Matches 1 - 50 out of 159 1 2 3 4 >


Match Document Document Title
US20120159775 PICK-UP JIG  
A pick-up jig is adapted to be dismountably mounted to an electronic component which has two buckling blocks. The pick-up jig includes a pick-up board and two buckling arms. The pick-up board is...
US20140237815 STIFFENER FRAME FIXTURE  
Methods and apparatus for coupling a stiffener frame to a circuit board are disclosed. In one aspect, an apparatus for engaging a stiffener frame and a circuit board positioned in a fixture is...
US20080251707 OPTICAL CHASSIS, CAMERA HAVING AN OPTICAL CHASSIS, AND ASSOCIATED METHODS  
A camera including a mount substrate, a detector on a first surface of the mount substrate, a spacer on the mount substrate, the spacer including a hole exposing the detector, a cover on the...
US20150181778 MOUNTING SYSTEM  
A mounting system which mounts an LED element on a board and mounts a lens so as to cover the LED element, in which control devices which control operations of operating machines include an LED...
US20110214282 ACTUATOR FOR MAINTAINING ALIGNMENT OF DIE DETACHMENT TOOLS  
A die detachment apparatus for detaching a die from an adhesive tape on which the die is mounted includes a pick-and-place tool movable along a pick-up axis for picking up the die from the...
US20130255079 METHOD AND ARRANGEMENT FOR ATTACHING A CHIP TO A PRINTED CONDUCTIVE SURFACE  
A chip is attached to a printed conductive surface. The chip is first heated to a first temperature, which is lower than what the chip can stand without being damaged by the heat. The heated chip...
US20090049680 COMPONENT MOUNTER CONTROL METHOD AND COMPONENT MOUNTER  
The present invention is a method of controlling a component mounter which includes a mobile unit for mounting a component onto a circuit board, and includes judging (S1) on which side of the...
US20090070992 Pick And Place System For A Semiconductor Mounting Apparatus  
A semiconductor mounting apparatus contains a pick and place system having a bonding head, which has a first drive system and a second drive system for displacing the bonding head in a...
US20100058580 Stacking Integrated Circuits containing Serializer and Deserializer Blocks using Through Silicon Via  
Methods and systems for stacking multiple chips with high speed serialiser/deserialiser blocks are presented. These methods make use of Through Silicon Via (TSV) to connect the dice to each other,...
US20150074994 PARTS MOUNTING SYSTEM AND PARTS MOUNTING METHOD  
A parts mounting system includes: a parts checking section that detects parts information which is identification information applied to the electronic parts and includes a parts code for...
US20100095519 APPARATUS FOR MANUFACTURING WIRELESS COMMUNICATION DEVICE  
A method for manufacturing antenna elements for use with wireless communication devices comprises a number of cutting techniques that allow the size of the antenna elements to be adjusted. Rollers...
US20150089805 CHIP JOINING BY INDUCTION HEATING  
Methods and apparatus for joining a chip with a substrate. The chip is moved by with a pick-and-place machine from a first location to a second location proximate to the substrate over a first...
US20150201537 CHIP ATTACH FRAME  
A chip attach frame is used to align pins of an integrated circuit chip with pads on a chip carrier. A frame block has a socket defining two alignment edges that form a reference corner. The chip...
US20150059166 CHIP ATTACH FRAME  
A chip attach frame is used to align pins of an integrated circuit chip with pads on a chip carrier. A frame block has a socket defining two alignment edges that form a reference corner. The chip...
US20090035890 TECHNIQUES FOR DIRECT ENCASEMENT OF CIRCUIT BOARD STRUCTURES  
A technique for processing an electronic apparatus (e.g., manufacturing an assembled circuit board, treating an assembled circuit board, etc.) involves applying encasement material to an area of...
US20100072921 Lighting System Utilising RJ45 Patch Lead  
A luminaire has an aluminium body with an opening extending longitudinally therethrough from a front face from which, in use, light is emitted, and a rear face to which, in use, a power coupler is...
US20100024207 SURFACE-MOUNT TECHNOLOGY NOZZLE  
AN SMT nozzle is provided for picking up an SMD. The nozzle includes a suction portion and a supporting arm extending from a side of the suction portion. The suction portion forms an engaging end...
US20090021277 DEVICE AND METHOD FOR REPARING A MICROELECTROMECHANICAL SYSTEM  
A novel device and method for repairing MEMS systems, including probe cards for use in semiconductor testing is disclosed. In one embodiment, a probe card for use with a diagnostic computer for...
US20070289125 Component Mounting Head, Suction Nozzle, and Suction Nozzle Manufacturing Method  
A suction-and-holding face (14) for a component (1) in a suction nozzle (3) is formed from a semiconductor ceramic so that the suction-and-holding face to be brought into direct contact with the...
US20150033555 COMPONENT MOUNTING METHOD AND COMPONENT MOUNTING DEVICE  
A component mounting method includes: detecting feeder ID information of a parts feeder, which individually specifies a parts feeder, after a second parts feeder is attached to an attaching...
US20080313890 COMPONENT MOUNTER AND COMPONENT SUPPLY METHOD  
A component mounter includes a board transfer rail for positioning a board at a predetermined position on a base, and a transfer head for picking up a component supplied and mounting it on the...
US20070130755 Electronics assembly machine with embedded solder paste inspection  
A pick and place machine includes a placement head configured to releasably grasp a component for placement. A robotic system is coupled to the placement head to generate relative movement between...
US20060150400 Component placement machine as well as a method for transporting printed circuit boards  
A component placement machine with a frame and with a transport device for transporting printed circuit boards in an X-direction as well as a method for transporting printed circuit boards whereby...
US20080250636 Component Mounting Method and Apparatus  
Reference marks arranged at specified intervals on a glass board are recognized, and from its recognition results, offset values for individual areas matching the board size are determined as...
US20090249615 COMPONENT SUPPLY UNIT AND SURFACE MOUNTER  
It is intended to allow for readily performing a cover tape setting operation. In the present invention, a tape guide 110 for guiding a component supply tape 35 includes a front guide section 120...
US20080201940 APPARATUS AND METHOD FOR MOUNTING ELECTRONIC COMPONENT  
The invention prevents reduction of a pickup rate even when a storage tape in use and a new storage tape are connected to each other with a connection tape. A component recognition camera takes an...
US20100043215 CLAMP ASSEMBLY FOR AN ASSEMBLER FOR ASSEMBLING PRINTHEAD INTEGRATED CIRCUITRY ON A CARRIER  
The invention provides for a clamp assembly for an assembler for assembling printhead integrated circuits on a carrier. The assembler has an enclosure with a support assembly for operatively...
US20070107205 Device and method for linking microchip modules with antennas  
An apparatus and a method for joining microchip modules to antennas (18) which are arranged on at least one first support (1) for producing transponders. in particular smart labels. for...
US20110233791 METHOD FOR PERFORMING PARALLEL STOCHASTIC ASSEMBLY  
A method of positioning at least 2 chips simultaneously on a substrate by parallel stochastic assembly in a first liquid is disclosed. In one aspect, the chips are directed to target sites on the...
US20100107405 Die-Ejector  
A die ejector comprises a chamber which can be subjected to vacuum and comprises a cover plate having a hole, a plurality of plates which are arranged in the interior of the chamber, protrude into...
US20080250630 Back-up table for chip mounter  
A back-up table for a chip mounter. The back-up table for a chip mounter includes a base plate, a back-up plate spaced a predetermined distance from the base plate to support a back-up pin that...
US20060123627 Method for moving at least two elements of a placement machine as well as such placement machine  
A method and placement device are provided for moving at least two elements in and opposite to a predetermined direction. The second element is simultaneously moved by means of the first element....
US20090044401 COMPONENT MOUNTING CONDITION DETERMINATION METHOD  
A component mounting condition determination method is used in a component mounter of mounting components onto a board using a mounting head having plural suction nozzles, and includes: a maximum...
US20100043214 INTEGRATED CIRCUIT DICE PICK AND LIFT HEAD  
The invention provides for a dice pick and lift head for an assembler for assembling printhead integrated circuitry on a carrier. The assembler includes an enclosure with a support assembly for...
US20060236530 Device for assembling substrates with electronic components  
The present invention relates to a picking arm which may be displaced along a stationary longitudinal guide. A picking head for electrical components may be displaced along a transverse guide on...
US20090056114 NOZZLE MECHANISM, MOUNTING HEAD AND ELECTRONIC COMPONENT MOUNTING APPARATUS  
In an electronic component mounting apparatus, nozzle mechanisms are formed slender by providing shaft-type linear motors vertically upward of nozzle units and providing linear encoders vertical...
US20050115062 Chip assembling structure and socket  
The present invention relates to the design of a chip assembling structure and socket, namely a chip assembling structure that allows various semiconductor chips, which contain multiple contacts...
US20150200118 BONDING APPARATUS AND METHOD  
A bonding apparatus includes a wafer stage, a first chip stage, a first transporting device, a second stage and a second transporting device. The wafer stage is used for holding a wafer. The first...
US20080309260 Shaft Type Linear Motor, Mounting Head and Component Mounting Device With the Linear Motor, and Position Detection Method for Shaft for Driving the Linear Motor  
A shaft type linear motor including a stator in which plural hollow cylindrical coils are disposed so that the center through holes thereof are arranged linearly so as to form a shaft insertion...
US20090144968 Pick-Up Tool And Method For Grasping And Mounting Small Dies  
A pick-up tool for gripping a die comprises a sleeve and a gripping member. The sleeve has a longitudinal bore extending in the longitudinal direction in which the gripping member is inserted. The...
US20080301930 Apparatus for Manufacture of electronic Assemblies  
A electronic apparatus manufacturing cell defining an electronic apparatus manufacturing cell envelope having a first side and having a second side opposite the first side. According to one...
US20080149265 Applicator for electrical or electronic components  
Stock having printed circuits thereon is conveyed in a transport plane by a conveying device, and electronic components carried by a transfer belt are transferred to the stock under pressure...
US20080263856 Tape feeder for chip mounter  
A tape feeder for a chip mounter is provided. The tape feeder includes a frame, a first link, a second link, and a middle link. A tape is fed along the frame. The first link includes a guide unit...
US20120288996 METHODS AND APPARATUS FOR APPLYING AN ADHESIVE TO A CIRCUIT BOARD  
Methods and apparatus for curing an adhesive on a circuit board are disclosed. In one aspect, a method of manufacturing is provided that includes isolating a first portion of a surface of a...
US20090229118 Electronics Assembly Machine with Wireless Communication Nozzle  
A pick and place machine for placing components upon a workpiece includes a placement head, a robotic system and at least one detachable nozzle. The robotic system is configured to generate...
US20080247143 CHIP MOUNTING APPARATUS AND CHANGING METHOD FOR SEPARATION FACILITATION HEAD IN CHIP MOUNTING APPARATUS  
In a chip mounting apparatus, a structure is employed that a separation facilitation head keeping part is provided for detachably keeping a plurality kinds of separation facilitation heads in a...
US20090133247 APPARATUS FOR PACKAGING A TAPE SUBSTRATE  
An apparatus for packaging a tape substrate is provided. The apparatus includes a plurality of robotic arms, a plurality of clamping elements attached to the robotic arms, a memory having a...
US20080005894 Component Mounting Apparatus And Method For Determining Component Holding Members  
For determining the types of component holding members equipped to a plurality of holding-member equipping sections, a detection sensor having a detection optical axis in a direction intersecting...
US20120015458 MOUNTING APPARATUS AND MOUNTING METHOD  
Provided is a mounting apparatus which mounts a chip component on a circuit pattern on a circuit board having a plurality of circuit patterns formed thereon. The mounting apparatus is provided...
US20140053398 ELECTRONIC COMPONENT MOUNTING LINE AND ELECTRONIC COMPONENT MOUNTING METHOD  
Disclosed is an electronic component mounting line on which a substrate undergoes solder paste printing, electronic component placements, and then reflow, while being moved from upstream to...

Matches 1 - 50 out of 159 1 2 3 4 >