Match Document Document Title
US20140339697 Solder Bump for Ball Grid Array  
A solder bump structure for a ball grid array (BGA) includes at least one under bump metal (UBM) layer and a solder bump formed over the at least one UBM layer. The solder bump has a bump width...
US20130127045 MECHANISMS FOR FORMING FINE-PITCH COPPER BUMP STRUCTURES  
The mechanisms of forming a copper post structures described enable formation of copper post structures on a flat conductive surface. In addition, the copper post structures are supported by a...
US20150048499 FINE-PITCH PILLAR BUMP LAYOUT STRUCTURE ON CHIP  
Disclosed is a fine-pitch pillar bump layout structure on chip, comprising a chip, a passivation layer and at least two pillar bumps. Bonding pads of the chip are disposed along an X-axis....
US20110304042 Copper Bump Structures Having Sidewall Protection Layers  
A work piece includes a copper bump having a top surface and sidewalls. A protection layer is formed on the sidewalls, and not on the top surface, of the copper bump. The protection layer includes...
US20130320524 Design Scheme for Connector Site Spacing and Resulting Structures  
A system and method for preventing cracks in a passivation layer is provided. In an embodiment a contact pad has a first diameter and an opening through the passivation layer has a second...
US20110108981 REDISTRIBUTION LAYER ENHANCEMENT TO IMPROVE RELIABILITY OF WAFER LEVEL PACKAGING  
An enhanced redistribution layer is provided that geometrically expands redistribution layer (RDL) pads associated with a ball grid array of a wafer level package (WLP) to provide tensile stress...
US20140291838 Design Scheme for Connector Site Spacing and Resulting Structures  
A system and method for preventing cracks in a passivation layer is provided. In an embodiment a contact pad has a first diameter and an opening through the passivation layer has a second...
US20140077359 Ladder Bump Structures and Methods of Making Same  
An embodiment ladder bump structure includes an under bump metallurgy (UBM) feature supported by a substrate, a copper pillar mounted on the UBM feature, the copper pillar having a tapering curved...
US20140124877 CONDUCTIVE INTERCONNECT INCLUDING AN INORGANIC COLLAR  
A conductive interconnect includes an inorganic collar. The conductive interconnect includes a conductive support layer. The conductive interconnect also includes a conductive material on the...
US20140361432 Pillar Design for Conductive Bump  
A system and method for conductive pillars is provided. An embodiment comprises a conductive pillar having trenches located around its outer edge. The trenches are used to channel conductive...
US20130020698 Pillar Design for Conductive Bump  
A system and method for conductive pillars is provided. An embodiment comprises a conductive pillar having trenches located around its outer edge. The trenches are used to channel conductive...
US20140061898 Metal Pads with Openings in Integrated Circuits  
A device includes a metal pad, and a passivation layer including portions overlapping edge portions of the metal pad. A Post-Passivation-Interconnect (PPI) includes a trace portion overlying the...
US20120112343 ELECTROPLATED POSTS WITH REDUCED TOPOGRAPHY AND STRESS  
Bond pads on an integrated circuit are provided with planarizing dielectric structures to permit the electroplating of metal posts having planar top surfaces. The metal posts contact at least...
US20150130061 Bump-on-Trace Methods and Structures in Packaging  
A method and structure for bump-on-trace bonding is provided. In an embodiment traces to be used for bump-on-trace (BOT) bonding are protected during a pre-solder treatment. The pre-solder...
US20110298123 CU PILLAR BUMP WITH NON-METAL SIDEWALL SPACER AND METAL TOP CAP  
A bump has a non-metal sidewall spacer on a lower sidewall portion of Cu pillar, and a metal top cap on a top surface and an upper sidewall portion of the Cu pillar. The metal top cap is formed by...
US20140061901 Precise-Aligned Lock-And-Key Bonding Structures  
Copper (Cu)-to-Cu bonding techniques are provided. In one aspect, a bonding method is provided. The method includes the following steps. A first bonding structure is provided having at least one...
US20140077360 Interconnection Structure and Method of Forming Same  
An embodiment bump on trace (BOT) structure includes a contact element supported by an integrated circuit, an under bump metallurgy (UBM) feature electrically coupled to the contact element, a...
US20110115077 Method for Reducing Voids in a Copper-Tin Interface and Structure Formed Thereby  
An embodiment is a method for forming a semiconductor assembly comprising cleaning a connector comprising copper formed on a substrate, applying cold tin to the connector, applying hot tin to the...
US20150194405 Protrusion Bump Pads for Bond-on-Trace Processing  
An embodiment apparatus includes a dielectric layer, a conductive trace in the dielectric layer, and a bump pad. The conductive trace includes a first portion having an exposed top surface,...
US20140021600 REDISTRIBUTION LAYER (RDL) WITH VARIABLE OFFSET BUMPS  
An integrated circuit (IC) chip is disclosed including a plurality of metal vertical interconnect accesses (vias) in a back end of line (BEOL) layer, a redistribution layer (RDL) on the BEOL...
US20140203430 INTERCONNECTION DESIGNS AND MATERIALS HAVING IMPROVED STRENGTH AND FATIGUE LIFE  
Methods and designs for increasing interconnect areas for interconnect bumps are disclosed. An interconnect bump may be formed on a substrate such that the interconnect bump extends beyond a...
US20140091456 USING COLLAPSE LIMITER STRUCTURES BETWEEN ELEMENTS TO REDUCE SOLDER BUMP BRIDGING  
Provided are an electronic assembly and method for forming the same, comprising a first element having a first surface and a second element having a second surface. Electrical connections are...
US20120133042 MOUNTING STRUCTURE OF CHIP AND MODULE USING THE SAME  
A mounting structure of chip comprises a substrate having a base, a chip on the upper surface of the base, and adhesive agents which bonds the base and the first chip. The adhesive agent is...
US20130154089 BUMP INCLUDING DIFFUSION BARRIER BI-LAYER AND MANUFACTURING METHOD THEREOF  
Provided herein is a bump including a diffusion barrier bi-layer, the bump having: a conductive layer; a first diffusion barrier layer formed on or above the conductive layer, and comprising an...
US20110062580 PROTECTION LAYER FOR PREVENTING UBM LAYER FROM CHEMICAL ATTACK AND OXIDATION  
A protection layer formed of a CuGeyNz layer, a CuSixNz layer, a CuSixGeyNz layer or combinations thereof is formed on an under-bump metallurgy (UBM) layer for preventing the UBM layer from...
US20140077368 REPAIRING ANOMALOUS STIFF PILLAR BUMPS  
A system for repairing pillar bumps includes a pillar bump repair device that is adapted to form a plurality of strain-relieving notches in a pillar bump that is positioned above a metallization...
US20120306070 Electrical Connection for Chip Scale Packaging  
A system and method for providing a post-passivation and underbump metallization is provided. An embodiment comprises a post-passivation layer that is larger than an overlying underbump...
US20130270699 Conical-Shaped or Tier-Shaped Pillar Connections  
A pillar structure for a substrate is provided. The pillar structure may have one or more tiers, where each tier may have a conical shape or a spherical shape. In an embodiment, the pillar...
US20140084460 Contact bumps methods of making contact bumps  
Contact bumps between a contact pad and a substrate can include recesses and protrusions that can mate with the material of the substrate. The irregular mating surfaces between the contact bumps...
US20110156253 MICRO-BUMP STRUCTURE  
A dished micro-bump structure with self-aligning functions is provided. The micro-bump structure takes advantage of the central concavity for achieving the accurate alignment with the...
US20130001774 ELECTRICALLY CONDUCTIVE PASTE, AND ELECTRICALLY CONDUCTIVE CONNECTION MEMBER PRODUCED USING THE PASTE  
Providing the conductive paste for the material forming the conductive connecting member without disproportionately located holes (gaps), coarse voids, and cracks, which improves thermal cycle and...
US20120193778 INTEGRATED CIRCUIT HAVING PROTRUDING BONDING FEATURES WITH REINFORCING DIELECTRIC SUPPORTS  
An integrated circuit (IC) die includes a substrate including a topside surface having active circuitry and a bottomside surface. A plurality of protruding bonding features are on the topside...
US20120199967 Interconnection Structure  
An electrical interconnect for connecting an IC chip to a PCB, the electrical interconnect comprising a plurality of connection elements for connection to the PCB attached to a first surface of...
US20140175635 PACKAGING STRUCTURE  
A packaging structure is provided. The packaging structure includes first and second chips, at least one surface of each of the first and second chips being an active surface and a common chip to...
US20130228918 THREE-DIMENSIONAL INTEGRATED CIRCUIT WHICH INCORPORATES A GLASS INTERPOSER AND METHOD FOR FABRICATING THE SAME  
A three-dimensional integrated circuit (3D-IC) which incorporates a glass interposer and a method for fabricating the three-dimensional integrated circuit (3D-IC) with the glass interposer are...
US20110169157 SUBSTRATE AND FLIP CHIP PACKAGE WITH GRADATIONAL PAD PITCHES  
A flip-chip packaging substrate with gradational pad pitches for flip-chip jointing a bumped chip and a flip chip package utilizing the substrate are revealed. A plurality of connecting pads with...
US20140231987 Connector Structures of Integrated Circuits  
A die includes a substrate, a metal pad over the substrate, and a passivation layer covering edge portions of the metal pad. A metal pillar is formed over the metal pad. A portion of the metal...
US20130093079 Connector Structures of Integrated Circuits  
A die includes a substrate, a metal pad over the substrate, and a passivation layer covering edge portions of the metal pad. A metal pillar is formed over the metal pad. A portion of the metal...
US20120261813 REINFORCED VIA FARM INTERCONNECT STRUCTURE, A METHOD OF FORMING A REINFORCED VIA FARM INTERCONNECT STRUCTURE AND A METHOD OF REDESIGNING AN INTEGRATED CIRCUIT CHIP TO INCLUDE SUCH A REINFORCED VIA FARM INTERCONNECT STRUCTURE  
Disclosed is reinforced via farm interconnect structure for an integrated circuit chip that minimizes delamination caused by tensile stresses applied to the chip through lead-free C4 connections...
US20110272802 BUMP, METHOD FOR FORMING THE BUMP, AND METHOD FOR MOUNTING SUBSTRATE HAVING THE BUMP THEREON  
A two-layer structure bump including a first bump layer of a bulk body of a first conductive metal, which is any of gold, copper, and nickel, formed on a substrate and a second bump layer of a...
US20120049346 Pillar Bumps and Process for Making Same  
Apparatus and methods for providing solder pillar bumps. Pillar bump connections are formed on input/output terminals for integrated circuits by forming a pillar of conductive material using...
US20120319269 Enhanced Bump Pitch Scaling  
An integrated circuit (IC) device is provided. In an embodiment the IC device includes an IC die configured to be bonded onto an IC routing member and a first plurality of pads that is located on...
US20110316148 WIRING SUBSTRATE  
A wiring substrate includes plural wiring layers and plural insulation layers being alternately stacked one on top of the other. The plural insulation layers are formed with insulation resin...
US20110101527 MECHANISMS FOR FORMING COPPER PILLAR BUMPS  
The mechanism of forming a metal bump structure described above resolves the delamination issues between a conductive layer on a substrate and a metal bump connected to the conductive layer. The...
US20110049705 SELF-ALIGNED PROTECTION LAYER FOR COPPER POST STRUCTURE  
A copper post is formed in a passivation layer to electrically connect an underlying bond pad region, and extends to protrude from the passivation layer. A protection layer is formed on a sidewall...
US20060113667 Bond pad structure for gold wire bonding to copper low K dielectric silicon devices  
A bond pad structure which improves the reliability of the gold bonds, and thus, of the device. The bond pad structure allows for small gold bonds, which increases the density of the device. One...
US20120091577 COPPER PILLAR BUMP WITH COBALT-CONTAINING SIDEWALL PROTECTION  
An integrated circuit device includes a Cu pillar and a solder layer overlying the Cu pillar. A Co-containing metallization layer is formed to cover the Cu pillar and the solder layer, and then a...
US20140117532 Bump Interconnection Ratio for Robust CPI Window  
The disclosure is directed to a device and method for manufacture thereof. The device includes a first workpiece bonded to a second workpiece by a bump interconnection structure. The bump...
US20110006415 SOLDER INTERCONNECT BY ADDITION OF COPPER  
A method of forming an electronic device provides an electronic device substrate having a solder bump pad located thereover. A nickel-containing layer is located over the solder bump pad. A...
US20110291275 METHOD OF ASSEMBLING CHIPS  
A method of assembling chips. A first chip and a second chip are provided. At least one conductive pillar is formed on the first chip, and a conductive connecting material is formed on the...