Sign up


Match Document Document Title
US20100177497 EFFICIENT EMITTING LED PACKAGE AND METHOD FOR EFFICIENTLY EMITTING LIGHT  
An LED package comprises an LED for emitting LED light, and a conversion material remote to said LED for down-converting the wavelength of LED light. The package further comprises a reflector...
US20100072506 ULTRAVIOLET LIGHT EMITTING DIODE PACKAGE  
An ultraviolet light emitting diode package for emitting ultraviolet light is disclosed. The ultraviolet light emitting diode package comprises an LED chip emitting light with a peak wavelength of...
US20110164397 LED PACKAGE USING PHOSPHOR CONTAINING ELEMENTS AND LIGHT SOURCE CONTAINING SAME  
A light-emitting diode package is described comprising a body including a hollow having a rim that extends outwardly from an open end of the hollow. A light emitting diode is positioned in the...
US20110186897 POWER SURFACE MOUNT LIGHT EMITTING DIE PACKAGE  
A light emitting die package includes a substrate, a reflector plate, and a lens. The substrate has traces for connecting an external electrical power source to a light emitting diode (LED) at a...
US20110186896 POWER SURFACE MOUNT LIGHT EMITTING DIE PACKAGE  
A light emitting die package includes a substrate, a reflector plate, and a lens. The substrate has traces for connecting an external electrical power source to a light emitting diode (LED) at a...
US20110186895 POWER SURFACE MOUNT LIGHT EMITTING DIE PACKAGE  
A light emitting die package includes a substrate, a reflector plate, and a lens. The substrate has traces for connecting an external electrical power source to a light emitting diode (LED) at a...
US20100301372 POWER SURFACE MOUNT LIGHT EMITTING DIE PACKAGE  
A light emitting die package includes a substrate, a reflector plate, and a lens. The substrate has traces for connecting an external electrical power source to a light emitting diode (LED) at a...
US20140225145 LIGHT EMITTING DEVICE AND FABRICATING METHOD THEREOF  
A light-emitting device includes a light-emitting element for emitting primary light, and a wavelength conversion unit for absorbing part of the primary light and emitting secondary light having a...
US20100051989 LED AND METHOD FOR MAKING THE SAME  
An LED includes a substrate, an LED die, and a packaging layer. The substrate has conductive pins extending therethrough. The LED die is arranged on the substrate and electronically connected to...
US20080179613 Silicon Deflector on a Silicon Submount For Light Emitting Diodes  
The present invention deals with a process for the manufacturing of reflecting optical barriers comprising silicon and useful in combination with light emitting devices, wherein the process...
US20140175483 LIGHT EMITTING DIODE PACKAGE  
An LED package includes a first electrode, a second electrode electrically insulated from the first electrode, a reflecting cup connecting the first electrode and the second electrode, and an LED...
US20120181560 LED WIRING BOARD, LIGHT EMITTING MODULE, METHOD FOR MANUFACTURING LED WIRING BOARD AND METHOD FOR MANUFACTURING LIGHT EMITTING MODULE  
An LED wiring board includes an insulator layer, a conductor layer (a wiring pattern layer) formed on the insulator layer, and a white reflective film which is formed on the insulator layer and...
US20090153029 LIGHT EMITTING DIODES, INCLUDING HIGH-EFFICIENCY OUTCOUPLING OLED UTILIZING TWO-DIMENSIONAL GRATING  
The present disclosure relates to increasing the external efficiency of light emitting diodes, and specifically to increasing the outcoupling of light from an organic light emitting diode utilizing...
US20140175484 LIGHT EMITTING DIODE PACKAGE  
An LED package includes a first electrode, a second electrode, a reflecting cup connecting the first electrode and the second electrode, and an LED chip. The first electrode includes a first main...
US20110316031 TRANSFER SHEET FOR PHOSPHOR LAYER AND LIGHT-EMITTING DEVICE  
A transfer sheet for a phosphor layer includes a release substrate, a phosphor layer formed on the release substrate, and an adhesive layer formed on the phosphor layer.
US20120256217 LIGHT-EMITTING DIODE PACKAGE  
A light-emitting diode (LED) package including a substrate, an LED chip, a polarizer, and a supporter is provided. The LED chip is disposed on the substrate. The polarizer is disposed above the LED...
US20110284902 LIGHT EMISSION MODULE, LIGHT EMISSION MODULE MANUFACTURING METHOD, AND LAMP UNIT  
In a light emission module (40), a light wavelength conversion ceramic (52) is formed in a sheet shape which converts the wavelength of the light emitted from a semiconductor light emission element...
US20100123150 Hybrid organic light emitting diode  
A hybrid organic light emitting diode employing fluorescent family of blue light-emitting OLED and phosphorescent family of red and green light emitting OLED, each family being electrically...
US20130277702 Light Emitting Diode Device Having Electrode With Low Illumination Side And High Illumination Side  
A high-brightness vertical light emitting diode (LED) device includes an outwardly located metal electrode having a low illumination side and a high illumination side. The LED device is formed by:...
US20080296601 Light-Emitting Diode Incorporating an Array of Light Extracting Spots  
A light-emitting diode includes an optical layer formed in an array of substantially equidistant light extracting spots integrated to its multi-layered structure. The array of light extracting...
US20070145397 HIGH EFFICIENCY LIGHT EMITTING DIODE (LED)  
An (Al, Ga, In)N light emitting diode (LED), wherein light extraction from chip and/or phosphor conversion layer is optimized. By novel shaping of LED and package optics, a high efficiency light...
US20110186887 Reflection Mode Wavelength Conversion Material for Optical Devices Using Non-Polar or Semipolar Gallium Containing Materials  
An optical device includes an LED overlying a portion of a surface region of a substrate member and a wavelength conversion material within a vicinity of the LED. The device also includes a...
US20120199843 HIGH REFLECTIVE BOARD OR SUBSTRATE FOR LEDS  
Light emitting devices and methods are disclosed that provide improved light output. The devices have an LED mounted to a substrate, board or submount characterized by improved reflectivity, which...
US20070096130 LED Assembly Having Maximum Metal Support for Laser Lift-Off of Growth Substrate  
Described is a process for forming an LED structure using a laser lift-off process to remove the growth substrate (e.g., sapphire) after the LED die is bonded to a submount. The underside of the...
US20090212310 SOFT LITHOGRAPHIC MOLDING OF SURFACE RELIEF OUTPUT COUPLERS FOR ORGANIC LIGHT EMITTING DIODES  
The present invention provides a method and apparatus for surface relief output coupling in organic light emitting diodes is provided. The method includes forming a pattern in a surface of an...
US20110260197 LIGHT EMITTING DIODE PACKAGE  
Provided is an LED package. It is easy to control luminance according to the luminance and an angle applicable. Since heat is efficiently emitted, the LED package is easily applicable to a high...
US20130320378 LIGHT-EMITTING DEVICE  
A light-emitting device includes a face-up type LED chip formed rectangular in a top view, and a rectangular parallelepiped-shaped sealing portion to seal the LED chip. An angle formed between a...
US20050045897 Light emitting apparatus  
A light emitting apparatus at least includes a circuit board, several light emitting diodes (LEDs), a first reflective substance, and a diffusion structure. The LEDs, including red (R), green (G),...
US20090014740 LIGHT EMITTING DEVICES AND RELATED METHODS  
Devices, such as light-emitting devices (e.g., LEDs), and methods associated with such devices are provided. A light-emitting device may include an interface through which emitted light passes...
US20080251805 HEAT DISSIPATION PACKAGE FOR HEAT GENERATION ELEMENT  
A heat dissipation package is provided. Conducting leads of the package are located between two dissipating parts of a heat dissipation carrier to form the heat dissipation package with a structure...
US20130126922 LIGHT EMITTING DIODE INCORPORATING LIGHT CONVERTING MATERIAL  
An LED includes an LED chip, an encapsulant for encapsulating the LED chip, and a lens attached to the encapsulant. The lens includes a main body, and a light converting unit with a light...
US20110121326 Submount Having Reflective Cu-Ni-Ag Pads Formed Using Electroless Deposition  
A submount for an LED has relatively large copper pads formed on its top surface using an electroless process so that no electrical bias circuitry is required for the submount. The copper pads are...
US20090095966 Multiple conversion material light emitting diode package and method of fabricating same  
An emitter package comprising a light emitting diode (LED) emitting light at a wavelength within a wavelength range and a plurality of phosphors. Each of the phosphors absorbs at least some light...
US20120187433 STRUCTURE OF LIGHT SOURCE MODULE AND MANUFACTURING METHOD THEREOF  
A circuit substrate and at least one light-emitting diode (LED) chip are adhered to a heatsink substrate in sequence, and then a packaging material is formed on the LED chip. The circuit substrate...
US20140159088 LIGHT EMITTING DEVICE PACKAGES WITH IMPROVED HEAT TRANSFER  
Packages containing one or more light emitting devices, such as light emitting diodes (LEDs), are disclosed. In one embodiment, LED package can include a thermal element having improved solder...
US20130234186 ENCAPSULATING SHEET, LIGHT EMITTING DIODE DEVICE, AND PRODUCING METHOD THEREOF  
An encapsulating sheet includes a transparent layer in which a concave portion that is dented from the surface inwardly is formed and a phosphor encapsulating layer which fills the concave portion....
US20140138728 PHOSPHOR COMPOSITION AND LIGHT EMITTING DEVICE PACKAGE HAVING THE SAME  
Disclosed are a phosphor composition and a light emitting apparatus including the same. The phosphor composition has a compositional formula of AzCxO12:RE, wherein the z is 0≦z≦3, the x is 0≦x...
US20100044732 Light Emitting Diode Structure and Method of Forming the Same  
A light emitting diode structure and a light emitting diode structure forming method are provided. The light emitting diode structure includes a base, a diode chip, and a package lens. The diode...
US20110266574 LED PACKAGE  
An LED package includes a substrate, an LED die, and an encapsulating layer. The LED die is arranged on the substrate. The encapsulating layer covers the LED die and at least a part of the...
US20050214567 Organic element for electroluminescent devices  
An electroluminescent device comprises a layer containing a naphthalene compound represented by Formula (1), wherein: each R1 and R2 represents an independently selected substituent provided that...
US20130032835 Device with Inverted Large Scale Light Extraction Structures  
An interface including roughness components for improving the propagation of radiation through the interface is provided. The interface includes a first profiled surface of a first layer comprising...
US20080191231 Led Package, Method Of Fabricating The Same, And Backlight Unit Having The Same  
Disclosed are a LED package, a method of fabricating the same, and a backlight unit having the same. The light emitting diode package comprises a light emitting diode, a printed circuit board...
US20080017875 Yellow Emitting Phosphor And White Semiconductor Light Emitting Device Incorporating The Same  
The present invention relates to a yellow phosphor represented by a general formula of A(1-y)3D5-x Ex O12:Cey (wherein: A is at least one element selected from the group consisting of Y, Lu, Sc,...
US20090101897 PACKAGE FOR A LIGHT EMITTING ELEMENT  
A high-brightness LED module includes a substrate with a recess in which a light emitting element is mounted. The recess is defined by a sidewalls and a relatively thin membrane. At least two...
US20130056765 LIGHT EMITTING DIODE LIGHT SOURCE INCLUDING ALL NITRIDE LIGHT EMITTING DIODES  
A light source including at least two phosphor converted (pc) light emitting diodes (LEDs), each of the pc LEDs including an associated blue-emitting LED as an excitation source for a phosphor...
US20130214314 LIGHT-EMITTING MATERIAL OF NITROGEN COMPOUND, PREPARATION PROCESS THEREOF AND ILLUMINATION SOURCE MANUFACTURED THEREFROM  
A nitrogen compound luminescent material belongs to the field of LED inorganic luminescent materials. The nitrogen compound luminescent material has a chemical formula: M1-yEuyAlSiCxN3-4/3x. In the...
US20090315965 LED ARRAY MANUFACTURING METHOD, LED ARRAY AND LED PRINTER  
An LED array having no insulating film between the LED structure and the reflector thereof is manufactured by forming a luminescent layer 1102 and a DBR layer 1103 on a first substrate 100 with an...
US20050035361 Polarized light emitting devices and methods  
An organic light emitting device (OLED) including a reflective electrode or reflective backing that emits polarized light, a linear polarizer and/or a band-pass filter may be combined such that...
US20110278609 PACKAGE STRUCTURE AND PACKAGE PROCESS OF LIGHT EMITTING DIODE  
A light emitted diode (LED) package structure and an LED package process are provided. The LED package structure comprises a carrier, a spacer, at least one LED chip, a junction coating, a...
US20110254038 LED HOUSING WITH FLUOROPOLYMER SURFACE COATING LAYER AND LED STRUCTURE HAVING THE SAME  
A housing for supporting a light-emitting diode chip is disclosed. The housing includes a housing body made of non-fluoro-containing polymer and a surface coating layer covering at least a portion...