily measuring the amount of overlay or alignment shift of the mark for overlay or alignment measurement while sequentially shifting a...
US20110238365 Diffraction Based Overlay Linearity Testing  
An empirical diffraction based overlay (eDBO) measurement of an overlay error is produced using diffraction signals from a plurality of diffraction based alignment pads from an alignment target....
US20130148120 OVERLAY MEASURING METHOD  
According to one embodiment, an overlay measuring method includes calculating a first symmetry center coordinate on a basis of reflected light from first and second overlay measurement marks...
US20130208279 IMAGE BASED OVERLAY MEASUREMENT WITH FINITE GRATINGS  
An image based overlay measurement is performed using an overlay target that includes shifted overlying gratings. The overlay target is imaged and an asymmetry is measured in the image of the...
US20090153862 TEST OBJECT USED FOR PROJECTING A SET OF MARKS TO INFINITY  
The collimated test object according to the invention is used for projecting to infinity a set of marks, the positions of which are very accurately known so as to be able to verify the alignment...
US20090153861 Alignment Method, Alignment System, and Product with Alignment Mark  
The position of a product is measured using an alignment mark on the product. Radiation is transmitted towards the alignment mark and diffracted by a pattern in the alignment mark. Position...
US20110129948 Optical alignment methods for forming LEDs having a rough surface  
A method of aligning a wafer when lithographically fabricating a light-emitting diode (LED). The method includes forming on the wafer at least one roughened alignment mark having a...
US20100309470 ALIGNMENT MARK ARRANGEMENT AND ALIGNMENT MARK STRUCTURE  
An alignment mark arrangement includes: a first alignment pattern comprising a plurality of parallel first stripes on a substrate, wherein each of the first stripes includes a first dimension; and...
US20120033215 MULTI-LAYER OVERLAY METROLOGY TARGET AND COMPLIMENTARY OVERLAY METROLOGY MEASUREMENT SYSTEMS  
A multi-layer overlay target for use in imaging based metrology is disclosed. The overlay target includes a plurality of target structures including three or more target structures, each target...
US20060152723 Complementary division mask having alignment mark, method for forming alignment mark of the complementary division mask, semiconductor device manufactured by using the complementary division mask, and its manufacturing method  
In fabrication of a semiconductor device having plural patterns on a plurality of layers by using complementary divided masks each having alignment marks distributed therein, because of the...
US20150219448 WAFER ALIGNMENT MARK SCHEME  
A wafer alignment apparatus includes a light source, a light detection device, and a rotation device configured to rotate a first wafer and a second wafer. The light source is configured to...
US20090195768 Alignment Mark and a Method of Aligning a Substrate Comprising Such an Alignment Mark  
An alignment mark comprising a periodic structure formed by mark lines is described. In an embodiment, the alignment mark is formed in a scribe lane of a substrate, the scribe lane extending in a...
US20130182255 OVERLAY MARK AND APPLICATION THEREOF  
An overlay mark for checking alignment accuracy between a former layer and a later layer on a wafer is described, including a former pattern as a part of the former layer, and a later pattern as a...
US20150002846 WAFER ALIGNMENT MARK SCHEME  
A wafer alignment apparatus includes a light source, a light detection device, and a rotation device configured to rotate a wafer. The light source is configured to provide light directed to the...
US20130107259 OVERLAY TARGET GEOMETRY FOR MEASURING MULTIPLE PITCHES  
An overlay target for use in imaging based metrology is disclosed. The overlay target includes a plurality of target structures including three or more target structures, each target structure...
US20150116686 EDGE-DOMINANT ALIGNMENT METHOD IN EXPOSURE SCANNER SYSTEM  
An edge-dominant alignment method for use in an exposure scanner system is provided. The method includes the steps of: providing a wafer having a plurality of shot areas, wherein each shot area...
US20120224176 Parallel Acquisition Of Spectra For Diffraction Based Overlay  
Spectra for diffraction based overlay (DBO) in orthogonal directions, i.e., along the X-axis and Y-axis, are acquired in parallel. A broadband light source produces unpolarized broadband light...
US20130258339 WAFER ALIGNMENT MARK SCHEME  
A wafer alignment apparatus includes a light source, a light detection device, and a rotation device configured to rotate a wafer. The light source is configured to provide light directed to a...
US20120008144 Method of Aligning a Substrate  
In a method of aligning a substrate, a first alignment mark and a second alignment mark in a first shot region on the substrate may be sequentially identified. The substrate may be primarily...
US20050286052 Elongated features for improved alignment process integration  
Improved integration of alignment or overlay and other processes. A substrate may have one or more alignment features, which may be included in alignment marks or overlay features. Elongated...
US20130182231 SUBSTRATE PLACEMENT IN IMMERSION LITHOGRAPHY  
A method for determining an offset between a center of a substrate and a center of a depression in a chuck includes providing a test substrate to the depression, the test substrate having a...
US20120050740 SUBSTRATE PLACEMENT IN IMMERSION LITHOGRAPHY  
A method for determining an offset between a center of a substrate and a center of a depression in a chuck includes providing a test substrate to the depression, the test substrate having a...
US20090141276 Scanning unit of a position measuring arrangement  
A scanning unit of a position measuring arrangement for scanning a measuring graduation of a scale. The scanning unit includes a base body including an interior space; wherein the base body can be...
US20140240706 OVERLAY SAMPLING METHODOLOGY  
A process of measuring overlay metrologies of wafers, the wafer having a plurality of patterned layers. The process begins with retrieving historical overlay metrologies from a database, and real...
US20090147237 Spatial Phase Feature Location  
Methods for locating an alignment mark on a substrate are described. Generally, the substrate includes one or more locator marks adjacent to a substrate alignment mark. Locator marks provide the...
US20100006029 Apparatus for aligning dispenser system, and dispenser alignment system  
An apparatus for aligning a dispenser includes a table having a first alignment mark, an alignment plate provided along at least one side of the table, at least one syringe supplying a dispensing...
US20110317163 Method of Aligning a Wafer and Method of Monitoring a Lithography Process Including the Same  
A method of aligning a wafer includes irradiating light onto a plurality of alignment marks of a wafer, detecting signals outputted from the alignment marks to obtain alignment position offsets,...
US20130044320 Self-Calibrated Alignment and Overlay Target and Measurement  
An alignment feature disposed on a substrate, the alignment feature including a first lithographic pattern having a first aggregate geometric center point defined by a first sub-pattern comprising...
US20100110434 Alignment for Edge Field Nano-Imprinting  
Systems and methods for alignment of template and substrate at the edge of substrate are described.
US20070188757 Method of sealing a glass envelope  
A method of sealing a glass package comprising providing a first glass substrate, the first substrate having first and second alignment marks. A second glass substrate having third and fourth...
US20150138555 OVERLAY METROLOGY SYSTEM AND METHOD  
Overlay metrology systems are provided which include, for instance: a first metrology pattern including at least two first pairs of sub-patterns, at least one sub-pattern lacking 90 degree...
US20060279735 Application of 2-dimensional photonic crystals in alignment devices  
Application of 2-Dimensional Photonic Crystals in Alignment Devices Alignment marks for use on substrates. In one example, the alignment marks consist of periodic 2-dimensional arrays of...
US20130258316 Tunable Wavelength Illumination System  
A lithographic apparatus has an alignment system including a radiation source configured to convert narrow-band radiation into continuous, flat and broad-band radiation. An acoustically tunable...
US20130293890 Overlay Targets with Orthogonal Underlayer Dummyfill  
The disclosure is directed to designing and using an overlay target with orthogonal underlayer dummyfill. According to various embodiments, an overlay target may include one or more segmented...
US20090116014 Determining Overlay Error Using an In-chip Overlay Target  
Overlay error between two layers on a substrate is measured using an image of an overlay target in an active area of a substrate. The overlay target may be active features, e.g., structures that...
US20060007442 Alignment marker and lithographic apparatus and device manufacturing method using the same  
An apparatus includes a first support structure configured to support an element that has an alignment marker provided with at least one height difference. The apparatus also includes an alignment...
US20100053617 ALIGNMENT MARKER, DISPLAY DEVICE USING THE SAME, AND FABRICATION METHOD THEREOF  
An alignment marker includes first marker element pieces for a first viewpoint and second marker element pieces for a second viewpoint different in plan shape. The first and second marker element...
US20100114522 PHOTOLITHOGRAPHY SYSTEMS AND ASSOCIATED ALIGNMENT CORRECTION METHODS  
Several embodiments of photolithography systems and associated methods of alignment correction are disclosed herein. In one embodiment, a method for correcting alignment errors in a...
US20100195102 IMPRINT LITHOGRAPHY  
A method of determining the location of a lithographic substrate relative to an imprint template is disclosed. The method includes positioning the substrate adjacent to the imprint template such...
US20140168648 ALIGNMENT DEVICE FOR EXPOSURE DEVICE, AND ALIGNMENT MARK  
This alignment device is furnished with an alignment light source for emitting alignment light, and is housed with a camera for example. The alignment light source emits alignment light, doing so,...
US20140240703 Overlay Sampling Methodology  
One embodiment relates to a method for overlay sampling. The method provides a number of fields over a semiconductor wafer surface. An inner subgroup of the number of fields includes fields in a...
US20050099628 Mark for position detection, mark identification method, position detection method, exposure method, and positional information detection method  
The present invention proposes a mark for position detection which can reliably detect a mark which is the subject of detection, even when a large number of marks of the same type are present in...
US20100097608 METHOD FOR DETERMINATION OF RESIDUAL ERRORS  
There is provided a method for determining residual errors, compromising the following steps: in a first step, a test plate comprising a first pattern is used, and in a second step, a test plate...
US20130148121 Device Manufacturing Method and Associated Lithographic Apparatus, Inspection Apparatus, and Lithographic Processing Cell  
Disclosed is a device manufacturing method, and accompanying inspection and lithographic apparatuses. The method comprises measuring on the substrate a property such as asymmetry of a first...
US20090130784 Method for determining the position of the edge bead removal line of a disk-like object  
A method for determining the position of an edge bead removal line of a disk-like object having an edge area and an alignment mark on the edge area is disclosed, wherein the edge area including...
US20110207565 METHODS AND APPARATUSES FOR ADJUSTING A VARIABLE SHEAVE PULLEY  
Pulley alignment apparatus for aligning pulleys when the operating position of a variable sheave pulley of a pulley system has changed is provided. The pulley alignment apparatus has an adjustable...
US20100079534 MARKING ELEMENT REGISTRATION  
A method of measuring a relative offset between a first array of marking elements and a second array of marking elements in a printer; a registration target; and a printer are provided. The method...
US20090225294 RETICLE FOR PROJECTION EXPOSURE APPARATUS AND EXPOSURE METHOD USING THE SAME  
In order to provide a reticle capable of increasing the number of chips per wafer and of enabling highly accurate alignment, and an exposure method using the reticle, a first alignment mark...
US20070035731 Direct alignment in mask aligners  
The invention relates to a method for aligning two flat substrates with one another, wherein each substrate has at least one aligning mark for mutual alignment, particularly for aligning a mask...
US20070292778 Methods of measuring critical dimensions and related devices  
A method of measuring a critical dimension may include forming an object pattern on a substrate and forming a plurality of reference patterns on the substrate, wherein each of the plurality of...

Matches 1 - 50 out of 146 1 2 3 >