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US20110073878 LED ARRAY PACKAGE COVERED WITH A HIGHLY THERMAL CONDUCTIVE PLATE  
A light source includes a substrate, a light emitting diode on the substrate, and a phosphor layer over the light emitting diode. A plate is on the phosphor layer. An attachment member is coupled...
US20130062654 LIGHT EXTRACTION SHEET, ORGANIC ELECTROLUMINESCENCE ELEMENT AND ILLUMINATION DEVICE  
Disclosed is a novel light extraction sheet which not only improves light extraction efficiency but suppresses color change with the angle of observation, an organic EL dement employing this light...
US20110309396 Led Module having a Platform with a Central Recession  
An LED module comprises a platform having a recession, wherein the recession presents a center section with a bottom and an enlarged section surrounding the center portion. An LED chip is arranged...
US20080023713 Package for Housing Light-Emitting Element and Method for Manufacturing Package for Housing Light-Emitting Element  
A package for housing a light-emitting element wherein a via hole for wiring provided so as to pass through an insulating substrate is arranged in such a manner that it is positioned under a...
US20100148201 LED PACKAGE  
There is provided an LED package including: a body unit; an LED chip mounted onto the body unit; lead frames mounted onto the body unit and electrically connected to the LED chip; and a reflection...
US20090289263 System and Method for Emitter Layer Shaping  
Embodiments of an LED disclosed has an emitter layer shaped to a controlled depth or height relative to a substrate of the LED to maximize the light output of the LED and to achieve a desired...
US20120193661 GAP ENGINEERING FOR FLIP-CHIP MOUNTED HORIZONTAL LEDS  
A horizontal LED die is flip-chip mounted on a mounting substrate to define a gap that extends between the closely spaced apart anode and cathode contacts of the LED die, and between the closely...
US20140077247 Phosphor-enhanced Lighting Device, Retrofit Light Bulb and Light Tube with Reduced Color Appearance  
A phosphor-enhanced lighting device 100, a retrofit light bulb, a light tube and a luminaire are provided. The phosphor-enhanced lighting 100 device comprises a light source 116, a light exit...
US20120153325 Integrated Reflector and Thermal Spreader and Thermal Spray Fabrication Method  
A low-cost integrated reflector and heat spreader for high-density high power solid-state (e.g., LED) lighting arrays includes a base structure onto which is applied a sacrificial material. A...
US20120074447 LIGHT EMITTING DIODE ELEMENT  
A light emitting diode element having a light emitting diode; and a glass covering sealing the light emitting diode is provided. The glass of the covering consists essentially of from 30 to 70 mol...
US20100059779 Light-Emitting Diode with Embedded Elements  
A light-emitting diode (LED) device is provided. The LED device has a substrate and an LED structure overlying the substrate. Embedded elements are embedded within one or more layers of the LED...
US20090321726 ENCAPSULATION FOR ORGANIC OPTOELECTRONIC DEVICES  
An organic optoelectronic device includes a substrate, an anode, a cathode, an active region comprising an organic material, an encapsulation that isolates the active region from an ambient...
US20090212314 YELLOW EMITTING PHOSPHORS BASED ON Ce3+-DOPED ALUMINATE AND VIA SOLID SOLUTION FOR SOLID-STATE LIGHTING APPLICATIONS  
A Ce3+ based aluminate phosphor or Ce3+ based phosphor in a solid solution can be used for white light generation when combined with a blue or ultraviolet light emitting diode.
US20110042706 AlxGa(1-x)As Substrate, Epitaxial Wafer for Infrared LEDs, Infrared LED, Method of Manufacturing AlxGa(1-x)As Substrate, Method of Manufacturing Epitaxial Wafer for Infrared LEDs, and Method of Manufacturing Infrared LEDs  
Affords AlxGa(1-x)As (0≦x≦1) substrates, epitaxial wafers for infrared LEDs, infrared LEDs, methods of manufacturing AlxGa(1-x)As substrates, methods of manufacturing epitaxial wafers for inf...
US20090321755 NANOCRYSTAL MIXTURE AND LIGHT-EMITTING DIODE USING THE SAME  
Disclosed is a light-emitting device. The light-emitting device comprises a blue light-emitting source and a light-emitting source. The light-emitting source includes first semiconductor...
US20140339593 LIGHT EMITTING DIODE (LED) COMPONENT COMPRISING A PHOSPHOR WITH IMPROVED EXCITATION PROPERTIES  
A light emitting diode (LED) component comprises an LED having a dominant wavelength in a range of from about 425 nm to less than 460 nm and a phosphor in optical communication with the LED. The...
US20100033987 Backlight Module and Light Emitting Diode Module Thereof  
A light emitting diode contains a package structure and a light emitting diode die embedded in the package structure. The package structure has an elliptic bottom surface having a semi-major axes...
US20090246895 APPARATUS AND METHODS FOR COMBINING LIGHT EMITTERS  
Provided are methods and apparatus for combining light emitters and devices including the same. Embodiments include methods of selecting combinations of multiple light emitters that are grouped...
US20120097982 Lighting Device  
A lighting device including an electroluminescent (EL) material is connected to an external power supply easily and the convenience is improved. In a lighting device having a light-emitting element...
US20070029565 Blue light-emitting phosphor and light-emitting device using the same  
A blue light-emitting phosphor emitting light with high efficiency by ultraviolet light of long wavelength as well as blue (to violet) light of short wavelength emitted from a semiconductor...
US20110001151 LED PACKAGES WITH SCATTERING PARTICLE REGIONS  
An LED package comprises at least one LED that emits LED light in an LED emission profile. The LED package includes regions of scattering particles with the different regions scattering light...
US20110193109 LED LIGHT MODULE  
A light emitting module is disclosed. The light emitting module includes a lead frame body, lead frame, a heat spreader, an intermediate heat sink, and at least one light emitting element (LED)....
US20100308346 LIGHT-EMITTING DIODE AND MODULE THEREOF  
A light-emitting diode module includes a transparent base, a support and a plurality of light-emitting chips. The base has a plurality of cavities separated from each other by a predetermined...
US20060086940 Package structure of multi-chips light-emitting module  
The present invention pertains to a package structure of multi-chips light-emitting module, wherein via the packaging technology of semiconductor, a plurality of light emitting diode chips are...
US20100230695 LED package structure  
An LED package structure includes an LED chip, an internal transparent colloidal layer, a fluorescent colloidal layer, and an external transparent colloidal layer. The internal transparent...
US20100032698 PARTICLE FOR DISPLAY MEDIUM AND INFORMATION DISPLAY PANEL USING SAME  
In the particles for display media used for an information display panel, in which at least one group of display media are sealed between two opposed substrates, at least one of two substrates...
US20130320373 LIGHT EMITTING DEVICE  
The present invention relates to a light emitting device comprising a transparent substrate which light can pass through and at least one LED chip emitting light omni-directionally. Wherein the LED...
US20080203413 Optoelectronic Components With Adhesion Agent  
SiO2 layers are used as adhesion layers in the case of optoelectronic components. Durable adhesions can be produced with silicone rubbers. These materials normally have only an insufficient...
US20090169071 Pseudo-Translucent Integrated Circuit Package  
An integrated circuit (IC) package includes at least one light source disposed together with an IC structure within an encapsulation structure. The material forming the encapsulation structure is...
US20090242917 Light-emitting device including light-emitting diode  
A light-emitting device includes a light-emitting diode, a red light-emitting phosphor layer, a yellow light-emitting phosphor layer, and a blue light-emitting phosphor layer. These layers are...
US20120228649 LED MODULE, METHOD FOR MANUFACTURING THE SAME, AND LED CHANNEL LETTER INCLUDING THE SAME  
Disclosed herein is a method for manufacturing a light emitting diode (LED) module, the method including: disposing a circuit board at a molding space formed by an upper mold and a lower mold;...
US20090001389 HYBRID VERTICAL CAVITY OF MULTIPLE WAVELENGTH LEDS  
A solid state device (200) for a hybrid vertical cavity of multiple wavelength LEDs is provided. The solid state device can include a hybrid vertical cavity formed by a cascading of a first...
US20070096127 Semiconductor micro-cavity light emitting diode  
A spontaneously light emitting nitride-based active region placed within a micro-cavity bounded by a first mirror and a second mirror, wherein the micro-cavity has been thinned to a resonant...
US20100084671 BRIGHTNESS ENHANCEMENT METHOD AND APPARATUS OF LIGHT EMITTING DIODES  
A light source with enhanced brightness includes an angle-selective optical filter and a light emitting diode (LED) having a high reflective layer. The angle-selective filter is located on the top...
US20100025706 NANOPARTICLE BASED INORGANIC BONDING MATERIAL  
A method for the production of a light emitting device is provided, comprising providing at least one LED 10 and at least one optical element 13; arranging a bonding material 12, comprising a...
US20120241784 LIGHT-EMITTING DIODE (LED) PACKAGE SYSTEMS AND METHODS OF MAKING THE SAME  
A light-emitting diode (LED) package system includes a LED disposed over a surface of a substrate. A molding material covers the LED. A phosphor-containing material is disposed over and spaced from...
US20140054573 Hidden organic optoelectronic devices  
An optoelectronic device comprising at least one optoelectronic active region comprising at least a rear electrode and a front electrode between which an organic optoelectronic material is...
US20080224159 Optical Element, Optoelectronic Component Comprising Said Element, and the Production Thereof  
The invention relates to an optical element (1, 25) having a defined shape and comprising a thermoplastic material that has been further cross-linked during or following the shaping thereof. Such...
US20060022210 Radiation-emitting semiconductor chip with a beam shaping element and beam shaping element  
In a radiation-emitting semiconductor chip (2) with a beam shaping element, the beam shaping element is a hollow body (1) with a light exit opening (7). In a first embodiment, the semiconductor...
US20100133563 ILLUMINATION SYSTEM COMPRISING A RADIATION SOURCE AND A LUMINESCENT MATERIAL  
An illumination system, comprising a radiation source and a luminescent material comprising at least one phosphor capable of absorbing a part of light emitted by the radiation source and emitting...
US20100295075 DOWN-CONVERTED LIGHT EMITTING DIODE WITH SIMPLIFIED LIGHT EXTRACTION  
A wavelength converted light emitting diode (LED) device has an LED having an output surface. A multilayer semiconductor wavelength converter is optically bonded to the LED. At least one of the LED...
US20100177497 EFFICIENT EMITTING LED PACKAGE AND METHOD FOR EFFICIENTLY EMITTING LIGHT  
An LED package comprises an LED for emitting LED light, and a conversion material remote to said LED for down-converting the wavelength of LED light. The package further comprises a reflector...
US20100072506 ULTRAVIOLET LIGHT EMITTING DIODE PACKAGE  
An ultraviolet light emitting diode package for emitting ultraviolet light is disclosed. The ultraviolet light emitting diode package comprises an LED chip emitting light with a peak wavelength of...
US20110164397 LED PACKAGE USING PHOSPHOR CONTAINING ELEMENTS AND LIGHT SOURCE CONTAINING SAME  
A light-emitting diode package is described comprising a body including a hollow having a rim that extends outwardly from an open end of the hollow. A light emitting diode is positioned in the...
US20110186897 POWER SURFACE MOUNT LIGHT EMITTING DIE PACKAGE  
A light emitting die package includes a substrate, a reflector plate, and a lens. The substrate has traces for connecting an external electrical power source to a light emitting diode (LED) at a...
US20110186896 POWER SURFACE MOUNT LIGHT EMITTING DIE PACKAGE  
A light emitting die package includes a substrate, a reflector plate, and a lens. The substrate has traces for connecting an external electrical power source to a light emitting diode (LED) at a...
US20110186895 POWER SURFACE MOUNT LIGHT EMITTING DIE PACKAGE  
A light emitting die package includes a substrate, a reflector plate, and a lens. The substrate has traces for connecting an external electrical power source to a light emitting diode (LED) at a...
US20100301372 POWER SURFACE MOUNT LIGHT EMITTING DIE PACKAGE  
A light emitting die package includes a substrate, a reflector plate, and a lens. The substrate has traces for connecting an external electrical power source to a light emitting diode (LED) at a...
US20140225145 LIGHT EMITTING DEVICE AND FABRICATING METHOD THEREOF  
A light-emitting device includes a light-emitting element for emitting primary light, and a wavelength conversion unit for absorbing part of the primary light and emitting secondary light having a...
US20100051989 LED AND METHOD FOR MAKING THE SAME  
An LED includes a substrate, an LED die, and a packaging layer. The substrate has conductive pins extending therethrough. The LED die is arranged on the substrate and electronically connected to...