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US20090087989 POLISHING LIQUID AND POLISHING METHOD USING THE SAME  
The invention provides a polishing liquid used for chemical mechanical polishing during planarization of a semiconductor integrated circuit, having at least: a benzotriazole compound (A)...
US20080265420 METHOD OF FORMING A FULLY SILICIDED SEMICONDUCTOR DEVICE WITH INDEPENDENT GATE AND SOURCE/DRAIN DOPING AND RELATED DEVICE  
A method of forming a fully silicided semiconductor device with independent gate and source/drain doping and related device. At least some of the illustrative embodiments are methods comprising...
US20080182413 SELECTIVE CHEMISTRY FOR FIXED ABRASIVE CMP  
Methods and compositions for planarizing a substrate surface with selective removal rates and low dishing are provided. One embodiment provides a method for selectively removing a dielectric...
US20080171441 Polishing compound and method for producing semiconductor integrated circuit device  
In polishing of a surface to be polished in production of a semiconductor integrated circuit device, it is possible to obtain a flat surface of an insulating layer having an embedded metal wiring....
US20080171440 Pre-polishing treatment solution for interconnect substrate, polishing method, and method and apparatus for manufacturing interconnect substrate  
A pre-polishing treatment solution has a prominent corrosion inhibiting effect, and can be used in pre-polishing treatments for interconnect substrates. The pre-polishing treatment solution...
US20080026583 COMPOSITIONS AND METHODS FOR MODIFYING A SURFACE SUITED FOR SEMICONDUCTOR FABRICATION  
The disclosure pertains to compositions and methods for modifying or refining the surface of a wafer suited for semiconductor fabrication. The compositions include working liquids useful in...
Matches 1 - 6 out of 6