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US20130016313 PIXEL UNIT AND DISPLAY PANEL HAVING THE SAME  
In a pixel unit and a display panel having the pixel unit, the pixel unit includes a pixel portion configured to display a color, and a transmissive portion configured to transmit light. The pixel...
US20110241058 LED HEAT DISSIPATING MODULE  
A light emitting diode (LED) heat dissipating module includes an aluminum base plate, at least one connecting hole formed on aluminum base plate, and a copper pillar installed in the connecting...
US20110080747 LED LIGHT STRUCTURE  
A LED light structure is designed to replace a LED unit easily by user as the LED unit is broken, and a plate member disposed in the LED light structure is removed quickly as replacement. In...
US20110278629 LED THERMAL MANAGEMENT  
Thermal management solutions for higher power LEDs. In accordance with embodiments, a heat sink, preferably copper, is connected directly to the thermal pad of an LED. Directly connecting the LED...
US20110278633 LED Light Bulb With Integrated Heat Sink  
The use of an LED light source coupled with an integrated heat sink is described in this application. The most preferred embodiments of the present invention comprise an LED light source...
US20120025216 PHOSPHOR SUSPENDED IN SILICONE, MOLDED/FORMED AND USED IN A REMOTE PHOSPHOR CONFIGURATION  
A light emitting package comprising a support hosting at least one light emitting diode. A light transmissive dome comprised of a silicone including a phosphor material positioned to receive light...
US20110089460 LIGHT EMITTING DIODE ASSEMBLY  
An electronic assembly includes a Light Emitting Diode (LED) mounted on a top surface of a heat spreader, at least two electrical contacts co-planar with the heat spreader, and at least one heat...
US20140225152 WIRING BOARD AND LIGHT EMITTING DEVICE USING SAME, AND MANUFACTURING METHOD FOR BOTH  
A wiring board includes a base in which plate wirings formed of a metal plate are integrally formed with an insulating portion made of resin or a resin composition and surface wirings electrically...
US20100320497 LED bracket structure  
The present invention relates to a new LED bracket structure and in particular to a bracket that adopts the structure in which the upper section and lower section are made of different materials,...
US20110012161 MANUFACTURING METHODS AND INSTALLATION PROCEDURES WHICH CONFORMING TO THE INTERNATIONAL SAFETY CODES AND REGULATIONS FOR AC LED LAMP  
An alternating-current (AC) light-emitting diode (LED) lamp conforming to international safety regulations and a method for making the same are provided, wherein the core technique involves a...
US20110297973 LED WITH AN ADSORPTION PLATE  
The present invention relates to an LED with an adsorption plate attached thereto, and more particularly, to an LED which is covered with a light transmitter made of a light-transmitting material...
US20130168724 WARM WHITE LIGHT LED CHIP WITH HIGH BRIGHTNESS AND HIGH COLOR RENDERING  
A warm white light LED chip with high brightness and high color rendering includes a white light part emitting a white light, a colored light part emitting a colored light with a wavelength of 580...
US20130134454 WATER RESISTANT LED DEVICES AND AN LED DISPLAY INCLUDING SAME  
The disclosure provides an LED package including a first plastic portion having a mounting surface and a lower surface. In some embodiments, the LED package includes a second portion surrounding...
US20100025719 BOND PAD DESIGN FOR ENHANCING LIGHT EXTRACTION FROM LED CHIPS  
An improved bond pad design for increased light extraction efficiency for use in light emitting diodes (LEDs) and LED packages. Embodiments of the present invention incorporate a structure that...
US20130187189 HEAT SINK BIMETALLIC PILLAR BUMP AND THE LED HAVING THE SAME  
The invention relates to a heat sink bimetallic pillar bump that is mainly disposed inside of a LED. The heat sink bimetallic pillar bump comprises a heat absorbing section composed of a first...
US20120241807 Mounting Structure for Solid State Light Sources  
A mounting structure for solid-state light sources, for example of the LED type, comprises a support board; a submount mounted on said support board and having at least one solid-state light...
US20130256721 LED Light with Electrostatic Protection and Backlight Module Using the LED Light  
The present invention provides an LED light with electrostatic protection and a backlight module using the LED light. The LED light includes a carrying frame, a light-emitting die mounted in the...
US20120287606 LED LIGHT SOURCE ASSEMBLY, BACK LIGHT MODULE AND LIQUID CRYSTAL DISPLAY DEVICE  
The present disclosure provides an LED light source assembly which includes an LED chip and a printed circuit board. The LED chip is arranged on the printed circuit board. At least a hole...
US20130062641 LED LAMP  
A LED lamp is disclosed which has a plurality of light unit, each of the light unit has at least one flat metal lead for heat dissipation and the lower part of the metal lead is mounted on a heat...
US20130020606 CIRCUIT BOARD WITH THERMO-CONDUCTIVE PILLAR  
An LED device with improved circuit board LED support structure is presented. A top surface of a thermally-conductive substrate of this LED device comprises a thermally-conductive pillar. The...
US20100065882 GLASS FOR COVERING OPTICAL ELEMENT, GLASS-COVERED LIGHT-EMITTING ELEMENT AND GLASS-COVERED LIGHT-EMITTING DEVICE  
A glass-covered light-emitting element and a glass-covered light-emitting device are provided, which are covered with a glass having a low glass transition point and a thermal expansion...
US20110301909 TEMPERATURE MEASUREMENT SYSTEM FOR A LIGHT EMITTING DIODE (LED) ASSEMBLY  
A temperature measurement system is provided for a light emitting diode (LED) assembly that includes an LED having two semiconductors joined together at an LED junction. The system includes a...
US20110316038 SUBSTRATE COMPRISING ALUMINUM/GRAPHITE COMPOSITE, HEAT DISSIPATION PART COMPRISING SAME, AND LED LUMINESCENT MEMBER  
A process for producing a substrate, which comprises processing an aluminum/graphite composite into plates having a thickness of 0.5-3 mm using a multi-wire saw under the following conditions (1)...
US20130193476 LIGHT EMITTING DEVICE WITH REDUCE EPI STRESS  
Elements are added to a light emitting device to reduce the stress within the light emitting device caused by thermal cycling. Alternatively, or additionally, materials are selected for forming...
US20080029780 Solid state device  
A solid state device has a solid state component, a power receiving/supplying portion that mounts the solid state component thereon for receiving/supplying electrical power from/to the solid state...
US20120235206 LIGHTING DEVICE AND METHOD FOR CONTACTING A LIGHTING DEVICE  
A lighting device may include a printed circuit board, wherein the printed circuit board has wiring on at least one of the front side and the back side thereof, the respective wiring is covered by...
US20110175135 Circuit Board For LED  
A submount comprising a chip mounting area, a first bonding pad and a connecting portion is provided. An LED chip is mounted on the chip mounting area. The first bonding pad is electrically...
US20130214316 LED DEVICE WITH STRUCTURE FOR PRECISELY LOCATING LEDS THEREON AND METHOD FOR MANUFACTURING THE SAME  
An SMT LED device includes an LED and a circuit board supporting the LED. A pair of first solder pads are formed on the circuit board and spaced from each other. The LED includes two solder slugs...
US20110108865 SILICONE BASED REFLECTIVE UNDERFILL AND THERMAL COUPLER  
In one embodiment, a flip chip LED is formed with a high density of gold posts extending from a bottom surface of its n-layer and p-layer. The gold posts are bonded to submount electrodes. An...
US20130075781 LED WITH HONEYCOMB RADIATING HEAT DISSIPATION DEVICE  
An LED with a honeycomb radiating heat dissipation device includes a sapphire substrate, an LED epitaxy layer on the sapphire substrate, a thermally conductive binding layer, an intermediate heat...
US20130168722 SURFACE-MOUNTING LIGHT EMITTING DIODE DEVICE AND METHOD FOR MANUFACTURING THE SAME  
An SMT LED device includes an LED and a circuit board carrying the LED. The circuit board has two copper pads thereon, each being provided with a solder on an inner later side thereof which faces...
US20140306259 LIGHT EMITTING DIODE  
A siloxane compound comprises a plurality of siloxane repeating units and at least a portion of the siloxane repeating units are cyclosiloxane repeating units conforming to a specified structure....
US20120132952 LIGHT-EMITTING DIODE LAMP WITH LOW THERMAL RESISTANCE  
A light-emitting diode (LED) structure with an improved heat transfer path with a lower thermal resistance than conventional LED lamps is provided. For some embodiments, a surface-mountable...
US20100320490 LIGHT EMITTING DIODE PACKAGING STRUCTURE  
A light emitting diode (LED) packaging structure includes a base, a transparent layer, and an LED chip. The transparent layer is provided between the LED chip and the base to increase a relative...
US20140124824 ENCAPSULATION HOUSING AND LED MODULE WITH THE SAME  
An encapsulation housing for a LED module, may include an upper housing and a lower housing joined together and defining together a cavity, wherein at least one of the upper housing and the lower...
US20120313133 HETEROSTRUCTURE CONTAINING IC AND LED AND METHOD FOR FABRICATING THE SAME  
A heterostructure contains an IC and an LED. An IC and an LED are initially provided. The IC has at least one first electric-conduction block and at least one first connection block. The IC...
US20150008473 LED LIGHT  
Provided is an LED light which may include a base plate, an LED module disposed under the base plate, a plurality of heat pipes provided over the base plate, and a plurality of heat dissipation...
US20110049559 LIGHT-EMITTING DIODE LAMP WITH LOW THERMAL RESISTANCE  
A light-emitting diode (LED) structure with an improved heat transfer path with a lower thermal resistance than conventional LED lamps is provided. For some embodiments, a surface-mountable...
US20150129910 System and Method for Connecting LED Devices  
To connect multiple LED devices, each LED device is placed in a holder. A first wire is connected to a first wire connection point on the holder and a second wire is connected to a second wire...
US20120268968 HEAT RADIATING PRINTED CIRCUIT BOARD AND CHASSIS ASSEMBLY HAVING THE SAME  
The present invention relates to a heat radiating printed circuit board (PCB) and a chassis assembly having the same, the heat-radiating PCB characterized by: a circuit pattern unit mounted with a...
US20110156083 Light emission module with high-efficiency light emission and high-efficiency heat dissipation and applications thereof  
A light emission module is provided. The light emission module includes a substrate, a plurality of LED chips disposed on the substrate, a fluorescent colloid and a package colloid surrounding the...
US20130009186 LED LAMPS  
A high power LED lamp has a GaN chip placed over an AlGaInP chip. A reflector is placed between the two chips. Each of the chips has trenches diverting light for output. The chip pair can be...
US20120305980 LED LAMPS  
A high power LED lamp has a GaN chip placed over an AlGaInP chip. A reflector is placed between the two chips. Each of the chips has trenches diverting light for output. The chip pair can be...
US20120305978 LED LAMPS  
A high power LED lamp has a GaN chip placed over an AlGaInP chip. A reflector is placed between the two chips. Each of the chips has trenches diverting light for output. The chip pair can be...
US20120161193 LED LAMPS  
A high power LED lamp has a GaN chip placed over an AlGaInP chip. A reflector is placed between the two chips. Each of the chips has trenches diverting light for output. The chip pair can be...
US20110241062 LED lamps  
A high power LED lamp has a GaN chip placed over an AlGaInP chip. A reflector is placed between the two chips. Each of the chips has trenches diverting light for output. The chip pair can be...
US20110266560 WHITE-EMITTING LED CHIPS AND METHOD FOR MAKING SAME  
Methods and devices for light emitting diode (LED) chips are provided. In one embodiment of a method, a pre-formed capping wafer is provided, with the capping wafer comprising a conversion...
US20120018773 ALTERNATING-CURRENT LIGHT EMITTING DIODE STRUCTURE WITH OVERLOAD PROTECTION  
The present invention relates to an alternating current (AC) light emitting diode (LED) structure with overload protection, which comprises an AC LED, a heat dissipating unit and an overload...
US20110220958 ILLUMINATION DEVICE AND METHOD FOR MANUFACTURING THE SAME  
The present invention relates to a method for easily manufacturing an illumination device in which a surface mount chip-type LED is used, and a wiring board is formed into a truncated conical or...
US20120056215 LED PACKAGE HAVING AN ARRAY OF LIGHT EMITTING CELLS COUPLED IN SERIES  
Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body....