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US20090300912 |
Flex Circuit Apparatus and Method for Adding Capacitance while Conserving Circuit Board Surface Area
An apparatus and a method for adding capacitance while conserving circuit board surface area. An apparatus for adding capacitance while conserving circuit board surface area includes a flex...
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US20090300911 |
METHOD OF MANUFACTURING WIRING SUBSTRATE AND CHIP TRAY
A method of manufacturing a wiring substrate comprises the steps of attaching a semiconductor chip to a chip positioning plate of a chip tray formed of silicon, executing wiring formation...
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US20090293271 |
PRINTED WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
A printed wiring board is manufactured by a method in which an alignment mark is formed in a metal foil, a bump is formed on the metal foil at a position determined based on the alignment mark, an...
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US20090294534 |
Structure including an electronic device for making a security document
The present invention provides a method of making a structure for making a security document and/or a document of value, or for making an article secure, the structure comprising at least one...
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US20090293272 |
METHOD FOR MANUFACTURING NONRECIPROCAL CIRCUIT DEVICE AND METHOD FOR MANUFACTURING COMPOSITE ELECTRONIC COMPONENT
A method for manufacturing a nonreciprocal circuit device in which a ferrite-magnet device including ferrite having first and second center electrodes arranged to intersect and be electrically...
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US20090295461 |
DEVICE CONFIGURATION
A process and apparatus for configuring one or more integrated circuits within a device in a manufacturing process is described. In an exemplary process, a device is manufactured by assembling a...
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US20090290317 |
PRINTED CIRCUIT BOARD, METHOD OF FABRICATING PRINTED CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE
A printed circuit board has capacitors, a grounding wiring pattern having a bonding surface on which a semiconductor device is bonded, and a contact surface located opposite from the bonding...
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US20090284942 |
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
A semiconductor device fabrication method includes: forming an elongated hole 5 in a wiring board plate along a perimeter line 3 of a plurality of wiring board regions defined over the wiring...
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US20090277005 |
Small Form Factor PCBA Process Carrier
A process carrier is capable of supporting printed circuit boards during manufacturing and testing. The process carrier includes a base plate, a first top plate and a second top plate. The base...
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US20090277274 |
POST ASSEMBLY AUTOMATIC ADJUSTMENT OF SAW BASED PRESSURE SENSOR PRELOAD
A method of manufacturing a pressure monitoring package comprises the steps of mounting a plurality of resonators onto a substrate 1, mounting the substrate 1 in a package base 11, ...
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US20090277681 |
EXPANSION CROSS-CONNECT ENCLOSURE
An expansion cross-connect enclosure is disclosed. The expansion cross-connect enclosure includes a housing having a front, a rear, a top, a bottom, and left and right sides, the housing having a...
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US20090273910 |
Functional Unit And Method For The Production Thereof
The present invention relates to a functional unit, containing at least one active or passive electronic component, the functional unit being surrounded by at least one flexible dielectric layer...
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US20090274334 |
Mounting Method and Holder for SMD Microphone
A SMD microphone holder has an SMD microphone mounted within, and includes a cap body and cylindrical portion. The cap body is withstands a reflow temperature, and defines a cavity for mounting the...
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US20090271980 |
METHOD FOR CONTROLLING WARPAGE IN REDISTRIBUTED CHIP PACKAGING PANELS
A method is disclosed for controlling warpage in an integrated electronic panel assembly including a plurality of die embedded within an encapsulant. The method comprises determining a number of...
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US20090272567 |
ELECTRONIC DEVICE AND METHOD FOR MAKING THE SAME
An electronic device includes: first and second electronic parts, each of which has a conductive contact; and a plurality of first and second conductive filaments formed on the conductive contacts...
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US20090271981 |
METHOD OF FABRICATING A DEVICE WITH FLEXIBLE SUBSTRATE AND METHOD FOR STRIPPING FLEXIBLE-SUBSTRATE
A method for fabricating a device with a flexible substrate includes providing a rigid substrate at first. Next, an interfacing layer can be formed on the rigid substrate, and then a flexible...
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US20090265928 |
Circuit board and manufacturing method thereof
A circuit board may have a metal land supporting a pillar. The pillar may be fabricated by half-etching the metal land. An insulating layer may be provided on the circuit board so that the pillar...
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US20090266596 |
PRINTED CIRCUIT BOARD WITH EMBEDDED ELECTRONIC COMPONENTS AND METHODS FOR THE SAME
The present invention discloses a printed circuit board. The printed circuit board is made by the method of providing a substrate; forming a first circuit on the substrate; depositing a thin film...
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US20090267224 |
CIRCUIT DEVICE INCLUDING ROTATED STACKED DIE
In a particular embodiment, a circuit device includes a first die coupled to a circuit substrate and having a substantially planar surface. The first die includes electrical contacts distributed on...
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US20090250254 |
METHODS FOR CONFIGURABLE MANUFACTURING AND APPARATUS
A method of manufacturing industrial controls includes partially assembling a pre-product at a first stage in manufacturing, including at least partially populating a printed circuit board with...
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US20090249619 |
OVERMOLDED ELECTRONIC MODULE WITH AN INTEGRATED ELECTROMAGNETIC SHIELD USING SMT SHIELD WALL COMPONENTS
An electronic module with an integrated electromagnetic shield using surface mount shield wall components has been disclosed. Each surface mount shield wall component provides side shielding of the...
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US20090244865 |
METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD
A method for manufacturing a multilayer printed wiring board having an electronic component housed therein includes forming a first conductor circuit on a first surface of a substrate. A first...
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US20090242457 |
ELECTRONIC COMPONENT ORIENTATION FOR ASSEMBLY TO CIRCUIT BOARDS
Loading a component carrier strip carrying a series of discrete components to be assembled onto circuit boards is accomplished by first inserting a free end of the component carrier strip into a...
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US20090238954 |
LARGE AREA THIN FILM CAPACITORS ON METAL FOILS AND METHODS OF MANUFACTURING SAME
Disclosed are a method of making a dielectric on a metal foil, and a method of making a large area capacitor that includes a dielectric on a metal foil. A dielectric precursor layer and the base...
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US20090231798 |
Method and housing for memory module including battery backup
A device may include protective housing including a battery backup unit circuit, at least one L-hook disposed on the protective housing including a battery backup unit circuit, the L-hook...
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US20090233467 |
Circuit board connector assembly and method for assembling such an assembly
A circuit board connector assembly mounted in a housing and method of mounting are described. The assembly has orthogonal first and second circuit boards (CB). The CB has a CB connector containing...
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US20090229122 |
ANALYTE SENSORS AND METHODS
A sensor, and methods of making, for determining the concentration of an analyte, such as glucose, in a biological fluid such as blood or serum, using techniques such as coulometry, amperometry,...
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US20090225526 |
SYSTEM AND METHOD FOR MOUNTING SHIELDED CABLES TO PRINTED CIRCUIT BOARD ASSEMBLIES
Methods and apparatus are provided for securely and cost effectively attaching one or more shielded cables to a planar substrate. A cable assembly includes a printed circuit board (PCB) coupled to...
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US20090217516 |
Method for Producing Optoelectronic Components, and Products Produced Thereby
The invention relates to the production of optoelectronic components, optical components being mounted in the composite wafer. Provided to this end is a method for producing optoelectronic...
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US20090219720 |
LIGHTING
Lighting assemblies with light sources are disclosed for use in place of fluorescent lights. A support member can be attached to brackets, which can snap into a spring lampholder brackets used for...
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US20090217515 |
ELECTRONIC COMPONENT PRODUCTION METHOD AND ELECTRONIC COMPONENT PRODUCTION EQUIPMENT
Manufacturing an electronic component 5 in which an interposer 50 is bonded to a base circuit sheet includes a base circuit forming step for forming a base-side terminal in a continuous base...
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US20090218121 |
METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, AND ELECTRONIC APPARATUS
A method for manufacturing a printed circuit board. The method includes: preparing a printed wiring board, the printed wiring board comprising through holes and a plurality of electrode pads;...
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US20090217518 |
DEVICE-INCORPORATED SUBSTRATE AND METHOD OF MANUFACTURING THEREOF AS WELL AS PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THEREOF
A device-incorporated substrate and a method of manufacturing a device-incorporated substrate, as well as a printed circuit board and a method of manufacturing a printed circuit board in which a...
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US20090218118 |
BOARD AND MANUFACTURING METHOD FOR THE SAME
A board includes a core board, an electronic component arranged on the core board, and an intermediate layer that includes resin containing carbon fibers and that surrounds the electronic component...
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US20090217517 |
Laser-based technique for the transfer and embedding of electronic components and devices
A laser direct write method used to transfer entire single components such as semiconductor bare dies or surface mount passive and active components on a substrate or inside recess in a substrate...
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US20090211355 |
Heated Hot-Film Air-Mass Sensor
To determine air mass flows, especially for controlling internal combustion engines, a hot-film air-mass sensor is provided, which may be used especially for sensing air mass flows in the intake...
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US20090211794 |
Wiring board and manufacturing method therefor
In order to provide a wiring board having a structure different from a conventional structure and a manufacturing method therefor, a wiring board ( 1 ) includes: a first principal surface ( 6 a );...
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US20090211086 |
ELECTRONIC COMPONENT MOUNTING METHOD AND ELETRONIC COMPONENT AND MOUNTING APPARATUS
The invention is directed to prevention of interference of an operation of mounting proper electronic components and improvement of usability without reduction of a manufacturing speed of printed...
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US20090211791 |
SUBSTRATE FORMED ON CARRIER HAVING RETAINING FEATURES AND RESULTANT ELECTRONIC DEVICE
A method for forming an electronic device on a flexible substrate conditions at least one surface of a carrier to form at least one retaining feature on the surface for retaining a flexible...
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US20090199399 |
METHOD FOR MANUFACTURING BOARD WITH BUILT-IN ELECTRONIC ELEMENTS
A method for manufacturing a board with a built-in electronic element, includes providing a support substrate including a support base and a metal foil, forming a protective film made of a metal...
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US20090200779 |
Ignition Device, Method for Producing the Same, Gas Generator for Air Bag and Gas Generator for Seat Belt Pretensioner
The invention provides an ignition device which is produced without reducing its productivity, while being compact in size and enabling electric current securely to flow through electric circuits...
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US20090200064 |
Method for mounting an electronic component on a preferably soft support, and resulting electronic entity, such as a passport
Method for mounting an electronic component, such as a silicon chip, on a support which consists in: providing an electronic component ( 40 ) having connection pads, whereof one predetermined pad (...
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US20090200073 |
PRINTED WIRING BOARD WITH CAPACITOR
A printed wiring board includes a capacitor including a dielectric body having a first surface and a second surface, a first electrode provided on the first surface of the dielectric body, and a...
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US20090202142 |
CIRCUIT BOARD, METHOD FOR TESTING CIRCUIT BOARD, AND METHOD FOR MANUFACTURING CIRCUIT BOARD
A circuit board according to the present invention comprises an insulating layer, a first electronic component mounted on the insulating layer, and a solder marker provided on the insulating layer....
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US20090196009 |
Semiconductor module, wiring board , and wiring method
A semiconductor module includes a plurality of rectangular shaped semiconductor devices which are arranged in two rows such that each pair of adjacent semiconductor devices is in orientations...
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US20090189949 |
METHOD FOR ARRANGING PRINT HEAD CHIPS
A method for arranging print head chips, includes: (a) setting a first fiducial mark and a second fiducial mark on a PCB for determining coordinate positions of a plurality of array units that are...
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US20090188703 |
MULTILAYER WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
A multilayer wiring board includes a multilayer wiring substrate having a concave portion which accommodates an electronic component. The multilayer wiring substrate has multiple insulation layers,...
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US20090185357 |
THREE-DIMENSIONAL LIQUID CRYSTAL POLYMER MULTILAYER CIRCUIT BOARD INCLUDING MEMBRANE SWITCH AND RELATED METHODS
An electronic device includes a multilayer circuit board having a non-planar three-dimensional shape defining a membrane switch recess therein. The multilayer circuit board may include at least one...
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US20090183364 |
METHOD OF CONNECTING A SERIES OF INTEGRATED DEVICES UTILIZING FLEXIBLE CIRCUITS IN A SEMI-STACKING CONFIGURATION
A method of serially connecting devices utilizing flexible circuits in a semi-stacking configuration includes positioning a first flexible circuit on a carrier, the first flexible circuit includes...
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US20090185393 |
LIGHT SOURCE MODULE, METHOD OF FABRICATING THE SAME, AND DISPLAY DEVICE HAVING THE LIGHT SOURCE MODULE
A light source module includes a mounting substrate including at least two exposed metal lines, a light-emitting diode (LED) including two electrodes disposed corresponding to the at least two...
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