Matches 1 - 4 out of 4
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US20090203209 Semiconductor device and method of manufacturing the same  
A semiconductor device which is capable of avoiding an increase in pattern ratio and allowing wiring dummy patterns to improve global steps developed by CMP upon insertion of the dummy patterns...
US20090170305 METHOD FOR IMPROVING ELECTROMIGRATION LIFETIME FOR CU INTERCONNECT SYSTEMS  
A method for forming a single damascene and/or dual damascene interconnect structure, comprising: performing front end processing, depositing copper, annealing the copper, performing CMP...
US20090108431 Inverted package-on-package (POP) assemblies and packaging methods for integrated circuits  
Integrated circuit package assemblies and packaging methods are provided. An integrated circuit package assembly includes a first circuit package including a first substrate having a top surface...
US20080042177 Image sensor and method of fabricating the same  
In one embodiment, the method includes forming a first dielectric layer over a substrate, and removing a portion of the first dielectric layer over a photoactive region of the substrate to form a...
Matches 1 - 4 out of 4