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US20110233568 LED STREET LAMP  
Disclosed is a light emitting diode (LED) street lamp using an LED as a light source and capable of minimizing a luminance deviation within an illuminated area while increasing the luminance of...
US20140145221 LED LAMP STRUCTURE WITH HEAT SINK  
An LED lamp structure with a heat sink includes a reflection cup, an LED module, and a cover, in addition to the heat sink. The reflection cup has an inside bottom surface, a reflection surface,...
US20130105829 LED CHIP-BASED LIGHTING PRODUCTS AND METHODS OF BUILDING  
A method of building a light-emitting diode (LED) based lighting product includes mounting a plurality of unpackaged LED chips or LEDs directly on conductors on a surface of a two-sided panel,...
US20110133222 LED LAMP WITH REMOTE PHOSPHOR COATING AND METHOD OF MAKING THE LAMP  
A light emitting diode (LED) lamp includes a base with one or more LED chips, an internal cover over the LED chips, where the cover is a translucent ceramic whose thermal conductivity is greater...
US20110309386 LAMP HAVING OUTER SHELL TO RADIATE HEAT OF LIGHT SOURCE  
A lamp includes an outer shell having heat conductivity, a base provided in the outer shell, and a cover provided in the outer shell. The outer shell has a light source support, and a heat...
US20150171289 Substrate Insert Molding with Deposited Light-Generating Sources  
Disclosed herein are technologies related to film-insert molding (FIM) with deposited light-generating sources, such as printed light-emitting diodes. This Abstract is submitted with the...
US20140091329 LED Emitter with Improved White Color Appearance  
The present disclosure involves a lighting instrument. The lighting instrument includes a board or substrate, for example, a printed circuit board substrate. The lighting instrument includes a...
US20120261680 LED Array Having Embedded LED and Method Therefor  
An LED array comprises a base layer, at least one LED disposed on the base layer, and a diffusion layer including a luminescent material. The diffusion layer covers the at least one LED and the...
US20120043552 System and Method for Selected Pump LEDs with Multiple Phosphors  
An LED pump light with multiple phosphors is described. LEDs emitting radiation at violet and/or ultraviolet wavelengths are used to pump phosphor materials that emit other colors. The LEDs...
US20120187429 LED LIGHT SOURCE AND METHOD OF MANUFACTURING THE SAME  
After the LEDs 2 (red LEDs (R), green LEDs (G) and blue LEDs (B), or white LEDs (W)) are mounted on the frame 3, without dicing the frame 3 for dividing the LEDs 2 into pieces, the tie bar is...
US20110303928 LED LAMP  
An LED lamp A includes a plurality of LED modules 2 each including an LED chip 21, and a support member 1 including a support surface 1a on which the LED modules 2 are mounted. The LED modules 2...
US20140197429 METHOD OF ARRANGING A MULTIPLICITY OF LEDS IN PACKAGING UNITS, AND PACKAGING UNIT COMPRISING A MULTIPLICITY OF LEDS  
A method of arranging a multiplicity of LEDs in packaging units includes defining a desired range for at least one photometric measurement variable for each of the packaging units; selecting an...
US20130193463 Methods Of Integrating LED Chips With Heat Sinks, And Led-Based Lighting Assemblies Made Thereby  
An LED-based lighting assembly includes a heat sink having at least one pedestal with an upwardly facing, upper planar surface that is raised in a vertical direction relative to an upwardly...
US20140110682 PIXEL STRUCTURE OF ELECTROLUMINESCENT DISPLAY PANEL  
A pixel structure of an electroluminescent display panel having a first sub-pixel region and a second sub-pixel region is disclosed. The pixel structure includes a first organic light emitting...
US20120153307 LED LIGHTING DEVICE WITH EXCELLENT HEAT DISSIPATION PROPERTY  
The present invention relates to an improved LED lighting device with good heat dissipation, comprising: a housing; a copper circuit layer, disposed on the housing; a plurality of LED chips,...
US20150144972 MATRIX LEADFRAME FOR LED PACKAGING  
A leadframe (610) is formed that simplifies the packaging of light emitting elements and/or eliminates the need for stress-inducing folding after encapsulation. In particular, the folding of the...
US20150008457 FLIP-CHIP PHOSPHOR COATING METHOD AND DEVICES FABRICATED UTILIZING METHOD  
Methods for fabricating light emitting diode (LED) chips one of which comprises flip-chip mounting a plurality of LEDs on a surface of a submount wafer and forming a coating over said LEDs. The...
US20120025216 PHOSPHOR SUSPENDED IN SILICONE, MOLDED/FORMED AND USED IN A REMOTE PHOSPHOR CONFIGURATION  
A light emitting package comprising a support hosting at least one light emitting diode. A light transmissive dome comprised of a silicone including a phosphor material positioned to receive light...
US20090283778 Electroluminescent display useful for displaying a predetermined pattern  
An electroluminescent display comprising semiconductor nanocrystals, wherein the semiconductor nanocrystals are selected to emit light at a predetermined wavelength and are disposed in a...
US20110297971 LED LIGHTING DEVICE  
An LED lighting device A1 includes a plurality of LED chips 32, an LED unit 2 in which the LED chips 32 are mounted, and a mount 1 holding the LED unit 2. This arrangement allows the appearance or...
US20130134447 LOW-LIGHT-EMITTING-ANGLE HIGH-LUMINANCE UV LED NAIL LAMP STRUCTURE AND LED LIGHT SOURCE MODULE THEREOF  
A low-light-emitting-angle high-luminance ultraviolet (UV) light-emitting diode (LED) nail lamp structure and an LED light source module thereof are provided. The UV LED nail lamp structure...
US20130168703 DEPOSITION OF PHOSPHOR ON DIE TOP BY STENCIL PRINTING  
A method for depositing a layer of phosphor-containing material on a plurality of LED dies includes disposing a template with a plurality of openings on an adhesive tape and disposing each of a...
US20150228634 LED CIRCUIT  
An LED circuit (40) comprises integrated circuit LEDs (50) each mounted over a respective LED control circuit (42). The LED control circuits (42) are electrically connected together to by the...
US20120097988 LED Module  
A LED module has a LED chip, LED packaging materials, a metal base circuit board, a power connection cable, a heat sink that also functions as a metal case; and an optional potting material. The...
US20120049205 Structure of light-emitting diode (LED)  
A stricture of light-emitting diode includes a substrate, a board, light-emitting dies, and packages. The board forms spaced reflection receptacles, each of which has a side wall forming an...
US20130106812 DISPLAY PANEL, DISPLAY UNIT, AND ELECTRONIC UNIT  
A display panel includes: a plurality of first wirings extending in a row direction; a plurality of second wirings extending in a column direction; and a plurality of pixels each arranged in...
US20130313516 LED LAMPS WITH IMPROVED QUALITY OF LIGHT  
LED lamps having improved light quality are disclosed. The lamps emit more than 500 lm and more than 2% of the power in the spectral power distribution is emitted within a wavelength range from...
US20130175558 LED LIGHTING DEVICES  
Packaged chip-on-board (COB) LED arrays are provided where a color conversion medium is distributed within a glass containment plate, rather than silicone, to reduce the operating temperature of...
US20120061694 LIGHT-EMITTING STRUCTURE  
An embodiment of the present application discloses a light-emitting structure, comprising a first unit; a second unit; a trench formed between the first unit and the second unit, and having a less...
US20140183565 Light-Emitting Module Board and Manufacturing Method of the Light-Emitting Module Board  
A light-emitting module board includes a metal board provided with an insulating layer, a light-emitting part and a white insulating film. The light-emitting part includes plural LED chips mounted...
US20120032203 LED UNIT  
The LED unit 100 comprises a plurality of the LED module 1 and the heat radiation plate. Each the LED module 1 comprises the LED chip and the package for incorporating the LED chip therein; the...
US20110297973 LED WITH AN ADSORPTION PLATE  
The present invention relates to an LED with an adsorption plate attached thereto, and more particularly, to an LED which is covered with a light transmitter made of a light-transmitting material...
US20110073886 LED multi-side light source bracket  
The present invention relates to a LED multi-side light source bracket, in particular to the bracket design that extends in the rectangular shape directly above the conducting pin for distribution...
US20140306243 LIGHT EMITTING DEVICE  
A light emitting device includes a frame, a plurality of first light emitting units and a plurality of second light emitting units. The frame includes a base, a plurality of first pillars and a...
US20130146901 COMPRESSION VOLUME COMPENSATION  
A liquid-filled light emitting diode (LED) bulb including a base, a shell, one or more LEDs, a thermally conductive liquid, and a bladder. The shell is connected to the base and the thermally...
US20130134454 WATER RESISTANT LED DEVICES AND AN LED DISPLAY INCLUDING SAME  
The disclosure provides an LED package including a first plastic portion having a mounting surface and a lower surface. In some embodiments, the LED package includes a second portion surrounding...
US20150249182 Double-Sided LED and Fabrication Method Thereof  
A double-sided LED has a double-sided light emitting structure formed by electroplating or electrocasting without the need for wire bonding. The double-sided light emitting gives the chip a...
US20100038656 Nitride LEDs based on thick templates  
Thick HVPE templates of nitrides enhance both the growth conditions and resulting device performance of LEDs, power devices, solar cells, and other electrical elements. The use of HVPE templates...
US20130105825 LIGHT EMITTING DIODE ARRAY  
A light emitting diode array comprises a plurality of light emitting diode units connected in series and arranged for forming an array with n rows and m columns. At least one of the numbers m and...
US20130214296 HEAT SPREADING SUBSTRATE WITH EMBEDDED INTERCONNECTS  
Heat spreading substrate with embedded interconnects. In an embodiment in accordance with the present invention, an apparatus includes a metal parallelepiped comprising a plurality of wires inside...
US20130306994 DISPLAY PANEL  
A display panel includes a fiber reinforced plastic substrate having a first lattice pattern with a first lattice period P, and a pixel layer disposed on the substrate having a second lattice...
US20120074437 LED UNIT HAVING UNIFORM LIGHT EMISSION  
An LED unit includes a plurality of LEDs connected to each other and a plate supporting the LEDs. Each LED includes a base, a chip mounted on the base, a pair of leads fixed to the base and...
US20090267086 Thermal Management For LED  
A method and system for removing heat from an LED facilitates the fabrication of LEDs having enhanced brightness. A thermally conductive interposer can be attached to the top of the LED. Heat can...
US20120007106 ORGANIC LIGHT EMITTING DIODE DISPLAY  
An organic light emitting diode (OLED) display according to an exemplary embodiment includes an organic light emitting display panel that includes an organic light emitting member, a polarizing...
US20140299893 Conductive Connector For Use With Circuit Board, and LED Module Having the Same  
A conductive connector for use with circuit boards is characterized in that a conductive connection plug and a conductive connection socket are disposed on two circuit boards, respectively. The...
US20120187428 METHOD FOR THE PRODUCTION OF WHITE LEDS AND WHITE LED LIGHT SOURCE  
For the production of a white LED having a predetermined color temperature, a blue LED (2a-2d) or a UV LED is coated with a conversion layer (5) which absorbs the blue light or UV light and emits...
US20130234126 ORGANIC EL DISPLAY PANEL AND METHOD FOR MANUFACTURING SAME  
The present invention provides an organic EL display panel such that, even when a light emitting layer is formed in a line bank, generation of brightness unevenness and emission color unevenness...
US20150214445 LED (LIGHT-EMITTING DIODE) ENCAPSULATION AND MANUFACTURING METHOD THEREOF  
The present invention provides an LED encapsulation and a manufacturing method thereof. The LED encapsulation includes: a first frame (10), a plurality of LED elements (20), encapsulant (30), and...
US20130009179 COMPACT OPTICALLY EFFICIENT SOLID STATE LIGHT SOURCE WITH INTEGRATED THERMAL MANAGEMENT  
A compact and efficient LED array lighting component comprising a circuit board with an array of LED chips mounted on it and electrically interconnected. A plurality of primary lenses is included,...
US20140077177 LIFETIME OLED DISPLAY  
Light emitting devices including sub-pixels having different numbers of emissive layers are provided. At least one sub-pixel of a first color may include a single emissive layer, and at least one...