Matches 1 - 50 out of 74 1 2 >


Match Document Document Title
US20080185737 INTEGRATED CIRCUIT SYSTEM WITH PRE-CONFIGURED BOND WIRE BALL  
An integrated circuit system is provided including forming a wire ball on a bond wire; forming a shaped ball from the wire ball; and attaching the shaped ball on an integrated circuit die.
US20050275096 Pre-doped reflow interconnections for copper pads  
A metal interconnect structure (100) comprising a bond pad (110) of copper; a body (103) of eutectic alloy in contact with the bond pad, this alloy including copper; and a contact pad (120)...
US20150137390 ALUMINUM COATED COPPER RIBBON  
A ribbon, preferably a bonding ribbon for bonding in microelectronics, contains a first layer containing copper, a coating layer containing aluminum superimposed over the first layer, and an...
US20120223432 MOISTURE BARRIER FOR A WIRE BOND  
An electronic device comprising a bond pad on a substrate and a wire bonded to the bond pad. The device further comprises an intermetallic compound interface located between the bond pad and the...
US20070069393 Wiring board embedded with spherical semiconductor element  
A double-sided or multilayer wiring board having high-density wiring is obtained by embedding a spherical semiconductor element in an electrically insulating substrate which composes the wiring...
US20060017176 Bump ball device and placing method thereof  
The present invention provides a bump ball device and a placing method thereof. The bump ball device having a die on which I/O terminal of a plurality of circuit elements are arranged, includes: a...
US20130241083 Joint Structure for Substrates and Methods of Forming  
Disclosed embodiments include wire joints and methods of forming wire joints that can enable realization of fine pitch joints and collapse control for various packages. A first embodiment is a...
US20080230925 SOLDER-BUMPING STRUCTURES PRODUCED BY A SOLDER BUMPING METHOD  
A method for solder bumping provides a substrate and forms a film on the substrate. The film has openings therethrough. A stencil is aligned on the film. The stencil has openings therethrough over...
US20070096338 Semiconductor package having non-solder mask defined bonding pads and solder mask defined bonding pads, printed circuit board and semiconductor module having the same  
A semiconductor package may include a semiconductor chip and a substrate. The substrate may include a plurality of bonding pads for interfacing the semiconductor chip with a printed circuit board...
US20090294994 BOND PAD STRUCTURE  
A bond pad structure located over an active circuit structure is disclosed. The bond pad structure includes a bond pad, a passivation layer and a topmost metal layer in the active circuit...
US20070114674 Hybrid solder pad  
Disclosed herein is a solder pad interface for a solder joint on a substrate. The solder pad interface includes a soldermask defined (SMD) interface between a solder pad (202) and the substrate,...
US20070284758 Electronics package and associated method  
An electronics package is provided. The electronics package may include an underfill layer having a surface that defines an opening. The electronics package may include a polymer bump structure...
US20150145148 Copper Ball Bond Interface Structure and Formation  
An integrated circuit copper wire bond connection is provided having a copper ball (32) bonded directly to an aluminum bond pad (31) formed on a low-k dielectric layer (30) to form a bond...
US20060012055 Semiconductor package including rivet for bonding of lead posts  
A semiconductor device (30,30′) includes a semiconductor die (32, 32′) having bonding pads (34, 34′) and ball bumps (38, 38′). Each of the ball bumps (38, 38′) has a base portion (40, 40′) and a...
US20050054187 Method for forming ball pads of BGA substrate  
A method for forming ball pads of a BGA substrate is disclosed. A substrate is provided with a plurality of pad terminals on its surface. A solder mask is formed on the surface and has a plurality...
US20070158857 Semiconductor device having a plurality of semiconductor constructs  
A semiconductor device includes a plurality of semiconductor constructs, each of the semiconductor constructs including a semiconductor substrate and external connection electrodes provided on an...
US20060012041 Connection between two circuitry components  
A semiconductor chip or wafer includes a passivation layer, a pad and a bump. The pad is exposed by an opening in the passivation layer. The bump is connected to the pad, wherein the area of the...
US20150262961 Wedge Bond Foot Jumper Connections  
A semiconductor device includes a substrate, first and second bond pad structures supported by the substrate and spaced from one another by a gap, and a wire bond foot jumper extending across the...
US20080296780 MEMORY DEVICES INCLUDING SEPARATING INSULATING STRUCTURES ON WIRES AND METHODS OF FORMING  
Wires included in integrated circuit devices can have separate insulating structures formed thereon. The separate insulating structures on the wires can surround respective cross sectional...
US20080116589 Ball grid array package assembly with integrated voltage regulator  
An integrated voltage regulator may be provided on the bottom of a ball grid array processor package. This may be done despite the fact that conventionally integrated voltage regulator chips are...
US20130285263 SENSOR ARRAY PACKAGE  
A sensor array package can include a sensor disposed on a first side of a substrate. Signal trenches can be formed along the edges of the substrate and a conductive layer can be deposited in the...
US20110285020 MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED INDUCTANCE  
A microelectronic assembly includes a semiconductor chip having chip contacts exposed at a first face and a substrate juxtaposed with a face of the chip. A conductive bond element can electrically...
US20070057382 Electronic package with compliant electrically-conductive ball interconnect  
An electronic device comprises a device substrate, a plurality of compliant electrically-conductive balls, and a plurality of solder joints that couple the compliant electrically-conductive balls...
US20100213619 BONDING STRUCTURE OF BONDING WIRE AND METHOD FOR FORMING SAME  
Provided is a bonding structure of a bonding wire and a method for forming the same which can solve problems of conventional technologies in practical application of a multilayer copper wire,...
US20070069394 SOLDER BUMP STRUCTURE FOR FLIP CHIP SEMICONDUCTOR DEVICES AND METHOD OF MANUFACTURE THEREFORE  
The invention provides, in one aspect, a semiconductor device that comprises an interconnect layer located over a semiconductor substrate. A passivation layer is located over the interconnect...
US20050206011 Circuit module  
The present invention is intended to miniaturize a circuit module including a pressure sensing element. In a circuit module of this embodiment, a laminated sheet to which a pressure sensing...
US20050218528 Capillary underfill channel  
An interposer, between a die and a substrate, has a body with a first surface, an opposite second surface, and a channel that passes from the first surface, through the body to the opposite second...
US20050104222 Flip chip device having supportable bar and mounting structure thereof  
A flip chip device may have a semiconductor chip with an active surface on which chip pads and a protective layer may be provided. Solder bumps may be provided on the active surface and...
US20050285266 Arrangement for increasing the reliability of substrate-based BGA packages  
An arrangement increases the reliability of substrate-based Ball-Grid-Array (BGA) packages, with a die (chip) that is mounted on a substrate and electrically connected to interconnects of the...
US20060192297 System and method for reducing voltage drops in integrated circuits  
In one embodiment, a die arrangement is disclosed in which a wire-bond pad may be operatively coupled to a power supply via a wire bond. A first pad may be operatively coupled to the wire-bond...
US20050133928 Wire loop grid array package  
A device comprising a workpiece (401) with a surface (401a) including a center (402) and an array of bond pads (420), further an array of interconnects (405) of uniform height. Each of these...
US20050093153 BGA package with component protection on bottom  
A ball grid array (BGA) package includes an electronic component mounted on its bottom. Formed on the lower surface of the substrate are the electronic component, a plurality of standoffs and a...
US20050156329 Semiconductor device by embedded package  
A semiconductor device by embedded package has a good mechanical property for assembly on the machine, especially for installation on a vehicle. The semiconductor device by embedded package can...
US20110079877 MOUNTING CIRCUIT SUBSTRATE  
A semiconductor package containing a field effect transistor (FET) used in a high frequency band includes a mounting circuit substrate on which the semiconductor device is mounted. The mounting...
US20050093173 Semiconductor package having dicrete non-active electrical components incorporated into the package  
Embodiments of the invention include a semiconductor integrated circuit package that includes a substrate having an integrated circuit die attached thereto. The substrate further includes at least...
US20050082670 Method for preapplying a viscous material to strengthen solder connections in microelectronic packaging and microelectronic packages formed thereby  
Apparatus and methods for preapplying discrete amounts of underfill material of a component on a component substrate before the solder bumps of the component are joined by reflow with a packaging...
US20050056944 Super-thin high speed flip chip package  
A chip package achieves miniaturization and excellent high-speed operation by employing flip chip interconnection between the die and the package substrate, and mounting the chip on the same side...
US20080197473 CHIP HOLDER WITH WAFER LEVEL REDISTRIBUTION LAYER  
A chip holder formed of silicon, glass, other ceramics or other suitable materials includes a plurality of recesses for retaining semiconductor chips. The bond pads of the semiconductor chip are...
US20130292856 METHOD FOR THE WAFER-LEVEL INTEGRATION OF SHAPE MEMORY ALLOY WIRES  
The present invention relates to a method to attach a shape memory alloy wire to a substrate, where the wire is mechanically attached into a 3D structure on the substrate. The present invention...
US20070164451 Power configuration method for structured ASICs  
A method for electrically coupling a bond pad of an integrated circuit such as a field programmable device, an application-specific integrated circuit, or a rapid chip with an input/output device...
US20060273468 Configuration for multi-layer ball grid array  
Disclosed herein is a method and circuit arrangement for a multi-layer ball grid array configuration. In one embodiment, there is presented a board comprising a first surface, a second surface,...
US20070205520 CHIP PACKAGE AND METHOD FOR FABRICATING THE SAME  
A chip package includes a semiconductor substrate, a first metal pad over the semiconductor substrate, and a second metal pad over the semiconductor substrate. In a case, the first metal pad is...
US20080308926 Heat dissipation package structure and method for fabricating the same  
A heat dissipation package structure and method for fabricating the same are disclosed, which includes mounting and electrically connecting a semiconductor chip to a chip carrier through its...
US20090039526 PACKAGE AND THE METHOD FOR MAKING THE SAME, AND A STACKED PACKAGE  
The present invention relates to a package and the method for making the same, and a stacked package. The method for making the package includes the following steps: (a) providing a carrier having...
US20090115074 Method of Processing a Contact Pad, Method of Manufacturing a Contact Pad, and Integrated Circuit Element  
In a method of processing a contact pad, a passivation layer stack including at least one passivation layer is formed on at least an upper surface of a contact pad region. A first portion of the...
US20130001780 MULTI-COMPONENT INTEGRATED CIRCUIT CONTACTS  
An integrated circuit connection is describe that includes a first, securing member and a second, connection member. The first member, in an embodiment, is a spike that has a portion of its body...
US20100225008 WIRE BOND INTERCONNECTION  
A wire bond interconnection between a die pad and a bond finger includes a support pedestal at a bond site of the lead finger, a ball bond on the die pad, and a stitch bond on the support...
US20080036098 CONFIGURABLE UNIVERSAL INTERCONNECT DEVICE  
A universal interconnect device for mounting and interconnecting a semiconductor integrated circuit die in preparation for mounting to another substrate such as a printed circuit board. The device...
US20080012149 Semiconductor chip structure  
A semiconductor chip structure includes a top metal layer and an inter-layer dielectric under the top metal layer. The top metal layer includes a bonding pad area and a non-bonding pad area. The...
US20070102829 CHIP STRUCTURE WITH SOLDER BUMP AND METHOD FOR PRODUCING THE SAME  
A chip structure with solder bumps and the method for producing the same are disclosed. The chip structure with solder bumps includes a chip, a plurality of pads arranged on one surface of the...

Matches 1 - 50 out of 74 1 2 >