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US20090261467 |
Semiconductor device
A semiconductor device including a semiconductor chip having a plurality of electrodes on one surface thereof in a thickness direction, a resin layer overlapping the one chip surface to provide a...
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US20090261482 |
SEMICONDUCTOR PACKAGE AND METHOD OF MAKING SAME
A semiconductor package ( 20 ) includes an organic substrate ( 24 ) and a semiconductor die subassembly ( 22 ). A method ( 50 ) for making the semiconductor package ( 20 ) entails providing ( 52 )...
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US20090108472 |
WAFER-LEVEL UNDERFILL PROCESS USING OVER-BUMP-APPLIED RESIN
A process of fabricating wafer-level underfilled microelectronic packages using over-bump application of a self-fluxing resin to a wafer, b-staging of the resin, dicing of the coated wafer, and...
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US20090108440 |
SEMICONDUCTOR DEVICE
A semiconductor device is disclosed. One embodiment provides an arrangement of a plurality of semiconductor chips arranged side by side in a spaced apart relationship. A first material fills at...
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US20090065953 |
Chip module and a fabrication method thereof
A chip module and a fabricating method thereof are provided. Firstly, a substrate is provided. Next, a chip is assembled on the substrate and electrically connected with the substrate. Afterward, a...
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US20090008802 |
FLEXIBLE CARRIER FOR HIGH VOLUME ELECTRONIC PACKAGE FABRICATION
An assembly for producing partially packaged semiconductor devices is provided. In one embodiment, the assembly includes a magnetic plate; a flexible substrate disposed adjacent the magnetic plate...
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US20080265438 |
LIQUID EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
A liquid epoxy resin composition comprising (A) a liquid epoxy resin, (B) a curing agent, (C) an inorganic filler, (D) a hygroscopic agent, and optionally, (E) a fluxing agent has the advantages of...
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US20080164593 |
METHOD OF PACKAGING SEMICONDUCTOR DEVICES
A method of packaging a semiconductor includes providing a support structure. An adhesive layer is formed overlying the support structure and is in contact with the support structure. A plurality...
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