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US20080296601 Light-Emitting Diode Incorporating an Array of Light Extracting Spots  
A light-emitting diode includes an optical layer formed in an array of substantially equidistant light extracting spots integrated to its multi-layered structure. The array of light extracting...
US20070145397 HIGH EFFICIENCY LIGHT EMITTING DIODE (LED)  
An (Al, Ga, In)N light emitting diode (LED), wherein light extraction from chip and/or phosphor conversion layer is optimized. By novel shaping of LED and package optics, a high efficiency light...
US20110186887 Reflection Mode Wavelength Conversion Material for Optical Devices Using Non-Polar or Semipolar Gallium Containing Materials  
An optical device includes an LED overlying a portion of a surface region of a substrate member and a wavelength conversion material within a vicinity of the LED. The device also includes a...
US20120199843 HIGH REFLECTIVE BOARD OR SUBSTRATE FOR LEDS  
Light emitting devices and methods are disclosed that provide improved light output. The devices have an LED mounted to a substrate, board or submount characterized by improved reflectivity, which...
US20070096130 LED Assembly Having Maximum Metal Support for Laser Lift-Off of Growth Substrate  
Described is a process for forming an LED structure using a laser lift-off process to remove the growth substrate (e.g., sapphire) after the LED die is bonded to a submount. The underside of the...
US20090212310 SOFT LITHOGRAPHIC MOLDING OF SURFACE RELIEF OUTPUT COUPLERS FOR ORGANIC LIGHT EMITTING DIODES  
The present invention provides a method and apparatus for surface relief output coupling in organic light emitting diodes is provided. The method includes forming a pattern in a surface of an...
US20110260197 LIGHT EMITTING DIODE PACKAGE  
Provided is an LED package. It is easy to control luminance according to the luminance and an angle applicable. Since heat is efficiently emitted, the LED package is easily applicable to a high...
US20130320378 LIGHT-EMITTING DEVICE  
A light-emitting device includes a face-up type LED chip formed rectangular in a top view, and a rectangular parallelepiped-shaped sealing portion to seal the LED chip. An angle formed between a...
US20050045897 Light emitting apparatus  
A light emitting apparatus at least includes a circuit board, several light emitting diodes (LEDs), a first reflective substance, and a diffusion structure. The LEDs, including red (R), green (G),...
US20090014740 LIGHT EMITTING DEVICES AND RELATED METHODS  
Devices, such as light-emitting devices (e.g., LEDs), and methods associated with such devices are provided. A light-emitting device may include an interface through which emitted light passes...
US20080251805 HEAT DISSIPATION PACKAGE FOR HEAT GENERATION ELEMENT  
A heat dissipation package is provided. Conducting leads of the package are located between two dissipating parts of a heat dissipation carrier to form the heat dissipation package with a structure...
US20130126922 LIGHT EMITTING DIODE INCORPORATING LIGHT CONVERTING MATERIAL  
An LED includes an LED chip, an encapsulant for encapsulating the LED chip, and a lens attached to the encapsulant. The lens includes a main body, and a light converting unit with a light...
US20110121326 Submount Having Reflective Cu-Ni-Ag Pads Formed Using Electroless Deposition  
A submount for an LED has relatively large copper pads formed on its top surface using an electroless process so that no electrical bias circuitry is required for the submount. The copper pads are...
US20090095966 Multiple conversion material light emitting diode package and method of fabricating same  
An emitter package comprising a light emitting diode (LED) emitting light at a wavelength within a wavelength range and a plurality of phosphors. Each of the phosphors absorbs at least some light...
US20120187433 STRUCTURE OF LIGHT SOURCE MODULE AND MANUFACTURING METHOD THEREOF  
A circuit substrate and at least one light-emitting diode (LED) chip are adhered to a heatsink substrate in sequence, and then a packaging material is formed on the LED chip. The circuit substrate...
US20140159088 LIGHT EMITTING DEVICE PACKAGES WITH IMPROVED HEAT TRANSFER  
Packages containing one or more light emitting devices, such as light emitting diodes (LEDs), are disclosed. In one embodiment, LED package can include a thermal element having improved solder...
US20130234186 ENCAPSULATING SHEET, LIGHT EMITTING DIODE DEVICE, AND PRODUCING METHOD THEREOF  
An encapsulating sheet includes a transparent layer in which a concave portion that is dented from the surface inwardly is formed and a phosphor encapsulating layer which fills the concave portion....
US20140138728 PHOSPHOR COMPOSITION AND LIGHT EMITTING DEVICE PACKAGE HAVING THE SAME  
Disclosed are a phosphor composition and a light emitting apparatus including the same. The phosphor composition has a compositional formula of AzCxO12:RE, wherein the z is 0≦z≦3, the x is 0≦x...
US20100044732 Light Emitting Diode Structure and Method of Forming the Same  
A light emitting diode structure and a light emitting diode structure forming method are provided. The light emitting diode structure includes a base, a diode chip, and a package lens. The diode...
US20110266574 LED PACKAGE  
An LED package includes a substrate, an LED die, and an encapsulating layer. The LED die is arranged on the substrate. The encapsulating layer covers the LED die and at least a part of the...
US20050214567 Organic element for electroluminescent devices  
An electroluminescent device comprises a layer containing a naphthalene compound represented by Formula (1), wherein: each R1 and R2 represents an independently selected substituent provided that...
US20130032835 Device with Inverted Large Scale Light Extraction Structures  
An interface including roughness components for improving the propagation of radiation through the interface is provided. The interface includes a first profiled surface of a first layer comprising...
US20080191231 Led Package, Method Of Fabricating The Same, And Backlight Unit Having The Same  
Disclosed are a LED package, a method of fabricating the same, and a backlight unit having the same. The light emitting diode package comprises a light emitting diode, a printed circuit board...
US20080017875 Yellow Emitting Phosphor And White Semiconductor Light Emitting Device Incorporating The Same  
The present invention relates to a yellow phosphor represented by a general formula of A(1-y)3D5-x Ex O12:Cey (wherein: A is at least one element selected from the group consisting of Y, Lu, Sc,...
US20090101897 PACKAGE FOR A LIGHT EMITTING ELEMENT  
A high-brightness LED module includes a substrate with a recess in which a light emitting element is mounted. The recess is defined by a sidewalls and a relatively thin membrane. At least two...
US20130056765 LIGHT EMITTING DIODE LIGHT SOURCE INCLUDING ALL NITRIDE LIGHT EMITTING DIODES  
A light source including at least two phosphor converted (pc) light emitting diodes (LEDs), each of the pc LEDs including an associated blue-emitting LED as an excitation source for a phosphor...
US20130214314 LIGHT-EMITTING MATERIAL OF NITROGEN COMPOUND, PREPARATION PROCESS THEREOF AND ILLUMINATION SOURCE MANUFACTURED THEREFROM  
A nitrogen compound luminescent material belongs to the field of LED inorganic luminescent materials. The nitrogen compound luminescent material has a chemical formula: M1-yEuyAlSiCxN3-4/3x. In the...
US20090315965 LED ARRAY MANUFACTURING METHOD, LED ARRAY AND LED PRINTER  
An LED array having no insulating film between the LED structure and the reflector thereof is manufactured by forming a luminescent layer 1102 and a DBR layer 1103 on a first substrate 100 with an...
US20050035361 Polarized light emitting devices and methods  
An organic light emitting device (OLED) including a reflective electrode or reflective backing that emits polarized light, a linear polarizer and/or a band-pass filter may be combined such that...
US20110278609 PACKAGE STRUCTURE AND PACKAGE PROCESS OF LIGHT EMITTING DIODE  
A light emitted diode (LED) package structure and an LED package process are provided. The LED package structure comprises a carrier, a spacer, at least one LED chip, a junction coating, a...
US20110254038 LED HOUSING WITH FLUOROPOLYMER SURFACE COATING LAYER AND LED STRUCTURE HAVING THE SAME  
A housing for supporting a light-emitting diode chip is disclosed. The housing includes a housing body made of non-fluoro-containing polymer and a surface coating layer covering at least a portion...
US20110062471 LED MODULE WITH HIGH INDEX LENS  
An array of housings with housing bodies and lenses is molded, or an array of housing bodies is molded and bonded with lenses to form an array of housings with housing bodies and lenses....
US20120267660 ORGANIC LIGHT EMITTING DIODE DISPLAY  
An organic light emitting diode (OLED) display includes: a display substrate; an organic light emitting element formed over the display substrate; a thin film encapsulation layer formed over the...
US20110260191 LIGHT-EMITTING DIODE HAVING ZINC OXIDE NANORODS AND METHOD OF FABRICATING THE SAME  
The light extraction efficiency of a typical light-emitting diode (LED) is improved by incorporating one-dimensional ZnO nanorods. The light extraction efficiency is improved about 31% due to the...
US20060019116 White electroluminescent device with anthracene derivative host  
An OLED device for emitting white light comprises adjacent layers 1 and 2 wherein layer 1 contains a host and a yellow, orange, or red emitter and layer 2 contains a host and a blue or blue-green...
US20110215354 Double Flip-Chip LED Package Components  
A light-emitting device (LED) package component includes an LED chip and a carrier chip. The carrier chip includes a first and a second bond pad on a surface of the carrier chip; and a third and a...
US20100295079 MANUFACTURE OF LIGHT EMITTING DEVICES WITH PHOSPHOR WAVELENGTH CONVERSION  
A method of manufacturing a light emitting device comprises: depositing over substantially the entire surface of a LED wafer having a array of LEDs formed on a surface thereof a mixture of at least...
US20080067533 FLEXIBLE CIRCUIT LIGHT-EMITTING STRUCTURES  
Light-emitting structures, and related components, systems, and methods associated therewith are provided. In one embodiment, a light-emitting structure includes at least one LED, a contact bond...
US20120217525 LIGHT EMITTING DIODE PACKAGE AND LIGHT EMITTING DEVICE HAVING THE SAME  
An LED package includes a light transmissive encapsulation, an LED die embedded in the encapsulation from a bottom surface of the encapsulation, a positive electrode electrically connected to an...
US20070228402 SMT LED with high light output for high power applications  
A method and apparatus is described for a light-emitting diode with high light output. A polymeric cup to reflect light holds a light-emitting diode chip connected to surface-mounting leads and is...
US20130320379 EPOXY RESIN COMPOSITION AND LIGHT EMITTING APPARATUS  
Disclosed are an epoxy resin composition and a light emitting apparatus. The epoxy resin composition includes a triazine derivative epoxy resin and an alicyclic epoxy resin.
US20090230416 Al-Ni-B ALLOY MATERIAL FOR REFLECTIVE FILM  
With respect to a reflection-type display device, an Al-based alloy material for a reflective film, which has excellent reflective characteristics and can be directly bonded to a transparent...
US20120280256 REMOTE PHOSPHOR LIGHT EMITTING DEVICES, COMPONENTS AND FABRICATION  
A substrate including phosphor is remotely illuminated by an LED. Optical radiation that emerges through the substrate is measured. Portions of the substrate, such as raised features on the...
US20120248474 LIGHT EMITTING ELEMENT, ILLUMINATION DEVICE, AND DISPLAY APPARATUS  
A light emitting element has an organic layer that sequentially includes a first emission layer and a second emission layer, a first reflection interface, and a second reflection interface,...
US20100155749 LIGHT-EMITTING DIODE (LED) DEVICES COMPRISING NANOCRYSTALS  
The present invention provides light-emitting diode (LED) devices comprises compositions and containers of hermetically sealed luminescent nanocrystals. The present invention also provides displays...
US20120305953 Mixed Light Source  
A mixed light source comprising: a first radiation source, which emits radiation in the red spectral range; an excitation source, which contains a III-V semiconductor material; and a conversion...
US20120119244 LED PACKAGE AND METHOD FOR MANUFACTURING THE SAME  
An LED package includes a substrate, an LED chip, and an encapsulation. The substrate includes a first surface. The LED chip is mounted on the first surface of the substrate. The encapsulation...
US20120313131 LED LEADFRAME OR LED SUBSTRATE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING LED LEADFRAME OR LED SUBSTRATE  
An LED leadframe or LED substrate includes a main body portion having a mounting surface for mounting an LED element thereover. A reflection metal layer serving as a reflection layer for reflecting...
US20120228653 LIGHT EMITTING DEVICE  
A light emitting device of embodiments is provided with a light-emitting element emitting excitation light of a first wavelength, a first phosphor layer containing a first phosphor that converts...
US20090278152 LIGHT EMITTING DIODE AND PACKAGE METHOD THEREOF  
A light emitting diode comprises a sheet-like package body, a barricade, a light emitting diode die, and fluorescent filler. The sheet-like package body has a die-bonding region. The barricade is a...