Sign up


Match Document Document Title
US20100308346 LIGHT-EMITTING DIODE AND MODULE THEREOF  
A light-emitting diode module includes a transparent base, a support and a plurality of light-emitting chips. The base has a plurality of cavities separated from each other by a predetermined...
US20060086940 Package structure of multi-chips light-emitting module  
The present invention pertains to a package structure of multi-chips light-emitting module, wherein via the packaging technology of semiconductor, a plurality of light emitting diode chips are...
US20100230695 LED package structure  
An LED package structure includes an LED chip, an internal transparent colloidal layer, a fluorescent colloidal layer, and an external transparent colloidal layer. The internal transparent...
US20100032698 PARTICLE FOR DISPLAY MEDIUM AND INFORMATION DISPLAY PANEL USING SAME  
In the particles for display media used for an information display panel, in which at least one group of display media are sealed between two opposed substrates, at least one of two substrates...
US20130320373 LIGHT EMITTING DEVICE  
The present invention relates to a light emitting device comprising a transparent substrate which light can pass through and at least one LED chip emitting light omni-directionally. Wherein the LED...
US20080203413 Optoelectronic Components With Adhesion Agent  
SiO2 layers are used as adhesion layers in the case of optoelectronic components. Durable adhesions can be produced with silicone rubbers. These materials normally have only an insufficient...
US20090169071 Pseudo-Translucent Integrated Circuit Package  
An integrated circuit (IC) package includes at least one light source disposed together with an IC structure within an encapsulation structure. The material forming the encapsulation structure is...
US20090242917 Light-emitting device including light-emitting diode  
A light-emitting device includes a light-emitting diode, a red light-emitting phosphor layer, a yellow light-emitting phosphor layer, and a blue light-emitting phosphor layer. These layers are...
US20120228649 LED MODULE, METHOD FOR MANUFACTURING THE SAME, AND LED CHANNEL LETTER INCLUDING THE SAME  
Disclosed herein is a method for manufacturing a light emitting diode (LED) module, the method including: disposing a circuit board at a molding space formed by an upper mold and a lower mold;...
US20090001389 HYBRID VERTICAL CAVITY OF MULTIPLE WAVELENGTH LEDS  
A solid state device (200) for a hybrid vertical cavity of multiple wavelength LEDs is provided. The solid state device can include a hybrid vertical cavity formed by a cascading of a first...
US20070096127 Semiconductor micro-cavity light emitting diode  
A spontaneously light emitting nitride-based active region placed within a micro-cavity bounded by a first mirror and a second mirror, wherein the micro-cavity has been thinned to a resonant...
US20100084671 BRIGHTNESS ENHANCEMENT METHOD AND APPARATUS OF LIGHT EMITTING DIODES  
A light source with enhanced brightness includes an angle-selective optical filter and a light emitting diode (LED) having a high reflective layer. The angle-selective filter is located on the top...
US20100025706 NANOPARTICLE BASED INORGANIC BONDING MATERIAL  
A method for the production of a light emitting device is provided, comprising providing at least one LED 10 and at least one optical element 13; arranging a bonding material 12, comprising a...
US20120241784 LIGHT-EMITTING DIODE (LED) PACKAGE SYSTEMS AND METHODS OF MAKING THE SAME  
A light-emitting diode (LED) package system includes a LED disposed over a surface of a substrate. A molding material covers the LED. A phosphor-containing material is disposed over and spaced from...
US20140054573 Hidden organic optoelectronic devices  
An optoelectronic device comprising at least one optoelectronic active region comprising at least a rear electrode and a front electrode between which an organic optoelectronic material is...
US20080224159 Optical Element, Optoelectronic Component Comprising Said Element, and the Production Thereof  
The invention relates to an optical element (1, 25) having a defined shape and comprising a thermoplastic material that has been further cross-linked during or following the shaping thereof. Such...
US20060022210 Radiation-emitting semiconductor chip with a beam shaping element and beam shaping element  
In a radiation-emitting semiconductor chip (2) with a beam shaping element, the beam shaping element is a hollow body (1) with a light exit opening (7). In a first embodiment, the semiconductor...
US20100133563 ILLUMINATION SYSTEM COMPRISING A RADIATION SOURCE AND A LUMINESCENT MATERIAL  
An illumination system, comprising a radiation source and a luminescent material comprising at least one phosphor capable of absorbing a part of light emitted by the radiation source and emitting...
US20100295075 DOWN-CONVERTED LIGHT EMITTING DIODE WITH SIMPLIFIED LIGHT EXTRACTION  
A wavelength converted light emitting diode (LED) device has an LED having an output surface. A multilayer semiconductor wavelength converter is optically bonded to the LED. At least one of the LED...
US20100177497 EFFICIENT EMITTING LED PACKAGE AND METHOD FOR EFFICIENTLY EMITTING LIGHT  
An LED package comprises an LED for emitting LED light, and a conversion material remote to said LED for down-converting the wavelength of LED light. The package further comprises a reflector...
US20100072506 ULTRAVIOLET LIGHT EMITTING DIODE PACKAGE  
An ultraviolet light emitting diode package for emitting ultraviolet light is disclosed. The ultraviolet light emitting diode package comprises an LED chip emitting light with a peak wavelength of...
US20110164397 LED PACKAGE USING PHOSPHOR CONTAINING ELEMENTS AND LIGHT SOURCE CONTAINING SAME  
A light-emitting diode package is described comprising a body including a hollow having a rim that extends outwardly from an open end of the hollow. A light emitting diode is positioned in the...
US20110186897 POWER SURFACE MOUNT LIGHT EMITTING DIE PACKAGE  
A light emitting die package includes a substrate, a reflector plate, and a lens. The substrate has traces for connecting an external electrical power source to a light emitting diode (LED) at a...
US20110186896 POWER SURFACE MOUNT LIGHT EMITTING DIE PACKAGE  
A light emitting die package includes a substrate, a reflector plate, and a lens. The substrate has traces for connecting an external electrical power source to a light emitting diode (LED) at a...
US20110186895 POWER SURFACE MOUNT LIGHT EMITTING DIE PACKAGE  
A light emitting die package includes a substrate, a reflector plate, and a lens. The substrate has traces for connecting an external electrical power source to a light emitting diode (LED) at a...
US20100301372 POWER SURFACE MOUNT LIGHT EMITTING DIE PACKAGE  
A light emitting die package includes a substrate, a reflector plate, and a lens. The substrate has traces for connecting an external electrical power source to a light emitting diode (LED) at a...
US20140225145 LIGHT EMITTING DEVICE AND FABRICATING METHOD THEREOF  
A light-emitting device includes a light-emitting element for emitting primary light, and a wavelength conversion unit for absorbing part of the primary light and emitting secondary light having a...
US20100051989 LED AND METHOD FOR MAKING THE SAME  
An LED includes a substrate, an LED die, and a packaging layer. The substrate has conductive pins extending therethrough. The LED die is arranged on the substrate and electronically connected to...
US20080179613 Silicon Deflector on a Silicon Submount For Light Emitting Diodes  
The present invention deals with a process for the manufacturing of reflecting optical barriers comprising silicon and useful in combination with light emitting devices, wherein the process...
US20140175483 LIGHT EMITTING DIODE PACKAGE  
An LED package includes a first electrode, a second electrode electrically insulated from the first electrode, a reflecting cup connecting the first electrode and the second electrode, and an LED...
US20120181560 LED WIRING BOARD, LIGHT EMITTING MODULE, METHOD FOR MANUFACTURING LED WIRING BOARD AND METHOD FOR MANUFACTURING LIGHT EMITTING MODULE  
An LED wiring board includes an insulator layer, a conductor layer (a wiring pattern layer) formed on the insulator layer, and a white reflective film which is formed on the insulator layer and...
US20090153029 LIGHT EMITTING DIODES, INCLUDING HIGH-EFFICIENCY OUTCOUPLING OLED UTILIZING TWO-DIMENSIONAL GRATING  
The present disclosure relates to increasing the external efficiency of light emitting diodes, and specifically to increasing the outcoupling of light from an organic light emitting diode utilizing...
US20140175484 LIGHT EMITTING DIODE PACKAGE  
An LED package includes a first electrode, a second electrode, a reflecting cup connecting the first electrode and the second electrode, and an LED chip. The first electrode includes a first main...
US20110316031 TRANSFER SHEET FOR PHOSPHOR LAYER AND LIGHT-EMITTING DEVICE  
A transfer sheet for a phosphor layer includes a release substrate, a phosphor layer formed on the release substrate, and an adhesive layer formed on the phosphor layer.
US20120256217 LIGHT-EMITTING DIODE PACKAGE  
A light-emitting diode (LED) package including a substrate, an LED chip, a polarizer, and a supporter is provided. The LED chip is disposed on the substrate. The polarizer is disposed above the LED...
US20110284902 LIGHT EMISSION MODULE, LIGHT EMISSION MODULE MANUFACTURING METHOD, AND LAMP UNIT  
In a light emission module (40), a light wavelength conversion ceramic (52) is formed in a sheet shape which converts the wavelength of the light emitted from a semiconductor light emission element...
US20100123150 Hybrid organic light emitting diode  
A hybrid organic light emitting diode employing fluorescent family of blue light-emitting OLED and phosphorescent family of red and green light emitting OLED, each family being electrically...
US20130277702 Light Emitting Diode Device Having Electrode With Low Illumination Side And High Illumination Side  
A high-brightness vertical light emitting diode (LED) device includes an outwardly located metal electrode having a low illumination side and a high illumination side. The LED device is formed by:...
US20080296601 Light-Emitting Diode Incorporating an Array of Light Extracting Spots  
A light-emitting diode includes an optical layer formed in an array of substantially equidistant light extracting spots integrated to its multi-layered structure. The array of light extracting...
US20070145397 HIGH EFFICIENCY LIGHT EMITTING DIODE (LED)  
An (Al, Ga, In)N light emitting diode (LED), wherein light extraction from chip and/or phosphor conversion layer is optimized. By novel shaping of LED and package optics, a high efficiency light...
US20110186887 Reflection Mode Wavelength Conversion Material for Optical Devices Using Non-Polar or Semipolar Gallium Containing Materials  
An optical device includes an LED overlying a portion of a surface region of a substrate member and a wavelength conversion material within a vicinity of the LED. The device also includes a...
US20120199843 HIGH REFLECTIVE BOARD OR SUBSTRATE FOR LEDS  
Light emitting devices and methods are disclosed that provide improved light output. The devices have an LED mounted to a substrate, board or submount characterized by improved reflectivity, which...
US20070096130 LED Assembly Having Maximum Metal Support for Laser Lift-Off of Growth Substrate  
Described is a process for forming an LED structure using a laser lift-off process to remove the growth substrate (e.g., sapphire) after the LED die is bonded to a submount. The underside of the...
US20090212310 SOFT LITHOGRAPHIC MOLDING OF SURFACE RELIEF OUTPUT COUPLERS FOR ORGANIC LIGHT EMITTING DIODES  
The present invention provides a method and apparatus for surface relief output coupling in organic light emitting diodes is provided. The method includes forming a pattern in a surface of an...
US20110260197 LIGHT EMITTING DIODE PACKAGE  
Provided is an LED package. It is easy to control luminance according to the luminance and an angle applicable. Since heat is efficiently emitted, the LED package is easily applicable to a high...
US20130320378 LIGHT-EMITTING DEVICE  
A light-emitting device includes a face-up type LED chip formed rectangular in a top view, and a rectangular parallelepiped-shaped sealing portion to seal the LED chip. An angle formed between a...
US20050045897 Light emitting apparatus  
A light emitting apparatus at least includes a circuit board, several light emitting diodes (LEDs), a first reflective substance, and a diffusion structure. The LEDs, including red (R), green (G),...
US20090014740 LIGHT EMITTING DEVICES AND RELATED METHODS  
Devices, such as light-emitting devices (e.g., LEDs), and methods associated with such devices are provided. A light-emitting device may include an interface through which emitted light passes...
US20080251805 HEAT DISSIPATION PACKAGE FOR HEAT GENERATION ELEMENT  
A heat dissipation package is provided. Conducting leads of the package are located between two dissipating parts of a heat dissipation carrier to form the heat dissipation package with a structure...
US20130126922 LIGHT EMITTING DIODE INCORPORATING LIGHT CONVERTING MATERIAL  
An LED includes an LED chip, an encapsulant for encapsulating the LED chip, and a lens attached to the encapsulant. The lens includes a main body, and a light converting unit with a light...