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US20090289353 COVERED DEVICES IN A SEMICONDUCTOR PACKAGE  
An embodiment of the present invention is a technique to fabricate a cover assembly. A cover has a base plate and sidewalls attached to perimeter of the base plate. The sidewalls have a height. A...
US20090289352 SEMICONDUCTOR DEVICE AND A METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE  
A semiconductor device includes: a first substrate, having a grounding layer and holes formed therein for filling with an electroconductive material; a semiconductor chip over such first substrate;...
US20090289351 Semiconductor apparatus having both-side heat radiation structure and method for manufacturing the same  
A semiconductor apparatus having a first surface and a second surface opposite to the first surface includes: a semiconductor chip having a front side and a backside; a first heat radiation member...
US20090289268 LIGHT EMITTING APPARATUS AND SEMICONDUCTOR APPARATUS, AND METHOD FOR MANUFACTURING THE SAME  
A semiconductor apparatus and a light emitting apparatus which are capable of efficiently dissipating the heat generated by a semiconductor device and have high reliability, and a method for...
US20090273077 MULTI-LID SEMICONDUCTOR PACKAGE  
A multi-lid semiconductor package includes one or more die disposed on a substrate, an interconnect disposed on the substrate, one or more die lids, a die thermal interface between the one or more...
US20090273068 3-D Integrated Circuit Lateral Heat Dissipation  
By filling an air gap between tiers of a stacked IC device with a thermally conductive material, heat generated at one or more locations within one of the tiers can be laterally displaced. The...
US20090256161 POWER CONVERSION APPARATUS  
In the case where a chip is made of wide band gap semiconductor, a power conversion apparatus is obtained in which a component having a low heat resistant temperature is prevented from receiving...
US20090250807 Electronic Component and Method for its Production  
An electronic component includes a number of leads and at least one cooling element. The bottom surface of the cooling element is exposed and the material of the cooling element is different from...
US20090250806 SEMICONDUCTOR PACKAGE USING AN ACTIVE TYPE HEAT-SPREADING ELEMENT  
A semiconductor package includes a carrier, a chip, a stiffener, a heat spreader and an active type heat-spreading element. The chip and the stiffener are disposed on the carrier. The heat spreader...
US20090243086 Enhanced Thermal Dissipation Ball Grid Array Package  
In a semiconductor chip, a thermal adhesive is used to bond an internal heat spreader to an active functional die. In an alternative embodiment a dummy die is place directly on top of the active...
US20090243085 APPARATUS AND METHOD FOR ATTACHING A HEAT DISSIPATING DEVICE  
A microelectronic package is provided. The microelectronic package includes a heat dissipating device having a top side and a bottom side and a thermal interface material disposed adjacent to the...
US20090242914 LED ASSEMBLY WITH HIGH HEAT DISSIPATING CAPABILITY  
An LED assembly includes a substrate and a plurality of LEDs mounted on the substrate. Each LED comprises an LED die mounted on the substrate via an adhesive, a base spacedly surrounding the LED...
US20090230569 DEVICE COMPRISING A SEMICONDUCTOR CMPONENT, AND A MANUFACTURING METHOD  
A device having at least one semiconductor component, which is covered by a protective material on its outer surface. The invention provides for the outer surface to be provided with a surface...
US20090230544 HEAT SINK STRUCTURE AND SEMICONDUCTOR PACKAGE AS WELL AS METHOD FOR CONFIGURING HEAT SINKS ON A SEMICONDUCTOR PACKAGE  
A heat sink structure according to the present invention is provided. The heat sink has a through opening extending from the upper surface through to the lower surface. A solder is disposed in the...
US20090230543 Semiconductor package structure with heat sink  
A semiconductor package structure with a heat sink is disclosed herein. The semiconductor package structure includes a substrate having a chip mounting area and a plurality of through holes...
US20090230528 Support Mounted Electrically Interconnected Die Assembly  
Stacked die assemblies are electrically connected to connection sites on any support, without electrical connection to any interposed substrate or leadframe, and without solder.
US20090224399 Silicon nitride substrate, method of manufacturing the same, and silicon nitride circuit board and semiconductor module using the same  
A silicon nitride substrate having appropriately adjusted warpage and surface roughness can be obtained by mixing magnesium oxide of 3 to 4 wt % and at least one kind of rare-earth element oxide of...
US20090224393 SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF  
The present invention provides a semiconductor device capable of eliminating voltage (IR) drop of a semiconductor die inside the semiconductor device and a fabricating method of the semiconductor...
US20090218680 PROCESS OF GROUNDING HEAT SPREADER/STIFFENER TO A FLIP CHIP PACKAGE USING SOLDER AND FILM ADHESIVE  
A method of grounding a heat spreader/stiffener to a flip chip package comprising the steps of attaching an adhesive film to a substrate and attaching a stiffener to the adhesive film. The adhesive...
US20090218589 Semiconductor die with reduced thermal boundary resistance  
Thermal boundary resistances within nitride semiconductor LEDs are reduced or eliminated by forming a thick nitride epitaxial layer, which can be separated from a growth substrate, and by reducing...
US20090212417 Semiconductor Device  
A semiconductor device including: a heat sink, a die on the heat sink, resin encapsulating the die, and a mounting aperture in the resin having at least a segment between the heat sink and a first...
US20090200661 Devices with faraday cages and internal flexibility sipes  
A computer or microchip comprising an outer chamber and at least one inner chamber inside the outer chamber. The outer chamber and the inner chamber being separated at least in part by an internal...
US20090194869 HEAT SINK PACKAGE  
Provided are a heat sink package in which a semiconductor package and a heat sink are bound to each other and a method of fabricating the same. The heat sink package includes a heat sink having a...
US20090194868 PANEL LEVEL METHODS AND SYSTEMS FOR PACKAGING INTEGRATED CIRCUITS WITH INTEGRATED HEAT SINKS  
Panel level methods and arrangements are described for attaching heat sinks in panel form with dice attached to a leadframe panel. Various methods produce integrated circuit packages each having an...
US20090190312 Heat transfer film, semiconductor device, and electronic apparatus  
A heat transfer film includes a heat transfer layer formed of a first constituent material containing C (carbon) for transferring heat in an in-plane direction thereof and a layer thickness...
US20090184412 RESIN-SEAL TYPE SEMICONDUCTOR DEVICE  
There is provided a resin-seal type semiconductor device (BGA type semiconductor device) whose heat dissipating characteristic is improved, so that it is prevented from deteriorating in...
US20090179323 LOCAL AREA SEMICONDUCTOR COOLING SYSTEM  
A system and method in which a semiconductor chip has electrically inactive metal-filled vias adjacent to a semiconductor device or devices to be cooled and the semiconductor device or devices are...
US20090179322 ELECTRONIC PACKAGE METHOD AND STRUCTURE WITH CURE-MELT HIERARCHY  
Disclosed herein are embodiments of electronic package incorporating a thermal interface material (e.g., a metal TIM) that is positioned between a lid and a chip on a substrate. The TIM has a...
US20090174063 Semiconductor Module  
A semiconductor module 10 includes a ceramic substrate having a front surface on which a semiconductor element 12 is mounted and a rear surface on the opposite side of the front surface, a...
US20090168429 LIGHT SOURCE MODULE WITH A THERMOELECTRIC COOLER  
A light source module ( 100 ) includes a plurality of light emitting diodes ( 13 ), a heat dissipation device ( 30 ) and a thermoelectric cooler ( 20 ). The thermoelectric cooler has a cold side (...
US20090166853 MULTI-LAYER STACKED WAFER LEVEL SEMICONDUCTOR PACKAGE MODULE  
A stacked wafer level semiconductor package module includes a semiconductor chip module including first and second semiconductor chips each having a rectangular shape. The first semiconductor chip...
US20090152712 Packaging apparatus for optical-electronic semiconductors and a packaging method therefor  
A packaging apparatus for optical-semiconductors includes a mold base having a longitudinal receiving space, an encapsulating module attached to the mold base, and a fixing member attached to the...
US20090146292 SEMICONDUCTOR DEVICE THERMAL CONNECTION  
A semiconductor device thermal connection used to remove heat from a semiconductor device, such as an integrated circuit, includes a metallic barrier layer on the semiconductor device, and a high...
US20090127700 THERMAL CONDUCTOR LIDS FOR AREA ARRAY PACKAGED MULTI-CHIP MODULES AND METHODS TO DISSIPATE HEAT FROM MULTI-CHIP MODULES  
Multi-chip modules and methods to form multi-chip modules are disclosed. A disclosed method to form a multi-chip module includes attaching a first integrated circuit to a top surface of a...
US20090121342 SEMICONDUCTOR DEVICE INCLUDING MAIN SUBSTRATE AND SUB SUBSTRATES AND FABRICATION METHOD OF THE SAME  
A semiconductor device according to a preferred embodiment of the present invention is a semiconductor device including a main substrate and one or more sub substrates, and the semiconductor device...
US20090115053 Semiconductor Package Thermal Performance Enhancement and Method  
A semiconductor device package and related method are disclosed for providing a semiconductor device encapsulated in a protective package body. The device has an exposed surface to which a thermal...
US20090102046 ON-CHIP TEMPERATURE GRADIENT MINIMIZATION USING CARBON NANOTUBE COOLING STRUCTURES WITH VARIABLE COOLING CAPACITY  
An electronic device comprises a die with at least one defined hot-spot area; and at least one defined intermediate temperature area at a temperature lower than the temperature of the hot-spot...
US20090096085 Thermally Enhanced Wafer Level Package  
A method of forming a package structure includes providing a plurality of dies; attaching the plurality of dies onto a heat-dissipating plate; and sawing the heat-dissipating plate into a plurality...
US20090095979 Power Module  
A power module includes a substrate having first and second main substrate surfaces; a semiconductor device disposed on the first main substrate surface, and having a first main surface on which a...
US20090079062 SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE  
A semiconductor package is provided. The semiconductor package includes: a package substrate on which a semiconductor device is mounted; a heat spreader at least bonded to a surface of the...
US20090072385 Electronic Assemblies Providing Active Side Heat Pumping and Related Methods and Structures  
An electronic assembly may include a packaging substrate, an integrated circuit (IC) semiconductor chip, a plurality of metal interconnection structures, and a thermoelectric heat pump. The...
US20090072384 Packaging substrate having heat-dissipating structure  
Provided is a packaging substrate with a heat-dissipating structure, including a core layer with a first surface and an opposite second surface having a first metal layer and a second metal layer...
US20090072383 SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT MODULE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE  
A semiconductor element is provided with a heat dissipating path defined by a non-through hole in a first principal surface and that is filled with a conductive material. The semiconductor element...
US20090072382 MICROELECTRONIC PACKAGE AND METHOD OF FORMING SAME  
A microelectronic package includes a carrier ( 110, 210, 410, 1110 ) having a first surface ( 111, 211, 411, 1111 ) and an opposing second surface ( 112, 212, 412, 1112 ), an adhesive layer ( 120,...
US20090051026 PROCESS FOR FORMING METAL FILM AND RELEASE LAYER ON POLYMER  
A process for forming a releasable metal film includes depositing a metal onto a polymeric sheet such that the metal layer provides a low adhesive interface and exhibits relatively low stress. A...
US20090045506 Cu-Mo SUBSTRATE AND METHOD FOR PRODUCING SAME  
A Cu—Mo substrate 10 according to the present invention includes: a Cu base 1 containing Cu as a main component; an Mo base having opposing first and second principal faces 2 a, 2 b and...
US20090039500 SEMICONDUCTOR PACKAGE  
A semiconductor package includes a base plate having first and second surfaces both facing in opposite directions, and a plurality of anisotropic heat conducting members disposed in the base plate...
US20090032937 COOLING SYSTEMS FOR POWER SEMICONDUCTOR DEVICES  
A cooling device is provided for liquid cooling a power semiconductor device. The device includes a coolant diverter for guiding liquid coolant to the power semiconductor device. The coolant...
US20090032936 SEMICONDUCTOR DEVICE, METHOD FOR THE SAME, AND HEAT RADIATOR  
A semiconductor device includes a semiconductor chip, and a multicomponent alloy layer formed on a face of the semiconductor chip, the multicomponent alloy layer being in a solid-liquid coexisting...
US20090032822 HIGH POWER LIGHT EMITTING DIODE  
A high power light emitting diode, The high power light emitting diode comprises a light emitting diode chip, a main module, two first electrode pins, two second electrode pins, and at least one...
Matches 1 - 50 out of 114 1 2 3 >