Matches 1 - 37 out of 37


Match Document Document Title
US20140266278 PROBE NEEDLE  
A probe needle for connecting to a circuit board for inspection and to an inspection main board of a testing apparatus includes a conductive shaft having two ends of a connection end and an...
US20130271173 RHODIUM ALLOY WHICH HAS EXCELLENT HARDNESS, PROCESSABILITY AND ANTIFOULING CHARACTERISTICS AND IS SUITABLE FOR WIRE ROD FOR PROBE PINS  
The present invention is a rhodium alloy suitable for wire for a probe pin, the rhodium alloy comprising 30 to 150 ppm of Fe, 80 to 350 ppm of Ir and 100 to 300 ppm of Pt as additive elements, and...
US20130113512 PROBE BLOCK, PROBE CARD AND PROBE APPARATUS BOTH HAVING THE PROBE BLOCK  
The present invention provides a probe block, which comprises 1) a conductive base on which a first groove is formed, 2) a pair of signal transmitting probes which have dielectric covers and are...
US20080122464 Replaceable probe  
A replaceable probe to be used on a test feature includes a hollow probe body to house an elastic element and at least one needle inserting in the probe body. The needle presses the elastic...
US20050093559 Connection pin  
It is an object of the present invention to provide a connection pin for a probe card which measures electrical characteristics of a semiconductor device such as a LSI ship. The connection pin for...
US20110133767 SILVER ALLOY HAVING EXCELLENT CONTACT RESISTANCE AND ANTIFOULING PROPERTY AND SUITABLE FOR USE IN PROVE PIN  
The present invention is a silver alloy suitable for use in a probe pin made of an Ag—Cu alloy, wherein the silver alloy comprises 30 to 50% by weight of Cu and Ag as balance. This silver alloy...
US20140266280 PROBE CARD, PROBE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME  
A probe structure is disclosed which includes a metal needle, a soft insulative tube and a metal layer. The metal needle has a first end-portion and a second end-portion opposite to each other....
US20130006557 METHOD AND ARCHITECTURE FOR PRE-BOND PROBING OF TSVs IN 3D STACKED INTEGRATED CIRCUITS  
On-chip test architecture and design-for-testability methods for pre-bond testing of TSVs are provided. In accordance with certain embodiments of the invention, a die level wrapper is provided...
US20080309363 PROBE ASSEMBLY WITH WIRE PROBES  
Disclosed is a probe assembly for use in electrical testing of a testing object and a method of the probe assembly. The probe assembly has a probe supporter body having a first side surface and a...
US20060114008 Probe card for testing semiconductor element, and semiconductor device tested by the same  
An apparatus which reduces a contact resistance by appropriately overdriving a measuring probe of a probe card to ensure a stable contact pressure. The probe card comprises a measuring probe...
US20120319711 Probe Head Formation Methods Employing Guide Plate Raising Assembly Mechanism  
An assembly includes a lower guide plate having a first plurality of through-holes therein, and an upper guide plate over the lower guide plate. The upper guide plate includes a second plurality...
US20080122465 PROBE HOLDER FOR A PROBE FOR TESTING SEMICONDUCTOR COMPONENTS  
A probe holder in which the probe needle has a slight horizontal offset under the action of a vertical force comprises a probe holder for a probe needle, wherein the holder is adapted, for...
US20120126842 TEST PROBE  
A test probe for testing an object electrically includes a main body, a first probe pin mounted to and protruding out of the main body, and at least one second probe pin coupled to the main body....
US20110012634 Test probe  
A test probe is provided. The test probe includes a group of shielding boards and two probe pins. The group of shielding boards has two opposite surfaces. The group of shielding boards includes at...
US20080012595 Wafer test card using electric conductive spring as wafer test interface  
A wafer test card for testing the electric property of the chips on a wafer comprising a base board and a group of electric conductive springs or electric conductive spring pins connected to the...
US20080116926 SEMICONDUCTOR PROBE HAVING RESISTIVE TIP AND METHOD OF FABRICATING THE SAME  
Provided are a semiconductor probe having a resistive tip and a method of fabricating the semiconductor probe. The semiconductor probe includes a resistive tip which is doped with a first...
US20110316575 PIN ELECTRONICS CIRCUIT  
An I/O pin is connected to a DUT via a transmission line. A driver generates a test signal to be supplied to the DUT. A driver-side switch and an output resistor are arranged in series between the...
US20080290888 PROBE SUBSTRATE FOR TEST AND MANUFACTURING METHOD THEREOF  
A probe substrate includes a probe having a plurality of beams and a contactor formed at one end of the beam, and a support substrate for supporting the probe and having a bending space in which...
US20090140760 PROBE CARD  
The probe card includes a plurality of probes arranged on one surface side of a board. These probes belonging to any one of a first probe group including a plurality of probes contacting...
US20080116924 Device under test pogo pin type contact element  
A device under test pogo pin type contactor features an active head and an electronic component associated with the active head. A tip is spaced from the active head and a biasing device is...
US20100327894 Dual Tip Test Probe Assembly  
A dual tip test probe assembly for use in both cantilever and vertical probe applications includes first and second elongated test probes, each having a body portion and a tip portion with a tip...
US20060197542 Material for probe pins  
Probe pins related to the present invention are formed from a material which consists essentially of one or more elements selected from the group consisting of platinum, iridium, ruthenium,...
US20080061809 POGO PINS AND CONTACT-TYPE OF TEST DEVICE HAVING POGO PINS FOR TESTING SEMICONDUCTOR DEVICE  
A pogo pin of a contact-type of semiconductor test device will not be oxidized and will not damage of a solder ball of a semiconductor package when the pogo pin is brought into contact with the...
US20140091824 MECHANISM FOR FACILITATING A DYNAMIC ELECTRO-MECHANICAL INTERCONNECT HAVING A CAVITY FOR EMBEDDING ELECTRICAL COMPONENTS AND ISOLATING ELECTRICAL PATHS  
A mechanism is described for facilitating a dynamic electro-mechanical interconnect capable of being employed in a test system according to one embodiment. A method of embodiments of the invention...
US20080136429 Probe card of semiconductor test apparatus and method of fabricating the same  
A probe card of a semiconductor test apparatus includes a printed circuit board (PCB) in which a signal wiring and a first ground plate are provided, a needle fixture mounted at the PCB and...
US20100244875 SCRUB INDUCING COMPLIANT ELECTRICAL CONTACT  
The contact assembly having a contact member with a contact tip positioned within holes in a test socket or probe plate wherein the contact tip or the hole in the probe plate or test socket has a...
US20070152685 A PROBE ARRAY STRUCTURE AND A METHOD OF MAKING A PROBE ARRAY STRUCTURE  
Probe array structures and methods of making probe array structures are disclosed. A plurality of electrically conductive elongate contact structures disposed on a first substrate can be provided....
US20120086466 Semiconductor test probe apparatus and method  
An improved probe card system includes a probe assembly having a cantilever probe with a contact arm integral with and extending from a distal end of the probe, wherein the contact arm is oriented...
US20130106457 TEST PROBE FOR TEST AND FABRICATION METHOD THEREOF  
A method of fabricating a test probe includes a first conductive providing operation in which a first conductive member formed of a conductive metal material is provided, the first conductive...
US20070200585 Semiconductor wafer, semiconductor chip, semiconductor device, and wafer testing method  
A semiconductor wafer of the present invention includes switch circuits each connecting a corresponding internal circuit formed in the semiconductor chip and the test pad. The semiconductor wafer...
US20080290889 Method of destructive testing the dielectric layer of a semiconductor wafer or sample  
In a method of testing a semiconductor wafer or sample having a dielectric layer overlaying a substrate of semiconducting material, a contact is caused to touch a top surface of the dielectric...
US20100109692 APPARATUS, SYSTEM AND METHOD FOR TESTING ELECTRONIC ELEMENTS  
An electronic element testing apparatus for use with a number of probes. Each probe has a lower pole and an upper pole. The apparatus includes: a first plate having a first side and a second side,...
US20160363613 ETCHING FOR PROBE WIRE TIPS FOR MICROELECTRONIC DEVICE TEST  
Etching for probe wire tip is described particularly well suited to microelectronic device test. In one example, wires of a probe head are covered with an encapsulation material, the wires being...
US20160187384 VERTICAL PROBE DEVICE HAVING POSITIONING FILM  
A vertical probe device includes upper and lower dies having upper and lower installing holes, probe needles, a lower positioning film disposed between the dies and having lower positioning holes,...
US20160154024 INSPECTION UNIT  
An inspection unit includes: a metal block having at least a through hole; a ground bush disposed in the through hole, and being an electrically conductive body including: a cylindrical body part;...
US20120105089 SEMICONDUCTOR PACKAGE HAVING TEST PADS ON TOP AND BOTTOM SUBSTRATE SURFACES AND METHOD OF TESTING SAME  
A semiconductor package and testing method is disclosed. The package includes a substrate having top and bottom surfaces, a semiconductor chip mounted in a centrally located semiconductor chip...
US20110043235 SEMICONDUCTOR DEVICE HAVING A PLURALITY OF PADS  
A semiconductor device includes a plurality of sensor pads configured to receive a probe signal from a testing apparatus, and a plurality of normal pads configured to receive a driving signal to...

Matches 1 - 37 out of 37