|
Match
|
Document |
Document Title |
|
|
US20090236737 |
RF TRANSISTOR OUTPUT IMPEDANCE TECHNIQUE FOR IMPROVED EFFICIENCY, OUTPUT POWER, AND BANDWIDTH
An RF/microwave circuit is configured to eliminate the physical constraint that requires a sacrifice of one output series inductor wirebond for each shunt inductor wirebond. The circuit employs a...
|
|
|
US20090206473 |
System and Method for Integrated Waveguide Packaging
A millimeter wave system or package may include at least one printed wiring board (PWB), at least one integrated waveguide interface, and at least one monolithic microwave integrated circuit...
|
|
|
US20090206474 |
ELECTRICAL DEVICE AND METHOD OF MANUFACTURING ELECTRICAL DEVICES USING FILM EMBOSSING TECHNIQUES TO EMBED INTEGRATED CIRCUITS INTO FILM
An electrical device and method of making same is provided wherein a chip or other electrical component is embedded in a substrate. The substrate may be a thermoplastic material capable of...
|
|
|
US20090127675 |
SEMICONDUCTOR PACKAGE
A semiconductor package includes a base substrate on which semiconductor elements are disposed; a covering member which is provided to the base substrate, which covers the semiconductor elements,...
|
|
|
US20090085200 |
LOW LOSS RADIO FREQUENCY SIGNAL COMMUNICATION WITHIN A PACKAGE, A BOARD AND/OR A WAVE GUIDE
In some embodiments an integrated circuit package includes a coaxial arrangement of one or more ground via surrounding a signal via. The one or more ground via and the signal via extend through the...
|
|
|
US20090014867 |
SEAL RING FOR GLASS WALL MICROELECTRONICS PACKAGE
A seal ring formed from a conductive material has at least one recessed area formed on an internal or external surface which is dimensioned to permit attachment of a wire bond so that the wire and...
|
|
|
US20080296745 |
SEMICONDUCTOR DEVICE HAVING SEMICONDUCTOR CHIP AND ANTENNA
A semiconductor device comprises a lead frame, an antenna formed at a predetermined position on the lead frame, and a semiconductor chip. The semiconductor chip is mounted on an island of the lead...
|
|
|
US20080227284 |
Wire bonding method and related device for high-frequency applications
A wire bond circuit device has a circuit die in which substantially all of the input/output (I/O) pads are disposed along the outermost row of pads. A substrate onto which the die is disposed has...
|
|
|
US20080203561 |
HIGH FREQUENCY DEVICE MODULE AND MANUFACTURING METHOD THEREOF
A high frequency device module of an embodiment of a current invention includes: an insulation substrate in which electrodes are provided on the front surface thereof and a grounding substrate is...
|
|
|
US20080150129 |
Transceiver Device
A transceiver device includes a dielectric substrate, a ring member that is welded onto the dielectric substrate thereby forming a plurality of cavities, a cover that is welded onto the ring...
|
|
|
US20080093731 |
Cooled Integrated Circuit
The invention relates to an integrated circuit ( 1 ) having a plurality of substrate layers ( 2 ), active and/or passive components ( 3 ) embedded in the substrate layers ( 2 ), high-frequency...
|
|
|
US20080029886 |
Versatile Si-based packaging with integrated passive components for mmWave applications
An apparatus is described incorporating an interposer having a cavity for a portion of an antenna structure, having conductor through vias, a top Si part having interconnection wiring and having...
|