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US20100003767 |
MAGNETIC TUNNEL JUNCTION DEVICE, MEMORY CELL HAVING THE SAME, AND METHOD FOR FABRICATING THE SAME
A method for fabricating a magnetic tunnel junction device includes forming an insulation layer having a plurality of openings, forming a first electrode over the bottom and the sidewall of an...
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US20100001310 |
LIGHT EMITTING DIODE AND MANUFACTURING METHOD THEREOF
An exemplary light emitting diode (LED) includes a substrate, a LED chip and an encapsulation unit. The encapsulation unit includes a first encapsulation material located over the LED chip and a...
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US20100001724 |
IC Microfluidic Platform With Integrated Magnetic Resonance Probe
An integrated hybrid microfluidic-IC platform for single cell manipulation and microscopy and method for making the platform. In particular, the integrated platform can incorporate a planar...
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US20100001356 |
MAGNETIC MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME
A magnetic memory device and a method for manufacturing the same are disclosed. The magnetic memory device includes a plurality of gates formed on a semiconductor substrate, a source line connected...
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US20100003786 |
CHIP-LEVEL UNDERFILL PROCESS AND STRUCTURES THEREOF
A process comprises forming a first electrical interconnect structure on a surface of a singulated semiconductor chip having an alignment pattern. The alignment pattern is scanned and stored in a...
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US20100002563 |
MEDIA WITH TETRAGONALLY-STRAINED RECORDING LAYER HAVING IMPROVED SURFACE ROUGHNESS
A media for storing information comprises a substrate, a conductive layer formed over the substrate, and a ferroelectric layer epitaxially formed on the conductive layer. The ferroelectric layer...
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US20100001176 |
OPTICAL DIE WITH VARIABLE REFRACTIVE INDEX, CORRECTIVE OF NEGATIVE DISTORTION, AND METHOD OF FABRICATING SUCH A DIE
An optical die, which is intended to be placed in front of an optical sensor of a semiconductor component, has an optically useful zone having an optical axis and exhibiting a variable refractive...
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US20100001379 |
Multi-chip package (MCP) having three dimensional mesh-based power distribution network, and power distribution method of the MCP
A MCP includes a plurality of semiconductor memory devices, the plurality of semiconductor memory devices being stacked to define a three-dimensional (3D) structure, and a mesh structure, the mesh...
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US20100003806 |
DETERMINISTIC GENERATION OF AN INTEGRATED CIRCUIT IDENTIFICATION NUMBER
The generation of an identification number of a chip supporting at least one integrated circuit, including the step of causing a cutting of at least one conductive section by cutting of the chip...
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US20100002501 |
MRAM Device Structure Employing Thermally-Assisted Write Operations and Thermally-Unassisted Self-Referencing Operations
A thermally-assisted MRAM structure which is programmable at a writing mode operating temperature is presented and includes an anti-ferromagnet, an artificial anti-ferromagnet, a barrier layer, and...
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US20100001410 |
FLIP CHIP OVERMOLD PACKAGE
An integrated circuit (IC) package having a packaging substrate, an IC disposed onto the packaging substrate, and a rigid support member attached to the substrate layer through an adhesive spacer...
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US20090321947 |
SURFACE DEPRESSIONS FOR DIE-TO-DIE INTERCONNECTS AND ASSOCIATED SYSTEMS AND METHODS
Stacked microelectronic dies employing die-to-die interconnects and associated systems and methods are disclosed herein. In one embodiment, a stacked system of microelectronic dies includes a first...
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US20090321923 |
MAGNETIC PARTICLE-BASED COMPOSITE MATERIALS FOR SEMICONDUCTOR PACKAGES
A semiconductor package is described. The semiconductor package includes a substrate and an integrated heat spreader disposed above and coupled with the substrate. A cavity is disposed between the...
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US20090321957 |
Layered chip package and method of manufacturing same
A layered chip package includes: a main body including a plurality of layer portions; wiring disposed on a side surface of the main body; a plurality of first terminals disposed on a top surface of...
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US20090323406 |
MAGNETIC MEMORY ELEMENT, AND METHOD OF MANUFACTURING MEMORY ELEMENT
A magnetic memory element includes an impurity element, and magnetic thin lines to which the impurity element is added to adjust the movement of a magnetic domain wall in a magnetic field. Applying...
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US20090323304 |
LIGHT EMITTING DEVICE HAVING A PHOSPHOR LAYER
A light emitting device and method of producing the same is disclosed. The light emitting device includes a light emitting semiconductor, an encapsulation layer, wherein the light emitting...
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US20090324164 |
Waveguide photodetector device and manufacturing method thereof
Embodiments of the present invention describe a waveguide-based photodetector device and its methods of fabrication. The waveguide photodetector device comprises a substrate having a cladding...
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US20090321705 |
PHASE CHANGE MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME
A phase change memory device includes a semiconductor substrate, a first conductive pattern formed on the semiconductor substrate, a second conductive pattern contacting an upper surface of the...
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US20090321860 |
INTEGRATED CIRCUIT HAVING A MAGNETIC TUNNEL JUNCTION DEVICE AND METHOD
An integrated circuit having a magnetic tunnel junction and method. One embodiment provides an integrated circuit having a magnetic tunnel junction is provided. The magnetic tunnel junction...
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US20090321781 |
QUANTUM DOT DEVICE AND METHOD OF MAKING THE SAME
A semiconductor device includes an Al x Ga y In 1-x-y N layer and (Al,Ga,In)N quantum dots disposed on the Al x Ga y In 1-x-y N layer, wherein the indium fraction in the Al x Ga y In 1-x-y N layer...
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US20090321959 |
Chip Arrangement and Method of Manufacturing a Chip Arrangement
A chip arrangement includes a logic chip with electric contacts arranged on one side, at least one memory chip arrangement with electrical contacts arranged on at least one side, and a substrate...
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US20090322827 |
DECREASED ACTUATION VOLTAGE IN MEMS DEVICES BY CONSTRAINING MEMBRANE DISPLACEMENT WITHOUT USING CONDUCTIVE "LANDING PAD"
The present application is directed to electrostatic actuators, and methods of making electrostatic actuators. In one embodiment, an electrostatic actuator of the present application can include an...
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US20090321901 |
THERMALLY BALANCED HEAT SINKS
According to example embodiments, a device configured to dissipate heat from a first chip and a second chip on a multi-chip package includes a primary heat sink configured to contact an upper...
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US20090321867 |
Method for production of packaged electronic components, and a packaged electronic component
The invention relates to a method for production of packaged electronic, in particular optoelectronic, components in a composite wafer, in which the packaging is carried out by fitting microframe...
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US20090321619 |
OPTICALLY CONTROLLED ELECTRICAL-SWITCH DEVICE BASED UPON CARBON NANOTUBES AND ELECTRICAL-SWITCH SYSTEM USING THE SWITCH DEVICE
Described herein is an optically controlled electrical-switch device which includes a first current-conduction terminal and a second current-conduction terminal, and a carbon nanotube connected...
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US20090321859 |
System and Method to Fabricate Magnetic Random Access Memory
A system and method to fabricate magnetic random access memory is disclosed. In a particular embodiment, the method includes depositing a cap layer on a magnetic tunnel junction (MTJ) structure,...
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US20090321857 |
SYSTEMS AND METHODS FOR REDUCED STRESS ANCHORS
Anchor systems and methods anchor components of a Micro-Electro-Mechanical Systems (MEMS) device to a substrate. An exemplary embodiment has a trace anchor bonded to a substrate, a device anchor...
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US20090314095 |
PRESSURE SENSING DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF
A pressure sensing device package including a circuit substrate, a pressure sensing device, a molding compound, and a flexible protection layer is provided. The circuit substrate has an opening....
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US20090315156 |
PACKAGED INTEGRATED CIRCUIT HAVING CONFORMAL ELECTROMAGNETIC SHIELDS AND METHODS TO FORM THE SAME
Example packaged integrated circuit (IC) chips having conformal electromagnetic shields and methods to form the same are disclosed. A disclosed packaged IC chip comprises an IC attached to a first...
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US20090317924 |
METHOD FOR OPTIMIZING THE ROUTING OF WAFERS/LOTS BASED ON YIELD
A method for increasing overall yield in semiconductor manufacturing including routing wafers or wafer lots based on process variation data obtained from the wafers or wafer lots and on process...
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US20090317923 |
SPIN-CURRENT SWITCHED MAGNETIC MEMORY ELEMENT SUITABLE FOR CIRCUIT INTEGRATION AND METHOD OF FABRICATING THE MEMORY ELEMENT
A magnetic memory element switchable by current injection includes a plurality of magnetic layers, at least one of the plurality of magnetic layers having a perpendicular magnetic anisotropy...
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US20090317937 |
Maskless Doping Technique for Solar Cells
A improved, lower cost method of producing solar cells utilizing selective emitter design is disclosed. The contact regions are created on the substrate without the use of lithography or masks. The...
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US20090314941 |
Infrared detecting device and manufacturing method thereof
The present invention provides an infrared detecting device capable of improving device characteristics thereof by narrowing the width of each beam portion. The infrared detecting device has an...
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US20090315163 |
Semiconductor Die Packages with Stacked Flexible Modules Having Passive Components, Systems Using the Same, and Methods of Making the Same
Disclosed are semiconductor die packages comprising flexible modules having passive components, with the flexible modules and one or more semiconductor dice disposed in a stacked relationship,...
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US20090311822 |
PIXEL SENSOR CELL, METHODS AND DESIGN STRUCTURE INCLUDING OPTICALLY TRANSPARENT GATE
A pixel sensor cell, a method for fabricating or operating the pixel sensor cell and a design structure for fabricating the pixel sensor cell each include a semiconductor substrate that includes a...
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US20090309087 |
PHASE CHANGE MEMORY CELL HAVING TOP AND BOTTOM SIDEWALL CONTACTS
Memory devices and methods for manufacturing are described herein. A memory device as described herein includes a memory element and a first electrode having an inner surface surrounding the memory...
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US20090309492 |
Organic Light Emitting Component, and Production Method
The invention relates to an organic light emitting component, particularly an organic light emitting diode, in which an arrangement is formed that comprises a bottom electrode, a top electrode, and...
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US20090309216 |
WAFER LEVEL PACKAGE AND MANUFACTURING METHOD THEREOF
A wafer level package and a manufacturing method thereof capable of reducing stress between an under bump metal and a bump. The wafer level package includes a substrate provided with a plurality of...
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US20090309235 |
Method and Apparatus for Wafer Level Integration Using Tapered Vias
A semiconductor device has first and second wafers having bond pads. The bond pad of the second wafer is connected to the bond pad of the first wafer using a conductive adhesive. A first...
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US20090309215 |
SEMICONDUCTOR MODULE AND METHOD FOR FABRICATING SEMICONDUCTOR MODULE
A semiconductor module ( 10 ) includes a heat sink ( 1 ), an electronic component ( 2 ), a semiconductor device ( 3 ), and a thermally-conductive sheet member ( 4 ). The thermally-conductive sheet...
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US20090308454 |
INSULATING COATING, METHODS OF MANUFACTURE THEREOF AND ARTICLES COMPRISING THE SAME
Disclosed herein is an article comprising a metallic substrate; an insulating layer; the insulating layer being disposed on the metallic layer in an expanding thermal plasma; and a semiconductor...
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US20090311818 |
ANODIC BONDING METHOD AND METHOD OF PRODUCING ACCELERATION SENSOR
An anodic bonding apparatus includes a first electrode and a second electrode. The first electrode has a first surface, and the second electrode has a second surface facing the first surface. The...
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US20090309172 |
SENSOR AND A METHOD OF MAKING A SENSOR
A sensor is provided, which includes a plurality of conducting elements spaced apart from each other and at least one deformable electrolyte bridge contacting each of the conducting elements at one...
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US20090305462 |
COMPACT MULTI-PORT CAM CELL IMPLEMENTED IN 3D VERTICAL INTEGRATION
A multi-ported CAM cell in which the negative effects of increased travel distance have been substantially reduced is provided. The multi-ported CAM cell is achieved in the present invention by...
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US20090303224 |
LIQUID CRYSTAL DISPLAY DEVICE WITH A TIMING CONTROLLER AND MANUFACTURING THE SAME
A liquid crystal display device that includes a timing controller for outputting processed image signals to a source driver. The timing controller also includes a plurality of mapping circuits such...
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US20090302358 |
CMOS image sensor with high full-well-capacity
An image sensor with a high full-well capacity includes a photosensitive region, a transfer gate, and sidewall spacers. The photosensitive region is formed to accumulate an image charge in response...
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US20090304326 |
ETCHED-FACET SEMICONDUCTOR OPTICAL COMPONENT WITH INTEGRATED END-COUPLED WAVEGUIDE AND METHODS OF FABRICATION AND USE THEREOF
An optical apparatus comprises: a semiconductor substrate; a semiconductor optical device integrally formed on the substrate and having an off-normal device end face; and a low-index planar optical...
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US20090302405 |
METHOD FOR FORMING SLOT VIA BITLINE FOR MRAM DEVICES
A magnetic random access memory (MRAM) device includes a magnetic tunnel junction (MTJ) stack formed over a lower wiring level, a hardmask formed on the MTJ stack, and an upper wiring level formed...
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US20090302484 |
PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACKAGED MICROELECTRONIC DEVICES
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices are disclosed herein. In one embodiment, a packaged microelectronic device can include a support...
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US20090303780 |
INTEGRATED CIRCUIT INCLUDING AN ARRAY OF DIODES COUPLED TO A LAYER OF RESISTANCE CHANGING MATERIAL
An integrated circuit includes an array of diodes and an electrode coupled to each diode. The integrated circuit includes a layer of resistance changing material coupled to the electrodes and bit...
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